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71. 发明授权

US07112456B2 Vertical GaN light emitting diode and method for manufacturing the same 有权
标题翻译：垂直GaN发光二极管及其制造方法
公开(公告)号：US07112456B2
公开(公告)日：2006-09-26
申请号：US11115237
申请日：2005-04-27
申请人： Young Ho Park , Hun Joo Hahm , Jeong Seok Na , Seung Jin Yoo
发明人： Young Ho Park , Hun Joo Hahm , Jeong Seok Na , Seung Jin Yoo
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/32 , H01L2221/68363
摘要： Disclosed are a vertical GaN light emitting diode and a method for manufacturing the same. The vertical GaN light emitting diode comprises a first conductive GaN clad layer with an upper surface provided with a first contact formed thereon, an active layer formed on a lower surface of the first conductive GaN clad layer, a second conductive GaN clad layer formed on a lower surface of the active layer, a conductive adhesive layer formed on the second conductive GaN clad layer, and a conductive substrate, with a lower surface provided with a second contact formed thereon, formed on a lower surface of the conductive adhesive layer. The method for manufacturing the vertical GaN light emitting diodes comprises the step of removing the sapphire substrate from the light emitting structure so as to prevent the damages on a GaN single crystal plane of the structure.
摘要翻译：公开了一种垂直GaN发光二极管及其制造方法。垂直GaN发光二极管包括具有形成在其上的第一接触面的上表面的第一导电GaN包覆层，形成在第一导电GaN包层的下表面上的有源层，形成在第一导电GaN包覆层上的第二导电GaN包覆层有源层的下表面，形成在第二导电GaN包覆层上的导电粘合剂层和形成在导电粘合剂层的下表面上的形成有第二接触的下表面的导电基板。用于制造垂直GaN发光二极管的方法包括从发光结构去除蓝宝石衬底的步骤，以防止对结构的GaN单晶面的损坏。

72. 发明授权

US07097337B2 Vertical light emitting type backlight module 失效
标题翻译：垂直发光型背光模组
公开(公告)号：US07097337B2
公开(公告)日：2006-08-29
申请号：US10917383
申请日：2004-08-13
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： F21V8/00
CPC分类号： G02F1/133603 , F21K9/00 , F21Y2105/10 , F21Y2115/10
摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.
摘要翻译：本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板在水平方向读取，以将光线的路径改变为垂直方向。

73. 发明授权

US07063997B2 Process for producing nitride semiconductor light-emitting device 失效
标题翻译：氮化物半导体发光元件的制造方法
公开(公告)号：US07063997B2
公开(公告)日：2006-06-20
申请号：US10893924
申请日：2004-07-20
申请人： Dong Hyun Cho , Masayoshi Koike , Hun Joo Hahm
发明人： Dong Hyun Cho , Masayoshi Koike , Hun Joo Hahm
IPC分类号： H01L21/00
CPC分类号： H01L33/007 , H01L21/0237 , H01L21/0242 , H01L21/02458 , H01L21/0254 , H01L21/02579 , H01L21/0262
摘要： A process for producing a nitride semiconductor light-emitting device includes the steps of preparing a substrate, growing a p-type nitride semiconductor layer on the substrate by the MOCVD process using hydrazine-based gas as a nitrogen precursor and N2 gas as a carrier gas, forming an active layer on the p-type nitride semiconductor layer, forming an n-type conductive nitride semiconductor layer on the active layer, and forming p- and n-electrodes in electrical connection with the p- and n-type nitride semiconductors, respectively.
摘要翻译：制造氮化物半导体发光器件的方法包括以下步骤：制备衬底，通过使用肼系气体作为氮前体的MOCVD法在衬底上生长p型氮化物半导体层，气体作为载气，在p型氮化物半导体层上形成有源层，在有源层上形成n型导电氮化物半导体层，形成与p电极电连接的p型和n型电极和n型氮化物半导体。

74. 发明授权

US06972439B1 Light emitting diode device 失效
标题翻译：发光二极管装置
公开(公告)号：US06972439B1
公开(公告)日：2005-12-06
申请号：US10916525
申请日：2004-08-12
申请人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
发明人： Hyung Suk Kim , Young Sam Park , Hun Joo Hahm , Jung Kyu Park , Young June Jeong
IPC分类号： G02F1/13357 , H01L29/22 , H01L33/54 , H01L33/60
CPC分类号： H01L33/54 , H01L33/60
摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.
摘要翻译：这里公开了一种发光二极管（LED）装置。发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。

