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71. 发明授权

US07076688B2 Failure information management method and management server in a network equipped with a storage device 失效
标题翻译：配有存储设备的网络中的故障信息管理方法和管理服务器
公开(公告)号：US07076688B2
公开(公告)日：2006-07-11
申请号：US10659362
申请日：2003-09-11
申请人： Masayuki Yamamoto
发明人： Masayuki Yamamoto
IPC分类号： G06F11/00
CPC分类号： G06F11/0781 , G06F11/0727 , G06F11/079 , H04L41/0213 , H04L41/046 , H04L41/065 , H04L41/08 , H04L41/12 , H04L41/22
摘要： Failure investigation in a SAN providing virtual volumes requires a high degree of knowledge from the SAN administrator, who also evaluates the relative severities of failure events from different devices. The SAN manager obtains information from management agents in the devices. Using this information, the SAN manager manages the association between the server and the virtual volumes and the real volumes. The SAN manager receives failure messages from multiple devices and uses the association and a failure analysis dictionary table to determine the contents of the failure messages and associations between failure messages. Failures that are causal failure are displayed. The SAN manager is equipped with a conversion table for converting failure messages issued from different storage devices to a common severity. When a failure message is received, a notification is sent to a high-level program and to an administrator based on the common severity defined in the conversion table.
摘要翻译：提供虚拟卷的SAN中的故障调查需要SAN管理员的高度知识，SAN管理员也可以评估来自不同设备的故障事件的相对严重程度。 SAN管理器从设备中的管理代理获取信息。使用此信息，SAN管理器管理服务器与虚拟卷和实际卷之间的关联。 SAN管理器从多个设备接收故障消息，并使用关联和故障分析字典表来确定故障消息的内容和故障消息之间的关联。显示因果故障的故障。 SAN管理器配备了一个转换表，用于将从不同存储设备发出的故障消息转换为常见严重性。当接收到故障消息时，会根据转换表中定义的常见严重程度将通知发送到高级程序和管理员。

72. 发明申请

US20060129877A1 Volume and failure management method on a network having a storage device 有权
公开(公告)号：US20060129877A1
公开(公告)日：2006-06-15
申请号：US11288205
申请日：2005-11-29
申请人： Masayuki Yamamoto , Takashi Oeda
发明人： Masayuki Yamamoto , Takashi Oeda
IPC分类号： G06F11/00
CPC分类号： G06F3/0665 , G06F3/0605 , G06F3/067 , G06F11/0727 , G06F11/0775 , G06F11/0781 , G06F11/079 , H04L41/0213 , H04L41/046 , H04L41/065 , H04L41/08 , H04L41/12 , H04L41/22
摘要： A SAN manager acquires configuration information from devices constituting a SAN and produces a corresponding relationship between a host computer and a virtual volume (virtual volume mapping) and a corresponding relationship between the host computer and a real volume (real volume mapping). Based on those pieces of mapping information, the SAN manager outputs a corresponding relationship between virtual and real volumes. Meanwhile, the failure notification messages received from the in-SAN devices are construed to detect and output an influence of the failure upon the access to a real or virtual volume. Furthermore, when receiving a plurality of failure notifications from the devices connected to the SAN, the plurality of failure notifications are outputted with an association based on the corresponding relationship between real and virtual volumes.

