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    • 73. 发明授权
    • Method of patterning the surface of an article using positive microcontact printing
    • 使用正微接触印刷图案化制品表面的方法
    • US06893966B2
    • 2005-05-17
    • US10307069
    • 2002-11-27
    • Emmanuel DelamarcheMatthias GeisslerHeiko Wolf
    • Emmanuel DelamarcheMatthias GeisslerHeiko Wolf
    • B81C1/00G01Q60/00G01Q70/00G03F7/00H01L21/302H01L21/461
    • G03F7/0002B81C1/0046B81C2201/036B82Y10/00B82Y30/00B82Y40/00C23F1/02
    • There is disclosed a method of patterning an article (10) including a layer (12) of copper formed onto an insulating substrate (11) using a positive microcontact printing (MCP) process. In a preferred embodiment where the metal is copper (Cu) and the substrate is a silicon wafer, the method includes removing the native oxide presents on the Cu in a solution of HCl. Then, a stamp (13′) having a patterned polydimethylsiloxane (PDMS) body (14) is linked with a 0.2 mM solution of pentaerythritol-tetrakis(3-mercaptopropionate) (PTMP) in ethanol for 1 min, to form the inking layer (15′). The stamp is applied on the Cu layer to print a first self-assembled monolayer (SAM) (16′) according to a desired pattern. The article is dipped in a solution of ECT which is then adsorbed only in the non printed regions, forming a second SAM (18) in a configuration that is complementary to the desired pattern. Finally, the printed areas of the Cu layer are removed using a peroxodisulfate etch bath.
    • 公开了一种使用正微接触印刷(MCP)工艺将包含形成在绝缘基板(11)上的铜层(12)的物品(10)图案化的方法。 在金属是铜(Cu)并且衬底是硅晶片的优选实施方案中,该方法包括在HCl溶液中除去存在于Cu上的天然氧化物。 然后,将具有图案化聚二甲基硅氧烷(PDMS)体(14)的印模(13')与0.2mM季戊四醇四(3-巯基丙酸酯)(PTMP)在乙醇中的溶液连接1分钟,形成着墨层 15')。 将印模施加在Cu层上以根据期望的图案印刷第一自组装单层(SAM)(16')。 将物品浸入ECT溶液中,然后将其吸附在非印刷区域上,形成与期望图案互补的构型的第二SAM(18)。 最后,使用过氧化二硫酸盐蚀刻浴去除Cu层的印刷区域。