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71. 发明授权

US08140193B2 Assessing, forecasting and simulating energy consumption of buildings using energy efficiency coefficients 有权
标题翻译：使用能效系数评估，预测和模拟建筑物的能源消耗
公开(公告)号：US08140193B2
公开(公告)日：2012-03-20
申请号：US12697787
申请日：2010-02-01
申请人： Young Min Lee
发明人： Young Min Lee
IPC分类号： G05D11/00
CPC分类号： G05D23/19 , G06F1/28 , G06F17/10
摘要： Energy consumption data of a building and temperature data outside the building collected over a period of time are correlated and segmented into a plurality of segments including at least a heating consumption segment, a cooling segment, and temperature-insensitive segment. An energy efficiency coefficient for heating from the heating consumption segment, an energy efficiency coefficient for cooling from the cooling consumption segment, an energy efficiency coefficient for other energy consuming activities from the temperature insensitive segment are determined, and scaled. The energy efficiency coefficient for heating, the energy efficiency coefficient for cooling and the energy efficiency coefficient for other energy consuming activities are used to assess energy efficiency among one or more buildings, forecast future consumption of energy in the building based on forecasted temperature and simulate impact of hypothetical temperature and hypothetical energy efficiency on energy consumption in the building.
摘要翻译：建筑物的能耗数据和一段时间内收集的建筑物外的温度数据被相关联并分段成至少包括加热消耗段，冷却段和不敏感区段的多个段。确定从加热消耗部分进行加热的能量效率系数，从冷却消耗部分进行冷却的能量效率系数，对来自不敏感部分的其他能量消耗活动的能量效率系数和比例。用于加热的能效系数，冷却能效系数和其他能源消耗活动的能效系数用于评估一个或多个建筑物的能源效率，基于预测的温度预测建筑物中未来的能源消耗量并模拟影响的假设温度和假设的能源效率在建筑物的能源消耗。

72. 发明申请

US20120011323A1 MEMORY SYSTEM AND MEMORY MANAGEMENT METHOD INCLUDING THE SAME 有权
标题翻译：包括其内存系统和内存管理方法
公开(公告)号：US20120011323A1
公开(公告)日：2012-01-12
申请号：US13234173
申请日：2011-09-16
申请人： SUNG-JAE BYUN , Young Min Lee , Yun-Tae Lee , Gyoo-Cheol Hwang
发明人： SUNG-JAE BYUN , Young Min Lee , Yun-Tae Lee , Gyoo-Cheol Hwang
IPC分类号： G06F15/177
CPC分类号： G06F12/0607 , G06F9/4405 , G06F15/177 , G11C8/16 , Y02D10/13
摘要： A multi-processor system includes a first processor, a second processor communicable with the first processor, a first non-volatile memory for storing first codes and second codes to respectively boot the first and second processors, the first memory communicable with the first processor, a second volatile memory designated for the first processor, a third volatile memory designated for the second processor, and a fourth volatile memory shared by the first and second processors.
摘要翻译：多处理器系统包括第一处理器，与第一处理器通信的第二处理器，用于存储第一代码和第二代码以分别引导第一和第二处理器的第一非易失性存储器，可与第一处理器通信的第一存储器，为第一处理器指定的第二易失性存储器，为第二处理器指定的第三易失性存储器，以及由第一和第二处理器共享的第四易失性存储器。

73. 发明申请

US20110190951A1 ASSESSING, FORECASTING AND SIMULATING ENERGY CONSUMPTION OF BUILDINGS USING ENERGY EFFICIENCY COEFFICIENTS 有权
标题翻译：使用能源效率系数评估，预测和模拟建筑物的能源消耗
公开(公告)号：US20110190951A1
公开(公告)日：2011-08-04
申请号：US12697787
申请日：2010-02-01
申请人： Young Min Lee
发明人： Young Min Lee
IPC分类号： G06F1/28 , G05D23/19 , G06F17/10
CPC分类号： G05D23/19 , G06F1/28 , G06F17/10
摘要： Energy consumption data of a building and temperature data outside the building collected over a period of time are correlated and segmented into a plurality of segments including at least a heating consumption segment, a cooling segment, and temperature-insensitive segment. An energy efficiency coefficient for heating from the heating consumption segment, an energy efficiency coefficient for cooling from the cooling consumption segment, an energy efficiency coefficient for other energy consuming activities from the temperature insensitive segment are determined, and scaled. The energy efficiency coefficient for heating, the energy efficiency coefficient for cooling and the energy efficiency coefficient for other energy consuming activities are used to assess energy efficiency among one or more buildings, forecast future consumption of energy in the building based on forecasted temperature and simulate impact of hypothetical temperature and hypothetical energy efficiency on energy consumption in the building.
摘要翻译：建筑物的能耗数据和一段时间内收集的建筑物外的温度数据被相关联并分段成至少包括加热消耗段，冷却段和不敏感区段的多个段。确定从加热消耗部分进行加热的能量效率系数，从冷却消耗部分进行冷却的能量效率系数，对来自不敏感部分的其他能量消耗活动的能量效率系数和比例。用于加热的能效系数，冷却能效系数和其他能源消耗活动的能效系数用于评估一个或多个建筑物的能源效率，基于预测的温度预测建筑物中未来的能源消耗量并模拟影响的假设温度和假设的能源效率在建筑物的能源消耗。