73. 发明申请

US20060037694A1 Method and apparatus for joining protective tape 失效
公开(公告)号：US20060037694A1
公开(公告)日：2006-02-23
申请号：US11182761
申请日：2005-07-18
申请人： Masayuki Yamamoto , Norio Mori , Takashi Nishinohama , Atsushi Ogawa
发明人： Masayuki Yamamoto , Norio Mori , Takashi Nishinohama , Atsushi Ogawa
IPC分类号： B32B37/00 , B32B38/04 , B29C65/00
CPC分类号： H01L21/67132 , B26D3/02 , B26D3/10 , B29C63/02 , B29C2793/00 , H01L21/67092 , Y10T83/0259 , Y10T83/04 , Y10T83/05 , Y10T156/1052 , Y10T156/108 , Y10T156/12
摘要： In a method for allowing a cutter blade to relatively travel along an outer periphery of a semiconductor wafer to cut a protective tape joined to a surface of the semiconductor wafer in conformity with an outer shape of the semiconductor wafer, the cutter blade is allowed to relatively travel along the outer periphery of the semiconductor wafer with a positioning notch provided on the outer periphery thereof. The cutter blade is rotationally turned at the fore half of the notch recessed on the outer periphery of the semiconductor wafer during the relative travel of the cutter blade in such a manner that its blade tip is directed toward the center of the wafer. In contrast, the cutter blade is rotationally turned at the rear half of the notch in such a manner that its blade tip is directed toward the outer periphery of the semiconductor wafer.

74. 发明申请

US20060027331A1 Adhesive film sticking apparatus 审中-公开
标题翻译：胶粘贴胶装置
公开(公告)号：US20060027331A1
公开(公告)日：2006-02-09
申请号：US11156484
申请日：2005-06-21
申请人： Shuuji Hirai , Masaru Irie , Noriyoshi Nagata , Masayuki Yamamoto
发明人： Shuuji Hirai , Masaru Irie , Noriyoshi Nagata , Masayuki Yamamoto
IPC分类号： B65C9/18
CPC分类号： B29C63/02 , Y10T156/1707
摘要： For detection of an adhesive film adhesively provided on a base tape of a film supply tape, a front end of the adhesive film is detected based on the detection of a predetermined displacement amount of a roller contactor of a detection sensor, the roller contactor being displaceable in a direction of thickness of the adhesive film. Based on a detection signal from the detection sensor, feeding rollers and others are controlled to feed the film supply tape by a predetermined feeding amount until the front end of the adhesive film comes to near a fold-back point of the base tape by a guide member.
摘要翻译：为了检测粘合地设置在胶片供带的基带上的粘合膜，基于检测传感器的辊接触器的预定位移量的检测来检测粘合膜的前端，辊接触器可位移在粘合膜的厚度方向上。基于来自检测传感器的检测信号，控制送料辊等，以预定的供给量供给胶片供给带，直到粘合膜的前端通过导向件接近基带的折回点会员。

75. 发明申请

US20050240997A1 ID collection and management apparatus, method and program of computer 审中-公开
标题翻译： ID收集和管理设备，计算机方法和程序
公开(公告)号：US20050240997A1
公开(公告)日：2005-10-27
申请号：US10887845
申请日：2004-07-12
申请人： Kenichi Shimooka , Masayuki Yamamoto , Hiroshi Furukawa
发明人： Kenichi Shimooka , Masayuki Yamamoto , Hiroshi Furukawa
IPC分类号： G06F13/14 , G06F3/06 , G06F11/30 , G06F12/14 , G06F13/10 , H04L9/00 , H04L9/32
CPC分类号： G06F3/0637 , G06F3/0622 , G06F3/067 , G06F11/006
摘要： The IDs of a computer to be used for setting a storage controller are acquired and managed. An ID collection and management apparatus manages the IDs of the computer for a computer system comprising a storage volume assigned for storing data, at least one computer provided with a data port which reads or writs data in the storage volume, and a storage controller which controls the communications between the computer and the storage volume. The ID collection and management apparatus acquires an ID-A or the ID of the computer from the data port and an ID-B or the ID of the computer from the storage controller, and manages the corresponding relation between the ID-A and the ID-B for each computer.
摘要翻译：获取并管理用于设置存储控制器的计算机的ID。 ID收集和管理装置管理包括分配用于存储数据的存储卷的计算机系统的ID，至少一个计算机，其具有读取或写入存储卷中的数据的数据端口;以及存储控制器，其控制计算机和存储卷之间的通信。 ID收集和管理装置从存储控制器从数据端口和ID-B或计算机的ID获取计算机的ID-A或ID，并且管理ID-A和ID之间的对应关系 -B为每台电脑。

