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71. 发明申请

US20070263371A1 Air shroud installed on a circuit board 有权
标题翻译：空气护罩安装在电路板上
公开(公告)号：US20070263371A1
公开(公告)日：2007-11-15
申请号：US11400184
申请日：2006-04-10
申请人： Richard Chen
发明人： Richard Chen
IPC分类号： H05K9/00
CPC分类号： G06F1/20
摘要： A air shroud installed on a circuit board is composed of a circuit board which is installed with an outer housing, an inner surface of which is connected with at least more than one fan, and a side of which is provided with an air exit. The fan is provided with an air entrance and an air exit, wherein the air exit is corresponding to the air exit of outer housing. Air sucked in by the air entrance of fan is expelled out of the air exit of outer housing to be exported, through the air exit of fan, such that the air can be led to another space area or be used to dissipate heat from a specific electronic component.
摘要翻译：安装在电路板上的空气罩由电路板组成，该电路板安装有外壳，其外表面与至少一个以上的风扇连接，外侧具有空气出口。风扇设有空气入口和空气出口，其中空气出口对应于外壳的空气出口。由风扇进气口吸入的空气从外壳的出风口排出，通过风扇的出风口排出，使得空气可以被引导到另一个空间区域，或者用于从特定的空间排出热量电子元件

72. 发明申请

US20070072095A1 Apparatus and method for argon plasma induced ultraviolet light curing step for increasing silicon-containing photoresist selectivity 审中-公开
标题翻译：氩等离子体诱导紫外光固化步骤用于提高含硅光刻胶选择性的装置和方法
公开(公告)号：US20070072095A1
公开(公告)日：2007-03-29
申请号：US11606526
申请日：2006-11-29
申请人： Francis Ko , Richard Chen , Charlie Lee
发明人： Francis Ko , Richard Chen , Charlie Lee
IPC分类号： G03B27/42 , G03F1/00
CPC分类号： G03F7/40 , G03F7/075 , G03F7/094
摘要： Provided is a method and apparatus for increasing an etching selectivity of photoresist material. An exemplary method initiates with providing a substrate with a developed photoresist layer. The developed photoresist layer on the substrate includes polymer chains containing silicon. Next, the substrate and developed photoresist layer are exposed to an ultraviolet (UV) light, where the UV light emanates from a UV generating agent. A portion of the developed photoresist layer is then converted to a hardened layer where the hardened layer is created by cross-linking the polymer chains containing silicon and the cross-linking is activated by the UV light. Next an etch may be performed on the substrate using the hardened layer.
摘要翻译：提供了一种提高光致抗蚀剂材料的蚀刻选择性的方法和装置。提供一种示例性方法，其中提供具有显影的光致抗蚀剂层的基底。基底上显影的光致抗蚀剂层包括含硅的聚合物链。接下来，将基板和显影的光致抗蚀剂层暴露于紫外线（UV）光，其中UV光从UV产生剂发出。然后将显影的光致抗蚀剂层的一部分转化为硬化层，其中通过交联含有硅的聚合物链产生硬化层，并且交联通过UV光活化。接下来，可以使用硬化层在衬底上进行蚀刻。

73. 发明申请

US20060036368A1 Drug discovery methods 有权
公开(公告)号：US20060036368A1
公开(公告)日：2006-02-16
申请号：US10502420
申请日：2003-02-03
申请人： Richard Chen , Raymond Cho , Ramon Felciano , Bret Holley , Viresh Patel , Daniel Richards , Sushma Selvarajan , Keith Steward , Sara Schneider
发明人： Richard Chen , Raymond Cho , Ramon Felciano , Bret Holley , Viresh Patel , Daniel Richards , Sushma Selvarajan , Keith Steward , Sara Schneider
IPC分类号： G06F19/00
CPC分类号： G06F19/18 , G06F19/12 , G06F19/20 , G06F19/24 , G06F19/26 , G06F19/28
摘要： Method for identifying disease-related pathways that can used to identify discovery targets, to identify new uses for known drugs, to identify markers for drug response, and related purposes.

