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    • 74. 发明授权
    • Integrated circuits; methods for manufacturing an integrated circuit and memory module
    • 集成电路; 用于制造集成电路和存储器模块的方法
    • US07838861B2
    • 2010-11-23
    • US11856668
    • 2007-09-17
    • Ulrich Klostermann
    • Ulrich Klostermann
    • H01L29/02
    • H01L27/2463H01L45/085H01L45/1226H01L45/141H01L45/142H01L45/143H01L45/146H01L45/147H01L45/148H01L45/1658
    • Embodiments of the present invention relate generally to integrated circuits, to methods for manufacturing an integrated circuit and to a memory module. In an embodiment of the invention, an integrated circuit is provided having a programmable arrangement. The programmable arrangement includes a substrate having a main processing surface, at least two first electrodes, wherein each of the two first electrodes has a side surface being arranged at a respective angle with regard to the main processing surface, the side surfaces facing one another. The programmable arrangement may further include at least one second electrode and ion conducting material between each of the at least two first electrodes and the at least one second electrode, wherein the at least one second electrode is arranged partially between the side surfaces of the two first electrodes facing one another.
    • 本发明的实施例一般涉及集成电路,制造集成电路和存储器模块的方法。 在本发明的实施例中,提供具有可编程布置的集成电路。 可编程布置包括具有主处理表面的基板,至少两个第一电极,其中两个第一电极中的每一个具有相对于主处理表面相对于主处理表面相对的角度布置的侧表面。 所述可编程布置还可以包括在所述至少两个第一电极和所述至少一个第二电极中的每一个之间的至少一个第二电极和离子传导材料,其中所述至少一个第二电极部分地布置在所述两个第一电极 电极彼此面对。
    • 79. 发明申请
    • Hybrid Memory Cell for Spin-Polarized Electron Current Induced Switching and Writing/Reading Process Using Such Memory Cell
    • 用于旋转极化电子电流的混合存储单元使用这种存储单元的切换和写入/读取过程
    • US20080094881A1
    • 2008-04-24
    • US11845525
    • 2007-08-27
    • Jacques MiltatYoshinobu NakataniUlrich Klostermann
    • Jacques MiltatYoshinobu NakataniUlrich Klostermann
    • G11C11/00
    • G11C11/16
    • A magnetoresistive hybrid memory cell includes first and second stacked structures. The first stacked structure includes a magnetic tunnel junction including first and second magnetic regions stacked in a parallel, overlying relationship separated by a layer of non-magnetic material, wherein the first magnetic region has a fixed first magnetic moment vector and the second magnetic region has a free second magnetic moment vector that is switchable between the same and opposite directions with respect to the fixed first magnetic moment vector. The second stacked structure is at least partly arranged in a lateral relationship with respect to the first stacked structure and includes a third magnetic region having a fixed third magnetic moment vector and the second magnetic region. The first and second structures are arranged between at least two electrodes in electrical contact therewith.
    • 磁阻混合存储单元包括第一和第二堆叠结构。 第一堆叠结构包括磁隧道结,该磁隧道结包括由非磁性材料层隔开的并联叠置的堆叠的第一和第二磁区,其中第一磁区具有固定的第一磁矩矢量,第二磁区具有 相对于固定的第一磁矩矢量可在相同和相反方向之间切换的自由的第二磁矩矢量。 第二堆叠结构至少部分地相对于第一堆叠结构布置在横向关系中,并且包括具有固定的第三磁矩矢量和第二磁性区域的第三磁性区域。 第一和第二结构布置在与其接触的至少两个电极之间。
    • 80. 发明申请
    • Shared ground contact isolation structure for high-density magneto-resistive RAM
    • 用于高密度磁阻RAM的共享接地隔离结构
    • US20070296007A1
    • 2007-12-27
    • US11369195
    • 2006-03-06
    • Human ParkUlrich Klostermann
    • Human ParkUlrich Klostermann
    • H01L29/772G11C11/00
    • G11C11/16B82Y10/00H01L27/228
    • A buried ground contact that connects the ground electrodes of transistors in adjacent memory cells that are separated by an isolation region is described. In some embodiments, the buried ground contact passes beneath the isolation region that separates cells to electrically connect the drain regions of transistors in adjacent cells. The buried ground may be connected to a metal ground line through via connections at intervals, outside of the active cell area. Use of this buried ground contact eliminates the need for individual ground connections to each cell, leading to a substantial reduction in cell size, and a consequent increase in cell density. The buried ground contacts of the invention can be used with a variety of devices, including MRAM and PCRAM devices.
    • 描述了连接由隔离区分隔开的相邻存储单元中的晶体管的接地电极的埋地接地触点。 在一些实施例中,埋地接触通过隔离单元的隔离区下方,以电连接相邻单元中的晶体管的漏极区。 埋地可以在活动单元区域之外的间隔通过连接连接到金属接地线。 使用这种埋地接触消除了对每个电池的单独接地连接的需要,导致电池尺寸的显着降低,并且随之而来的电池密度增加。 本发明的埋地触点可以与各种装置一起使用,包括MRAM和PCRAM装置。