74. 发明申请

US20100034014A1 Magnetoresistive Element, Magnetic Memory Cell and Magnetic Random Access Memory Using the Same 有权
标题翻译：磁阻元件，磁记忆单元和使用其的磁性随机存取存储器
公开(公告)号：US20100034014A1
公开(公告)日：2010-02-11
申请号：US12185983
申请日：2008-08-05
申请人： Hideo Ohno , Shoji Ikeda , Young Min Lee , Jun Hayakawa
发明人： Hideo Ohno , Shoji Ikeda , Young Min Lee , Jun Hayakawa
IPC分类号： G11C11/00 , H01L29/82
CPC分类号： H01L43/08 , G11C11/161 , G11C11/1673 , G11C11/1675 , H01L27/228
摘要： Provided is a high-speed and ultra-low-power-consumption nonvolatile memory having a high temperature stability at a zero magnetic field. In a tunnel magnetoresistive film constituting a nonvolatile magnetic memory that employs a writing method using a spin-transfer torque, an insulating layer and a nonmagnetic conductive layer are stacked above a ferromagnetic free layer.
摘要翻译：提供了一种在零磁场下具有高温度稳定性的高速和超低功耗的非易失性存储器。在构成使用了自旋转移转矩的写入方式的非易失性磁存储器的隧道磁阻膜中，绝缘层和非磁性导电层堆积在铁磁性自由层的上方。

75. 发明申请

US20080177614A1 METHOD AND SYSTEM FOR ESTIMATING DYNAMICS OF WORKFORCE ABSENTEEISM USING INFORMATION ON PANDEMIC SPREAD AND MITIGATION ACTIONS 审中-公开
标题翻译：方法和用于估计WORKFORCE旷工动力学利用信息ON大规模蔓延和减缓行动
公开(公告)号：US20080177614A1
公开(公告)日：2008-07-24
申请号：US11626452
申请日：2007-01-24
申请人： Lianjun An , Stephen John Buckley , Young Min Lee
发明人： Lianjun An , Stephen John Buckley , Young Min Lee
IPC分类号： G06F9/46
CPC分类号： G16H50/80 , G06Q10/04 , G06Q10/06311 , G06Q10/06375 , G16H50/50
摘要： The present invention provides a method and system estimating the likelihood of employees not being available for work as a result of pandemic occurrence and effectiveness of related mitigation actions. The invention allows users to assess the impact of pandemic on availability of corporate workforce and to estimate the effectiveness of various corporate mitigation actions in terms of how such actions may reduce the adverse effects of a pandemic on employee availability by incorporating information on infection rate, perception, needs for family care and infrastructure availability into a system of algebraic and differential equations.
摘要翻译：本发明提供了一种方法和系统，其估计由于大流行发生和相关缓解行动的有效性而不能工作的雇员的可能性。本发明允许用户以评估企业的劳动力可用性大流行的影响并通过将上感染率，感知信息来估计在这样的动作可以如何减少对雇员可用性的大流行的不利影响方面的各种商务缓解动作的有效性，家庭关怀和基础设施可用性的需求转化为代数和微分方程组。

76. 发明申请

US20080167975A1 CYBER SHOPPING MALL MANAGEMENT APPARATUS, AND SYSTEM AND METHOD FOR MANAGING CYBER SHOPPING MALL USING THE SAME 审中-公开
标题翻译： CYBER SHOPPING MALL MANAGEMENT APPARATUS，AND SYSTEM AND METHOD FOR MANAGING CYBER SHOPPING MALL Using THE SAME
公开(公告)号：US20080167975A1
公开(公告)日：2008-07-10
申请号：US11966310
申请日：2007-12-28
申请人： Jae Sun Park , Young Bae Lee , Sang Kil Ahn , Jae Wook Kim , Yong Sung Chun , Ki Sung Kwon , Yun Sang Park , Young Min Lee
发明人： Jae Sun Park , Young Bae Lee , Sang Kil Ahn , Jae Wook Kim , Yong Sung Chun , Ki Sung Kwon , Yun Sang Park , Young Min Lee
IPC分类号： G06Q30/00 , G09G5/00
CPC分类号： G06Q30/0603 , G06Q30/0601 , G06Q30/0643
摘要： Provided are a cyber shopping mall management apparatus, and a system and method for managing a cyber shopping mall using the apparatus that can reduce a return rate of a purchased wear item. The cyber shopping mall management method includes adjusting a size of an image of a wear item to be purchased to fit a size of an image of an object to wear the wear item, synthesizing the adjusted wear item image onto the object image, and transmitting the synthesized image to a buyer. Thus, the cyber shopping mall management system and method enable a buyer to indirectly examine whether a wear item to be purchased can fit an object through an image of the object wearing the desired wear item, thus reducing a return rate of purchased wear items.
摘要翻译：提供了一种网络购物中心管理装置，以及一种使用能够降低购买的佩戴物品的返回率的装置来管理网络购物中心的系统和方法。网络购物中心管理方法包括调整要购买的磨损物品的图像的大小以适合物体的图像的尺寸以佩戴磨损项目，将调整的磨损项目图像合成到对象图像上，以及发送合成图像给买方。因此，网络购物中心管理系统和方法使得买方可以间接地检查待购买的磨损物品是否可以通过佩戴期望的磨损物品的物体的图像来适应物体，从而降低购买的磨损物品的返回率。

