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    • 71. 发明申请
    • Method of Generating Wiring Routes with Matching Delay in the Presence of Process Variation
    • 在过程变化存在下生成具有匹配延迟的接线路由的方法
    • US20080195993A1
    • 2008-08-14
    • US12107158
    • 2008-04-22
    • Peter A. HabitzDavid J. HathawayJerry D. HayesAnthony D. Polson
    • Peter A. HabitzDavid J. HathawayJerry D. HayesAnthony D. Polson
    • G06F17/50
    • G06F17/5077
    • A method and service of balancing delay in a circuit design begins with nodes that are to be connected together by a wiring design, or by being supplied with an initial wiring design that is to be altered. The wiring design will have many wiring paths, such as a first wiring path, a second wiring path, etc. Two or more of the wiring paths are designed to have matching timing, such that the time needed for a signal to travel along the first wiring path is about the same time needed for a signal to travel along the second wiring path, the third path, etc. The method/service designs one or all of the wiring paths to make the paths traverse wire segments of about the same length and orientation, within each wiring level that the first wiring path and the second wiring path traverse. Also, this process makes the first wiring path and the second wiring path traverse the wire segments in the same order, within each wiring level that the first wiring path and the second wiring path traverse.
    • 电路设计中的平衡延迟的方法和服务从通过布线设计连接在一起的节点开始,或通过提供要被改变的初始布线设计。 布线设计将具有许多布线路径,例如第一布线路径,第二布线路径等。两条或多条布线路径被设计成具有匹配的定时,使得信号沿着第一布线路径行进所需的时间 信号沿着第二布线路径,第三路径等移动所需的大致相同的时间。该方法/服务设计一个或所有布线路径,以使路径穿过大约相同长度的线段,并且 在第一布线路径和第二布线路径横越的各布线层内。 此外,该处理使得第一布线路径和第二布线路径在第一布线路径和第二布线路径横越的各布线层内以相同的顺序横穿线段。
    • 72. 发明授权
    • Kerf circuit for modeling of BEOL capacitances
    • 用于BEOL电容建模的Kerf电路
    • US06624651B1
    • 2003-09-23
    • US09684849
    • 2000-10-06
    • David M. FriedPeter A. Habitz
    • David M. FriedPeter A. Habitz
    • G01R3126
    • G01R31/006
    • A kerf circuit for modeling of Back End Of Line (BEOL) capacitances is disclosed. The kerf circuit contains a clock circuit connected to a number of capacitance testing circuits. Each capacitance testing circuit acts a “bay” that can be configured to test one particular capacitance. The clock circuit allows the capacitance testing circuits to charge and discharge the capacitive structures being tested. By having a number of different capacitance testing circuits, capacitances of many different structures may be tested at one time. This is particularly true if the kerf circuit is repeated several or many times, with each different kerf circuit containing different capacitive testing circuits that themselves contain different capacitive structures. The kerf circuit interfaces to testing equipment through pads. The pads connect to each capacitive testing circuit and allow capacitance measurements to be performed by measuring current.
    • 公开了一种用于线路后端(BEOL)电容建模的切口电路。 切口电路包含连接到多个电容测试电路的时钟电路。 每个电容测试电路都作为一个“间隔”,可以配置为测试一个特定的电容。 时钟电路允许电容测试电路对被测试的电容结构进行充电和放电。 通过具有多个不同的电容测试电路,可以一次测试许多不同结构的电容。 如果切割电路重复数次或多次,则特别如此,每个不同的切屑回路包含不同的电容测试电路,它们本身包含不同的电容结构。 切口电路通过焊盘与测试设备接口。 焊盘连接到每个电容测试电路,并通过测量电流来进行电容测量。
    • 75. 发明授权
    • Method and apparatus for modeling capacitance in an integrated circuit
    • 用于对集成电路中的电容进行建模的方法和装置
    • US5761080A
    • 1998-06-02
    • US561647
    • 1995-11-22
    • William F. DeCampJohn J. Ellis-MonaghanPeter A. HabitzEdward W. Seibert
    • William F. DeCampJohn J. Ellis-MonaghanPeter A. HabitzEdward W. Seibert
    • G06F17/50
    • G06F17/5081Y10S706/921
    • According to the present embodiment, a method for calculating the parasitic capacitance in a semiconductor device is disclosed. According to the preferred method, a layout file containing the shapes of a semiconductor device is provided. The dimensions of the layout file are then adjusted to wafer dimensions so as reflect actual production devices. The shapes of the layout file are then partitioned into simpler shapes, typically abutted rectangles, called tiles. Each tile is then decomposed into overlap and fringe capacitance components, each component having a uniform capacitance environment with respect to its capacitance elements. The parasitic capacitance of the semiconductor device can thus be accurately computed, with an efficient use of resources. Additionally the preferred embodiment is easily adaptable to a wide range of technology types.