74. 发明申请

US20060029133A1 System and method for bit-plane decoding of fine-granularity scalable (fgs) video stream 审中-公开
标题翻译：用于精细粒度可缩放（fgs）视频流的位平面解码的系统和方法
公开(公告)号：US20060029133A1
公开(公告)日：2006-02-09
申请号：US10539384
申请日：2003-12-12
申请人： Richard Chen
发明人： Richard Chen
IPC分类号： H04N7/12 , H04B1/66 , H04N11/02 , H04N11/04
CPC分类号： G06F17/147 , H04N19/122 , H04N19/176 , H04N19/18 , H04N19/184 , H04N19/187 , H04N19/34 , H04N19/61 , H04N19/90
摘要： A method of inverse transform of bit-plane-oriented discrete cosine transform transformed data representing the enhancement layer of a frame of video date encopoded in a fine granularscability comprising: providing a lookup table comprissing a mtrix of numerical contributions based on location of a bit-plane cell within any bit-plane of a bit-plane set, the numerical contributions independent of bit-plane order; selecting the numerical contribution from the lookup table for each bit-plane cell having a discrete cosine transform coefficient od 1 in each bit-plane; and shifting a binary representation of each selected numerical contribution by number of bit-positions equal to a bit-plane number of the bit-plane of which a particular bit-plane cell is a menber.
摘要翻译：一种以位平面取向的离散余弦变换的变换变换数据的方法，所述变换数据表示以精细可粒度形式包含的视频日期帧的增强层，包括：提供包括基于位元的位置的数字贡献矩阵的查找表，位平面集合的任何位平面内的平面单元格，独立于位平面顺序的数值贡献; 在每个位平面中选择具有离散余弦变换系数od 1的每个位平面单元的查找表的数字贡献; 并且通过等于特定位平面单元为弱的位平面的位平面数的位位置的数量来移位每个选择的数字贡献的二进制表示。

75. 发明申请

US20060011417A1 Food transport system 审中-公开
标题翻译：食品运输系统
公开(公告)号：US20060011417A1
公开(公告)日：2006-01-19
申请号：US10884121
申请日：2004-07-02
申请人： Richard Chen , Michelle Chen
发明人： Richard Chen , Michelle Chen
IPC分类号： E04H3/04
CPC分类号： A47F10/06
摘要： The present invention provides a food transport system comprising a conveyor including a controller that controls the movement of plates of food around the conveyor and determines the circulation time of each plate of food, a food heater and food cooler. The controller automatically diverts individual plates of food to the food heater if they require reheating and automatically diverts individual plates of food to the food cooler if they require cooling.
摘要翻译：本发明提供了一种食品运输系统，其包括输送机，该输送机包括控制器，该控制器控制食物周围的输送机板的移动，并确定食品，食品加热器和食品冷却器的每个板的循环时间。如果需要重新加热，控制器会将单独的食物板转移到食品加热器，如果需要冷却，则会将单独的食物板转移到食品冷却器。

76. 发明申请

US20050104609A1 Microprobe tips and methods for making 审中-公开
标题翻译：微型笔尖和制作方法
公开(公告)号：US20050104609A1
公开(公告)日：2005-05-19
申请号：US10772943
申请日：2004-02-04
申请人： Vacit Arat , Adam Cohen , Dennis Smalley , Ezekiel J. Kruglick , Richard Chen , Kieun Kim
发明人： Vacit Arat , Adam Cohen , Dennis Smalley , Ezekiel J. Kruglick , Richard Chen , Kieun Kim
IPC分类号： G01R1/067 , G01R3/00 , G01R31/02
CPC分类号： G01R1/06711 , G01R1/06716 , G01R1/06733 , G01R1/06744 , G01R3/00
摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
摘要翻译：多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如，当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在方向垂直于IC的表面的平面。在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

77. 发明申请

US20050073501A1 Advanced mouse 审中-公开
标题翻译：高级鼠标
公开(公告)号：US20050073501A1
公开(公告)日：2005-04-07
申请号：US10914464
申请日：2004-08-10
申请人： Richard Chen
发明人： Richard Chen
IPC分类号： G06F3/0354 , G09G5/00 , G09G5/08
CPC分类号： G06F3/03543
摘要： An advanced mouse has a standard mouse and a multi-function key. The multi-function key is used to activate a predetermined function or launch an application program via issuing a virtual combinative code. Thereby, the predetermined function or the application program can be activated without memorizing any combination keys, a universal serial bus (USB) hub, or a complex application or special driver. A Plug & Play function can thus be truly obtained.
摘要翻译：高级鼠标具有标准鼠标和多功能键。多功能键用于激活预定功能或通过发出虚拟组合代码启动应用程序。因此，可以在不记忆任何组合键，通用串行总线（USB）集线器或复杂应用程序或特殊驱动程序）的情况下激活预定功能或应用程序。因此可以真正获得即插即用功能。