77. 发明授权

US07228857B2 Electric oven with door cooling structure 有权
标题翻译：电烤箱带门冷却结构
公开(公告)号：US07228857B2
公开(公告)日：2007-06-12
申请号：US10883732
申请日：2004-07-06
申请人： Wan Soo Kim , Yang Kyeong Kim , Jong Sik Kim , Young Min Lee
发明人： Wan Soo Kim , Yang Kyeong Kim , Jong Sik Kim , Young Min Lee
IPC分类号： F23M7/04 , F24C15/04
CPC分类号： F24C15/006 , F24C15/04
摘要： An electric oven with a door cooling structure includes a cavity formed in the case to provide a high temperature environment, a door for selectively opening and closing the cavity, inner, intermediate and outer panels provided in the door; an airflow shielding panel for blocking a space formed below the intermediate panel to guide introduced air upward; a door cover for blocking a top of the door, which is defined between the inner and outer panels, and a fan for applying negative pressure to gaps defined between the inner, intermediate and outer panels so that the panels can be cooled by the air flowing upward and downward in the gaps.
摘要翻译：具有门冷却结构的电烤箱包括形成在壳体中以提供高温环境的空腔，用于选择性地打开和关闭空腔的门，设置在门中的内部，中间和外部面板; 用于阻挡形成在中间板下方的空间以将引入空气向上引导的气流屏蔽板; 限定在内板和外板之间的门的顶部的门盖以及用于向限定在内板，中间板和外板之间的间隙施加负压的风扇，使得板可以被空气流动上下差距。

78. 发明授权

US06381838B1 BGA package and method of manufacturing the same 失效
标题翻译： BGA封装及其制造方法
公开(公告)号：US06381838B1
公开(公告)日：2002-05-07
申请号：US09115826
申请日：1998-07-15
申请人： Eun Chul Ahn , Woong Ky Ha , Young Min Lee
发明人： Eun Chul Ahn , Woong Ky Ha , Young Min Lee
IPC分类号： H01K322
CPC分类号： H01L21/486 , H01L23/055 , H01L23/3677 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/0201 , H05K1/0206 , H05K3/28 , H05K3/3457 , H05K3/3484 , H05K3/42 , H05K2201/09572 , H05K2203/041 , Y10T29/49144 , Y10T29/49158 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A BGA package includes a semiconductor chip, and a PCB having a board body, a plurality of circuit patterns, a plurality of signal via holes, a solder resist, and a plurality of thermal emissive vias. The thermal emissive vias are holes located beneath a chip attach area, and these holes are filled with metal having a low melting point. The metal prevents moisture from being absorbed, while effectively transferring heat. The semiconductor chip is attached to the chip attach area of the PCB and is connected to circuit patterns of the PCB with bonding wires. The bonding wires and the semiconductor chip are encapsulated to protect them from external environmental stress. Solder bumps are formed on circuit patterns of the PCB. The BGA package has advantages in that it prevents moisture from penetrating to the chip through the thermal emissive vias, and effectively transfers the heat generated by the chip to the outside.
摘要翻译： BGA封装包括半导体芯片和具有板体，多个电路图案，多个信号通孔，阻焊剂和多个热发射通孔的PCB。热发射通孔是位于芯片连接区域下方的孔，并且这些孔用低熔点的金属填充。金属防止水分被吸收，同时有效地传递热量。半导体芯片连接到PCB的芯片连接区域，并通过接合线连接到PCB的电路图案。接合线和半导体芯片被封装以保护它们免受外部环境压力。在PCB的电路图形上形成焊点。 BGA封装具有通过热发射通孔防止湿气渗透到芯片的优点，并且有效地将由芯片产生的热量传递到外部。

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