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    • 80. 发明申请
    • Heat-Curable Urethane Resin Composition
    • 热固性聚氨酯树脂组合物
    • US20070293636A1
    • 2007-12-20
    • US11663192
    • 2005-09-20
    • Kazuya KimuraHiroshi Uchida
    • Kazuya KimuraHiroshi Uchida
    • C08F283/04C08G18/00
    • H05K3/285C08G18/12C08G18/44C08G18/672C09D175/06C09D175/16H05K2203/124C08G18/281C08G18/6659C08G18/0823
    • The invention provides a heat-curable resin composition comprising (A) a polyurethane having two or more carboxyl groups in one molecule, in particular a polyurethane having one or more carboxyl groups at a molecular terminal and (B) a heat-curable component, a cured product thereof, a solder resist and a protective film consisting of the cured product and a printed wiring board coated with the cured product. The polyurethane(A), preferably has a number average molecular weight of 500 to 100,000 and an acid value of 5 to 150 mgKOH/g. The heat-curable component (B) is preferably an epoxy resin. The heat-curable resin composition of the invention is excellent in adhesion with a substrate, low-warpage property, flexibility, resistance to moisture and heat, soldering heat resistance and resistance to tin plating.
    • 本发明提供一种热固性树脂组合物,其包含(A)在一个分子中具有两个或更多个羧基的聚氨酯,特别是在分子末端具有一个或多个羧基的聚氨酯和(B)可热固化组分, 其固化产物,阻焊剂和由固化产物组成的保护膜和涂覆有固化产物的印刷线路板。 聚氨酯(A)的数均分子量优选为500〜100,000,酸值为5〜150mgKOH / g。 可热固化成分(B)优选为环氧树脂。 本发明的热固性树脂组合物与基材的粘合性优异,翘曲性,柔软性,耐湿热性,耐焊接性,耐镀锡性优异。