75. 发明授权

US06893889B2 Method for manufacturing gallium nitride-based semiconductor light emitting device 有权
标题翻译：氮化镓系半导体发光元件的制造方法
公开(公告)号：US06893889B2
公开(公告)日：2005-05-17
申请号：US10735615
申请日：2003-12-16
申请人： Young Ho Park , Hun Joo Hahm , Soo Min Lee
发明人： Young Ho Park , Hun Joo Hahm , Soo Min Lee
IPC分类号： H01L33/06 , H01L33/20 , H01L33/32 , H01L33/42 , H01L33/44 , H01L29/06 , H01L31/0336 , H01L31/109
CPC分类号： H01L33/42 , H01L33/38
摘要： A method of manufacturing a gallium nitride-based semiconductor light emitting device, includes sequentially forming, over a substrate, a first conductivity type clad layer, an active layer, and a second conductivity type clad layer, forming a transparent electrode over the second conductivity type clad layer, forming a photoresist film on the transparent electrode such that the transparent electrode is exposed at a predetermined region, removing respective portions of the transparent electrode, second conductivity type clad layer, and active layer corresponding to the predetermined region, thereby partially exposing the first conductivity type clad layer, removing the photoresist film, and forming first and second bonding electrodes on predetermined portions of the transparent electrode and second conductivity type clad layer, respectively.
摘要翻译：一种制造氮化镓基半导体发光器件的方法，包括在衬底上顺序地形成第一导电型覆盖层，有源层和第二导电型覆盖层，在第二导电类型上形成透明电极在所述透明电极上形成光致抗蚀剂膜，使得所述透明电极在预定区域露出，除去与所述预定区域对应的所述透明电极，第二导电型覆盖层和有源层的各部分，从而部分地曝光第一导电型覆盖层，去除光致抗蚀剂膜，以及分别在透明电极和第二导电型覆盖层的预定部分上形成第一和第二接合电极。

76. 发明授权

US08735931B2 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08735931B2
公开(公告)日：2014-05-27
申请号：US12907348
申请日：2010-10-19
申请人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
发明人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
摘要翻译：一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

77. 发明授权

US08488081B2 Plane light source and LCD backlight unit having the same 有权
标题翻译：平面光源和具有相同的LCD背光单元
公开(公告)号：US08488081B2
公开(公告)日：2013-07-16
申请号：US12839945
申请日：2010-07-20
申请人： Seong Yeon Han , Hun Joo Hahm , Hyung Suk Kim , Young June Jeong , Young Sam Park , Chul Hee Yoo
发明人： Seong Yeon Han , Hun Joo Hahm , Hyung Suk Kim , Young June Jeong , Young Sam Park , Chul Hee Yoo
IPC分类号： G02F1/1335
CPC分类号： G02F1/133603
摘要： There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P1 between the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm≦P1≦29 mm, and a pitch P2 between the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm≦P2≦38 mm.
摘要翻译：提供有平面光源和具有该平面光源的LCD背光单元。根据本发明的一个方面的包括发光器件矩阵的平面光源包括：具有排列成行和列的多个发光器件的发光器件矩阵，包括：具有排列成行和列的多个发光器件的第一矩阵; 以及具有排列成行和列的多个发光器件的第二矩阵，所述发光器件各自位于由包括在所述第一矩阵中的四个相邻的发光器件形成的矩形内，并且形成满足条件为45°@ 其中基于水平方向的θ@ 55°，其中在包括在发光器件矩阵中的一个发光器件和与发光器件相邻的另一个照明发光器件之间的间距中，发光器件与发光器件对角地穿过发光器件的发光器件满足25mm @ P1 @ 29mm的条件，并且发光器件和位于水平方向的另一个发光器件之间的间距P2满足条件为34mm @ P2 @ 38毫米。

78. 发明申请

US20120127705A1 LIGHT EMITTING MODULE 有权
标题翻译：发光模块
公开(公告)号：US20120127705A1
公开(公告)日：2012-05-24
申请号：US13363879
申请日：2012-02-01
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
IPC分类号： F21V21/005 , F21V5/04 , F21V21/00
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译：提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。

79. 发明授权

US07968894B2 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US07968894B2
公开(公告)日：2011-06-28
申请号：US12549252
申请日：2009-08-27
申请人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
发明人： Young Sam Park , Seung Ick Lee , Hun Joo Hahm , Hyung Suk Kim , Bum Jin Kim , Young June Jeong , Ho Sik Ahn , Jung Kyu Park
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
摘要翻译： LED封装框架包括LED芯片和由高导热性材料制成的导热部件。导热构件在侧部具有接收部，并且安装有LED芯片。构造成插入到包括导线的导热构件的接收部分的引线涂层组件的一端插入导热构件的接收部分中，并且电连接到LED芯片。引线与导热部件的接收部之间紧密接触的电绝缘层使引线与接收部分隔离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。

80. 发明授权

US07946724B2 Surface light source using white light emitting diodes and liquid crystal display backlight unit having the same 有权
标题翻译：使用白色发光二极管的表面光源和具有相同的液晶显示器背光单元
公开(公告)号：US07946724B2
公开(公告)日：2011-05-24
申请号：US12078717
申请日：2008-04-03
申请人： Jae Hong Shin , Hun Joo Hahm , Hyung Suk Kim , Chang Ho Shin , Dae Yeon Kim , Chul Hee Yoo , Dong Hyun Cho
发明人： Jae Hong Shin , Hun Joo Hahm , Hyung Suk Kim , Chang Ho Shin , Dae Yeon Kim , Chul Hee Yoo , Dong Hyun Cho
IPC分类号： F21V21/00
CPC分类号： G02F1/133603 , G02F1/133606 , G02F1/133611 , G09G3/3413 , G09G3/3426 , G09G2320/0233
摘要： There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.
摘要翻译：提供了一种使用白色发光二极管的表面光源，包括：布置成彼此预定距离的多个白色发光二极管，其中白色发光二极管被布置成使得由每个布置在与白色发光二极管最近距离的白色发光二极管和白色发光二极管中的相应的白色发光二极管的中心光量相对于白色发光二极管的平均光量为80％〜120％。

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