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    • 71. 发明授权
    • Noise reducing equipment
    • 降噪设备
    • US07380636B2
    • 2008-06-03
    • US11201846
    • 2005-08-10
    • Hiroshi YanoMitsuaki OdaYoshinori KanehanaYoji Hosoe
    • Hiroshi YanoMitsuaki OdaYoshinori KanehanaYoji Hosoe
    • B64F1/26E04B1/00E04B9/00
    • B64F1/26E01F8/0005E01F8/0094F01N1/02F01N1/04F01N1/24F01N2490/155G10K11/172
    • The noise reducing equipment of the present invention is used in combination with a vertically oriented sound barrier wall to reduce the level of noise from a source of sound such as traffic generated on one side of the sound barrier wall and comprises an assembly composed of a predetermined number of interconnected resonant chambers mounted in tandem to said sound barrier wall in a relationship such that the assembly extends from said sound barrier wall on the side thereof opposite the source of sound with the resonant chamber closest to the sound barrier wall having a volumetric area larger than the volumetric area possessed by each of the other resonant chambers and an additional sound barrier section extending from the most distant resonant chamber relative to the location of the sound barrier wall. In addition, at least one external surface of the assembly should be coated with a photo-catalyst comprising titanium dioxide.
    • 本发明的降噪设备与垂直取向的隔音屏障结合使用,以减少来自声音源的噪声水平,例如在隔音屏障的一侧产生的交通,并且包括由预定的 相互连接的共振室的数量与所述隔音壁串联安装,使得组件从与声源相反侧的所述隔音壁延伸,最靠近声屏障的谐振室的体积面积较大 比每个其它谐振室所具有的体积面积以及从最远的谐振室相对于隔音壁的位置延伸的附加的声屏障部分。 此外,组件的至少一个外表面应该涂覆有包含二氧化钛的光催化剂。
    • 80. 发明授权
    • Optical link apparatus
    • 光连接装置
    • US5546489A
    • 1996-08-13
    • US520007
    • 1995-08-28
    • Goro SasakiHiroshi YanoSosaku SawadaKentaro Doguchi
    • Goro SasakiHiroshi YanoSosaku SawadaKentaro Doguchi
    • G02B6/42H01L31/0203H01L31/173G02B6/36
    • H01L31/173G02B6/4204G02B6/4246H01L31/0203H01L2224/48247H01L2924/1305
    • In an optical link apparatus of the present invention, a hybrid IC which is a main amplifier of a receiver circuit, and a hybrid IC which is a transmitter circuit are mounted on an island of a lead frame. An OEIC in which electronic devices and a light receiving device which constitute a preamplifier of the receiver circuit are integrated is housed in a light receiving device unit. A light emitting device is housed in a light emitting device unit. Sleeves which are optical link components are installed at the light receiving device unit and the light emitting device unit, and one ends of the sleeves are protruded from a plastic molding to the outside. As wires are connected to lead pins, the hybrid ICs are electrically connected with the light receiving device unit and the light emitting device unit. The lead pins, the hybrid ICs, the light receiving device unit, the light emitting device unit, and the sleeves are integrally sealed by a plastic molding which is superior in productivity and processability. Therefore, the optical link apparatus which is small and superior in productivity can be achieved.
    • 在本发明的光链路装置中,作为接收电路的主放大器的混合IC和作为发送电路的混合IC安装在引线框的岛上。 构成接收器电路的前置放大器的电子设备和光接收装置的OEIC被容纳在光接收装置单元中。 发光器件容纳在发光器件单元中。 作为光连接部件的套筒安装在光接收装置单元和发光装置单元处,并且套筒的一端从塑料模制件突出到外部。 当导线连接到引脚时,混合IC与光接收器件单元和发光器件单元电连接。 引线针,混合IC,光接收装置单元,发光装置单元和套筒通过生产率和加工性优异的塑料模制件一体地密封。 因此,能够实现小型化且生产率优异的光连接装置。