76. 发明申请

US20050215033A1 Method of dicing semiconductor wafer into chips, and apparatus using this method 失效
标题翻译：将半导体晶片切割成芯片的方法，以及使用该方法的装置
公开(公告)号：US20050215033A1
公开(公告)日：2005-09-29
申请号：US11084133
申请日：2005-03-21
申请人： Masayuki Yamamoto , Saburo Miyamoto
发明人： Masayuki Yamamoto , Saburo Miyamoto
IPC分类号： H01L21/301 , B28D5/00 , H01L21/00 , H01L21/304 , H01L21/46 , H01L21/68 , H01L21/78
CPC分类号： H01L21/6836 , H01L21/67132 , H01L21/78 , H01L2221/68327
摘要： The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the semiconductor wafer is diced into chips are formed is held by an adhesive tape. By radially drawing the adhesive tape in a state where the chips in the semiconductor wafer are not parted from each other, the chips are parted from each other and clearances among the chips are extended.
摘要翻译：本发明涉及一种将半导体晶片沿分型线切割成芯片的半导体晶片切割方法。形成半导体晶片切成芯片的分型线的半导体晶片由胶带保持。通过在半导体晶片中的芯片不彼此分离的状态下径向拉伸粘合带，芯片彼此分离，并且芯片之间的间隙延长。

77. 发明申请

US20050215030A1 Method and device for separating a reinforcing-plate fixed to a reinforced semiconductor wafer 失效
标题翻译：用于分离固定到增强半导体晶片上的增强板的方法和装置
公开(公告)号：US20050215030A1
公开(公告)日：2005-09-29
申请号：US11087214
申请日：2005-03-23
申请人： Masayuki Yamamoto
发明人： Masayuki Yamamoto
IPC分类号： C09J7/00 , C09J5/00 , C09J5/02 , C09J201/00 , H01L21/00 , H01L21/30 , H01L21/301 , H01L21/304 , H01L21/46 , H01L21/68 , H01L21/78
CPC分类号： H01L21/6835 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/6834
摘要： A reinforcing-plate fixed to a reinforced semiconductor wafer is separated from the wafer which includes a semiconductor wafer, a double-side adhesive sheet having, on at least one surface thereof, a peelable adhesive layer stuck to a front face of the semiconductor wafer, and the reinforcing-plate fixed to the other adhesive layer of the double-side adhesive sheet. A method includes separating the reinforcing-plate together with the double-side adhesive sheet from the reinforced semiconductor wafer by the peeling-effect of the peelable adhesive layer of the double-side adhesive sheet. The method further includes separating the reinforcing-plate from an arbitrarily selected edge of the semiconductor wafer toward an edge thereof different from the above-mentioned edge.
摘要翻译：固定在强化半导体晶片上的加强板与包括半导体晶片的晶片分离，在其至少一个表面上具有粘附在半导体晶片的正面上的可剥离粘合剂层的双面粘合片，并且固定在双面粘合片的另一粘合层上的加强板。一种方法包括通过双面粘合片的可剥离粘合剂层的剥离效应将加强板与双面粘合片从增强半导体晶片分离。该方法还包括从半导体晶片的任意选择的边缘朝向与上述边缘不同的边缘分离加强板。