78. 发明申请

US20050032375A1 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization 审中-公开
标题翻译：使用粘附的掩模电化学制造结构的方法，包括电介质片，和/或通过平面化部分去除的种子层
公开(公告)号：US20050032375A1
公开(公告)日：2005-02-10
申请号：US10841300
申请日：2004-05-07
申请人： Michael Lockard , Dennis Smalley , Willa Larsen , Richard Chen
发明人： Michael Lockard , Dennis Smalley , Willa Larsen , Richard Chen
IPC分类号： B05D1/32 , C23C18/16 , C25D5/02 , C25D5/10 , H01L21/768 , H01L21/4763 , H01L21/302 , H01L21/461
CPC分类号： C25D1/003 , B33Y10/00 , C23C18/1605 , C23C18/1657 , C25D5/022 , C25D5/10 , H01L21/7682 , H01L21/76838
摘要： Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.
摘要翻译：本发明的实施例提供中尺度或微尺寸的三维结构（例如部件，装置等）。实施例涉及以下一个或多个（1）形成这样的结构，其结合了介电材料片和/或其中用于允许通过电介质材料的电沉积的种子层材料通过平面化操作被去除; （2）形成这样的结构，其中用于至少一些选择性图案化操作的掩模通过将掩模材料转移到衬底或先前形成的层的表面获得，和/或（3）形成这样的结构，其中掩模用于形成至少部分一些层的图案直接来自表示掩模配置的数据在构建表面上图案化，例如在一些实施例中，通过经由计算机控制的喷墨喷嘴或阵列或经由计算机控制的挤出装置选择性地分配材料来实现掩模图案化。

79. 发明授权

US5904848A Controlled pore glass-synthetic resin membrane 失效
标题翻译：可控孔玻璃合成树脂膜
公开(公告)号：US5904848A
公开(公告)日：1999-05-18
申请号：US604440
申请日：1996-02-21
申请人： Yuan N. Wong , Richard Chen
发明人： Yuan N. Wong , Richard Chen
IPC分类号： B01D15/08 , B01D15/36 , B01D15/38 , B01D67/00 , B01D69/14 , B01D71/04 , B01D71/36 , B01J20/28 , B01J20/32 , B01J41/20 , C07B61/00 , C07H21/00 , G01N33/552 , B01D39/00 , B01D39/14 , B01D71/26
CPC分类号： B01D67/0093 , B01D69/141 , B01D71/04 , B01D71/36 , B01J20/28004 , B01J20/28026 , B01J20/28033 , B01J20/28085 , B01J20/3204 , B01J20/321 , B01J20/3212 , B01J20/3219 , B01J20/3255 , B01J20/3274 , B01J41/20 , C07H21/00 , G01N33/552 , B01D15/361 , B01D15/3804 , B01J2219/00527 , B01J2219/00605 , B01J2219/0061 , B01J2219/00612 , B01J2219/00626 , B01J2219/00641 , C07B2200/11 , C40B40/00
摘要： Particulate inorganic pore material, e.g., controlled pore glass (CPG) embedded porous synthetic resin membrane is prepared by mixing inorganic pore material and an aqueous resin, preferably polytetrafluoroethylene (PTFE), aqueous dispersion to form a paste-like mass, heating the mass at a temperature between 50 to 70.degree. C., and forming the mass into a sheet by calendering. The sheet is then sintered to produce a rigid porous sheet. The membrane may be functionalized, as by silanization. The membrane is useful for the same purposes as controlled pore glass or functionalized controlled pore glass.
摘要翻译：通过混合无机孔隙材料和水性树脂，优选聚四氟乙烯（PTFE）水分散体来制备颗粒状无机孔隙材料，例如可控孔隙玻璃（CPG）嵌入的多孔合成树脂膜，以形成糊状物质，温度在50至70℃之间，并通过压延将组合物形成片材。然后将片材烧结以产生刚性多孔片材。膜可以通过硅烷化官能化。该膜可用于与受控孔玻璃或官能化控制孔玻璃相同的目的。

80. 发明授权

US09433117B1 Shield lid interconnect package and method 有权
标题翻译：屏蔽盖互连封装及方法
公开(公告)号：US09433117B1
公开(公告)日：2016-08-30
申请号：US13475469
申请日：2012-05-18
申请人： Jong Ok Chun , Nozad Karim , Richard Chen , Giuseppe Selli , Michael Kelly
发明人： Jong Ok Chun , Nozad Karim , Richard Chen , Giuseppe Selli , Michael Kelly
IPC分类号： H05K7/10 , H05K1/02
CPC分类号： H01L24/49 , H01L23/3128 , H01L23/49811 , H01L23/552 , H01L23/66 , H01L24/48 , H01L24/73 , H01L2223/6655 , H01L2223/6677 , H01L2224/04042 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H05K1/0215 , H05K1/0218 , H05K1/115 , H05K1/165 , H05K7/10 , H05K2201/09436 , H05K2201/09481 , H05K2201/10287 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.
摘要翻译：电子部件封装包括基板和安装到基板的电子部件，电子部件包括接合焊盘。第一天线端子电连接到接合焊盘，第一天线端子电连接到衬底的第二天线端子。封装体包围电子部件，封装主体具有主表面。通过施加导电涂层在主表面上形成天线。嵌入式互连件在基板和主表面之间延伸穿过封装主体并将第二天线端子电连接到天线。施加导电涂层以形成天线相对简单，从而使整体封装制造成本最小化。此外，天线相对较薄，从而使整体封装尺寸最小化。

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