    • 根据本实施例,公开了一种用于计算半导体器件中的寄生电容的方法。 根据优选方法,提供了包含半导体器件的形状的布局文件。 然后将布局文件的尺寸调整为晶圆尺寸,以反映实际的生产设备。 然后,布局文件的形状被分割成更简单的形状,通常是称为块的邻接矩形。 然后,每个瓦片被分解成重叠和边缘电容分量,每个部件相对于其电容元件具有均匀的电容环境。 因此,可以有效利用资源来准确地计算半导体器件的寄生电容。 此外,优选实施例容易适应于广泛的技术类型。
    • 78. 发明授权
    • Method for use of hierarchy in extraction
    • 提取中使用层次结构的方法
    • US06757876B2
    • 2004-06-29
    • US10064444
    • 2002-07-15
    • Peter A. Habitz
    • Peter A. Habitz
    • G06F1750
    • G06F17/5036
    • A method and system for extracting circuit characteristics from a circuit design comprises extracting first cell characteristics from a portion of said circuit design using a first set of environmental conditions. The invention then extracts second cell characteristics from the portion of the circuit design using a second set of environmental conditions. The invention determines a difference between the first cell characteristics and the second cell characteristics and labels a placeability of the portion of the circuit design based on the difference.
    • 用于从电路设计中提取电路特性的方法和系统包括使用第一组环境条件从所述电路设计的一部分中提取第一单元特性。 然后,本发明使用第二组环境条件从电路设计的部分中提取第二电池特性。 本发明确定了第一单元特性和第二单元特性之间的差异,并且基于该差来标记电路设计的该部分的可放置性。
    • 80. 发明授权
    • Integrated circuit design simulation matrix interpolation
    • 集成电路设计仿真矩阵插值
    • US08855993B2
    • 2014-10-07
    • US13251517
    • 2011-10-03
    • Peter A. HabitzAmol A. Joshi
    • Peter A. HabitzAmol A. Joshi
    • G06F17/50
    • G06F17/5036
    • Methods and systems perform a simulation on an integrated circuit design by applying a first value to a first variable and a second value to a second variable of the simulation to produce a first matrix corner simulation value. The methods and systems repeat the simulation using different values for the first and said second variables to produce a second matrix corner simulation value, a third matrix corner simulation value, and a fourth matrix corner simulation value. The methods and systems create a matrix, and the matrix has the first matrix corner simulation value, the second matrix corner simulation value, the third matrix corner simulation value, and the fourth matrix corner simulation value. The methods and systems interpolate all remaining values within the matrix based upon existing simulation values within the matrix.
    • 方法和系统通过将第一值应用于第一变量和第二值到模拟的第二变量来对集成电路设计进行仿真以产生第一矩阵角模拟值。 方法和系统使用不同的值对第一和第二变量重复模拟,以产生第二矩阵角模拟值,第三矩阵角模拟值和第四矩阵角模拟值。 方法和系统创建矩阵,矩阵具有第一矩阵角模拟值,第二矩阵角模拟值,第三矩阵角模拟值和第四矩阵角模拟值。 方法和系统基于矩阵内的现有模拟值来内插矩阵内的所有剩余值。