78. 发明申请

US20050126694A1 Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same 审中-公开
标题翻译：保护胶带接合方法及其使用方法以及使用其的保护胶带分离方法和装置
公开(公告)号：US20050126694A1
公开(公告)日：2005-06-16
申请号：US10972536
申请日：2004-10-26
申请人： Masayuki Yamamoto
发明人： Masayuki Yamamoto
IPC分类号： B65H41/00 , B29C63/00 , B29C63/02 , H01L21/00 , H01L21/304 , H01L21/683 , B32B31/00
CPC分类号： H01L21/67132 , B29C63/0013 , B29C63/02 , B29C2793/009 , B32B2457/14 , H01L2221/6839 , Y10T156/1093 , Y10T156/1744 , Y10T156/1906
摘要： The protective tape is joined at an optional angle with respect to the recesses formed between the patterns on the surface of the article, which has irregularities and on which patterns as a plurality of chips are formed in a matrix. After that, joining the adhesive tape to the surface of the protective tape at an optional angle with respect to recesses formed between patterns on the surface of the article, and separating the protective tape at an optional angle with respect to the recesses.
摘要翻译：保护带相对于形成在制品表面上的图案之间的凹部以可选的角度接合，该凹槽具有不规则性，并且在其上以矩阵形成多个芯片的图案。之后，相对于在物品表面上的图案之间形成的凹部以任意角度将胶粘带粘合到保护带的表面上，并且相对于凹部以任意角度分离保护带。

79. 发明申请

US20050061425A1 Method and apparatus for joining adhesive tape 有权
标题翻译：连接胶带的方法和装置
公开(公告)号：US20050061425A1
公开(公告)日：2005-03-24
申请号：US10898996
申请日：2004-07-27
申请人： Masayuki Yamamoto
发明人： Masayuki Yamamoto
IPC分类号： H01L21/304 , B29C63/00 , B29C63/02 , H01L21/00 , B32B31/00 , B32B1/00
CPC分类号： H01L21/67132 , B29C63/0056 , B29C63/02 , B29L2031/3406 , Y10S242/90 , Y10T156/1052 , Y10T156/1054 , Y10T156/1075 , Y10T156/1087 , Y10T156/12 , Y10T156/1313 , Y10T156/1343 , Y10T156/1378 , Y10T156/1705 , Y10T156/1734 , Y10T156/1788
摘要： In an adhesive tape joining method for joining an adhesive tape to a surface of an article, cutting out the adhesive tape along an outer peripheral edge of the article and, then, collecting the unnecessary adhesive tape which has been cut out, the unnecessary adhesive tape is wound and collected so as not to shrink at a cut portion of the adhesive tape in a width direction.
摘要翻译：在将粘合带接合到制品的表面的胶带接合方法中，沿着制品的外周边缘切割胶带，然后收集已经切出的不必要的胶带，将不需要的胶带被卷绕和收集，以便在宽度方向上不会在胶带的切割部分处收缩。

80. 发明申请

US20050050275A1 Storage system 审中-公开
公开(公告)号：US20050050275A1
公开(公告)日：2005-03-03
申请号：US10962599
申请日：2004-10-13
申请人： Ikuya Yagisawa , Naoto Matsunami , Akihiro Mannen , Masayuki Yamamoto
发明人： Ikuya Yagisawa , Naoto Matsunami , Akihiro Mannen , Masayuki Yamamoto
IPC分类号： G06F3/06 , G06F3/00 , G06F7/00 , G06F12/00 , G06F12/14 , G06F12/16 , G06F13/00 , G11B27/00
CPC分类号： G06F3/0661 , G06F3/0607 , G06F3/0616 , G06F3/0617 , G06F3/0629 , G06F3/0634 , G06F3/0647 , G06F3/065 , G06F3/0653 , G06F3/0658 , G06F3/0689 , G06F11/1456 , G06F11/2069 , G06F11/2071
摘要： A disk array includes a drive management unit, which is a program for identifying kinds of disk devices and managing different disk devices separately, and a drive management table for storing information to be utilized by the drive management unit. The disk array further includes a program for managing accumulated time of disk devices. The program includes a drive lifetime setting portion for setting lifetimes of drives, a drive start/stop portion for intentionally starting/stopping ATA disk devices, and an operation time measurement portion for measuring accumulated operation time. Since it is necessary to be conscious of difference in reliability and performance among disk devices when forming a RAID, a drive kind notification unit, which is a program for notifying of the kind of a disk device when forming the RAID, is provided.

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