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    • 75. 发明授权
    • Pll for controlling frequency deviation of a variable frequency
oscillator
    • 用于控制可变频率振荡器的频率偏移的PLL
    • US5097219A
    • 1992-03-17
    • US450233
    • 1989-12-13
    • Takashi Itoh
    • Takashi Itoh
    • H03F3/45H03L7/093
    • H03L7/093H03F3/45
    • A control apparatus includes a phase comparator for generating a first control signal in accordance with the phase difference between a variable frequency signal and an input signal from the outside, a multiplier for multiplying the first control signal and a correction signal thereby to output a second control signal, a variable frequency oscillator for outputting the variable frequency signal in response to the second control signal, and a correction circuit for generating the correction signal for correcting a frequency deviation of the variable frequency signal from a predetermined value. An impedance conversion circuit which is of low input impedance and high output impedance includes a differential amplifier which is provided with a first terminal which receives a reference voltage obtained by resistors and a second terminal connected to an input terminal which receives an input current from the outside and which outputs a signal corresponding to the voltage difference between the first and second terminals. The impedance conversion circuit further includes a first current outputting circuit for outputting a current corresponding to a signal from the differential amplifier to the second terminal, and a second current outputting circuit for determining an output current against a signal from the differential amplifier and for outputting the output current to an external output terminal.
    • 76. 发明授权
    • Vertical deflection circuit
    • 垂直偏转电路
    • US4203056A
    • 1980-05-13
    • US4221
    • 1979-01-17
    • Takashi Itoh
    • Takashi Itoh
    • H04N3/23H03K4/69H04N3/233H01J29/70
    • H03K4/693
    • Disclosed is a vertical deflection circuit in which first and second NPN output transistors are connected in series to make up a single-ended push-pull circuit. A vertical deflection coil and a low-value resistor are connected in series between the output terminal of the push-pull circuit and the earth. The second NPN output transistor is driven by a driving transistor which amplifies the oscillated signal produced from a vertical oscillation stage. The voltage generated at the junction point of the vertical deflection coil and the low-value resistor is fed back to the driving transistor. An emitter resistor is inserted between the emitter of the second NPN output transistor and the earth, while a resistor for differentiating the amount of feedback in the former and latter halves of the vertical scanning period is inserted between the emitter of the second NPN transistor and the junction point.
    • 公开了一种垂直偏转电路,其中第一和第二NPN输出晶体管串联连接以构成单端推挽电路。 一个垂直偏转线圈和一个低电阻电阻串联连接在推挽电路的输出端和地之间。 第二NPN输出晶体管由放大从垂直振荡级产生的振荡信号的驱动晶体管驱动。 在垂直偏转线圈和低电阻电阻的接合点处产生的电压被反馈到驱动晶体管。 在第二NPN输出晶体管的发射极和地之间插入一个发射极电阻,同时用于将前一个和后半个垂直扫描周期中的反馈量微分的电阻插入第二个NPN晶体管的发射极和 交点
    • 78. 发明授权
    • Thermosetting resin composition, multilayer body using same, and circuit board
    • 热固性树脂组合物,使用其的多层体和电路板
    • US08501874B2
    • 2013-08-06
    • US12188898
    • 2008-08-08
    • Shigeru TanakaKanji ShimoohsakoTakashi ItohKoji OkadaMutsuaki Murakami
    • Shigeru TanakaKanji ShimoohsakoTakashi ItohKoji OkadaMutsuaki Murakami
    • A47G19/08B32B15/04B32B15/08C07F9/24C08F283/00C08F283/04C08G18/77C08G59/14C08G65/32C08G65/48C08G69/48C08G79/02C08K5/49C08K5/51C08K5/5399C08L61/00C08L61/04C08L63/00C08L67/00C08L71/02C08L71/12C08L75/04C08L77/00C08L85/02
    • C08L79/08C08L63/00C08L2205/03H05K3/4676H05K2201/0154Y10T428/12569Y10T428/31678Y10T428/31681
    • The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions.A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc.A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
    • 本发明涉及适合用于制造柔性印刷电路板(FPC)和积聚电路板的电路板的热固性树脂组合物以及使用这种热固性树脂组合物制造的多层体和电路板。 热固性树脂组合物含有聚酰亚胺树脂组分(A),酚醛树脂组分(B)和环氧树脂组分(C)。 重量比(A)/ [(B)+(C)]的混合比在0.4至2.0的范围内,重量比为组分(A)的重量与总重量的比例 组分(B)和组分(C)。 通过使用这种热固性树脂组合物,可以制造介电特性,粘合性,加工性,耐热性,流动性等优异的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂(A),磷腈 化合物(D)和氰酸酯化合物(E)。 磷腈化合物(D)包括通过使苯氧基磷腈化合物(D-1)交联而制得的交联的苯氧基磷腈化合物(D-1)和/或交联的苯氧基磷腈化合物(D-1),交联的苯氧基磷腈化合物 -2)具有至少一个酚羟基。 通过使用这种热固性树脂组合物,可以制造介电特性,加工性,耐热性和阻燃性优异的多层体和电路板。