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    • 71. 发明授权
    • Method for producing a low-impedance contact between a metallizing layer
and a semiconductor material
    • 用于在金属化层和半导体材料之间产生低阻抗接触的方法
    • US6146982A
    • 2000-11-14
    • US853158
    • 1997-05-08
    • Wolfgang WernerKlaus WiesingerAndreas Preussger
    • Wolfgang WernerKlaus WiesingerAndreas Preussger
    • H01L21/28H01L21/285H01L21/336H01L21/3205H01L21/331
    • H01L21/28512
    • A method for producing a low-impedance contact between a metallizing layer and a semiconductor material of a first conductivity type having a semiconductor surface, an insulation layer on the semiconductor surface and a semiconductor layer on the insulation layer, includes applying a first insulating layer with a predetermined content of dopants on the semiconductor layer, and structuring the first insulating layer by anisotropic etching, forming first and second openings. The semiconductor layer is anisotropically etched by using the first insulating layer as a mask. A first dopant of a second conductivity type is implanted and driven through the first opening into the semiconductor material with a first phototechnique, forming a first zone in the semiconductor material. A second dopant of the first conductivity type is implanted through the second opening into the semiconductor material with a second phototechnique. A second doped insulating layer is applied over the entire surface. The second insulating layer is anisotropically back-etched down to the semiconductor surface, with peripheral insulating webs remaining in the first opening. The semiconductor material is self-adjustingly anisotropically etched down to the first zone, by using the second insulating layer as a mask. A third dopant of higher doping and of the second conductivity type is implanted into the first zone by using the second insulating layer as a mask. A metallizing layer is applied.
    • 一种用于在金属化层和具有半导体表面的半导体材料的半导体材料,半导体表面上的绝缘层和绝缘层上的半导体层之间产生低阻抗接触的方法,包括:将第一绝缘层与 半导体层上的预定含量的掺杂剂,并且通过各向异性蚀刻构造第一绝缘层,形成第一和第二开口。 通过使用第一绝缘层作为掩模对半导体层进行各向异性蚀刻。 第一导电类型的第一掺杂剂通过第一光刻技术被注入和驱动通过第一开口进入半导体材料,在半导体材料中形成第一区。 第一导电类型的第二掺杂剂通过第二开口以第二光电技术注入半导体材料。 在整个表面上施加第二掺杂绝缘层。 将第二绝缘层各向异性地向下蚀刻到半导体表面,其中外围绝缘网保留在第一开口中。 通过使用第二绝缘层作为掩模,将半导体材料自适应地各向异性地蚀刻到第一区域。 通过使用第二绝缘层作为掩模,将较高掺杂和第二导电类型的第三掺杂剂注入第一区。 施加金属化层。
    • 78. 发明申请
    • Semiconductor Component With Dielectric Layer Stack
    • 半导体元件与介质层堆叠
    • US20110049667A1
    • 2011-03-03
    • US12862821
    • 2010-08-25
    • Wolfgang Werner
    • Wolfgang Werner
    • H01L23/528
    • H01L27/0802H01L23/52H01L27/0676H01L27/0805H01L27/0814
    • A semiconductor component has a semiconductor body zone, a first electrically conductive layer adjacent to the semiconductor body zone, a first dielectric layer with first dielectric properties and a second dielectric layer with second dielectric properties. The first dielectric properties differ from the second dielectric properties. The first dielectric layer and the second dielectric layer are arranged between the semiconductor body zone and the first electrically conductive layer. A second electrically conductive layer is applied between the first dielectric layer and the second dielectric layer. A first voltage divider is switched between the first electrically conductive layer and the semiconductor body zone. The second electrically conductive layer is electrically conductively connected only to the voltage divider.
    • 半导体部件具有半导体主体区域,与半导体本体区域相邻的第一导电层,具有第一介电特性的第一介电层和具有第二介电特性的第二介电层。 第一介电性质与第二介电性质不同。 第一电介质层和第二电介质层布置在半导体本体区和第一导电层之间。 在第一介电层和第二介电层之间施加第二导电层。 第一分压器在第一导电层和半导体主体区之间切换。 第二导电层仅导电地连接到分压器。