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71. 发明授权

US07262611B2 Apparatuses and methods for planarizing a semiconductor contactor 有权
标题翻译：用于平坦化半导体接触器的装置和方法
公开(公告)号：US07262611B2
公开(公告)日：2007-08-28
申请号：US10852370
申请日：2004-05-24
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
IPC分类号： G01R31/02
CPC分类号： G01R1/07307 , G01R3/00
摘要： A wiring substrate can include a substrate material, which can have a first surface and a second surface. A plurality of first electrically conductive elements can be disposed on the first surface, and a plurality of second electrically conductive elements can be disposed on the second surface. Ones of the first conductive elements can be electrically connected through the substrate material to ones of the second conductive elements. A mechanism can be located in a first region, which can be a center region, of the second surface of the substrate material. The mechanism can be configured to engage a control member. First activation of the control member can apply an adjustable pulling force to the first region, and second activation of the control member can apply an adjustable pushing force to the first region. The mechanism can be or can include a threaded stud, and the control member can be or can include a threaded nut configured to engage the threaded stud.
摘要翻译：布线基板可以包括可以具有第一表面和第二表面的基板材料。多个第一导电元件可以设置在第一表面上，并且多个第二导电元件可以设置在第二表面上。第一导电元件的一部分可以通过衬底材料电连接到第二导电元件中的一个。机构可以位于基板材料的第二表面的可以是中心区域的第一区域中。该机构可以被配置为接合控制构件。控制构件的第一启动可以对第一区域施加可调节的拉力，并且控制构件的第二启动可以向第一区域施加可调节的推力。机构可以是或可以包括螺柱，并且控制构件可以是或可以包括构造成接合螺柱的螺纹螺母。

72. 发明授权

US07202682B2 Composite motion probing 失效
标题翻译：复合运动探测
公开(公告)号：US07202682B2
公开(公告)日：2007-04-10
申请号：US10328113
申请日：2002-12-20
申请人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
发明人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
IPC分类号： G01R31/02
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备相对于用于与设备电接触的探针移动到第一位置。然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。进入第二位置的运动包括两个部件。移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。第二动作往往会减轻压力。然后通过探头将测试数据传送到电子设备和从电子设备传送。

73. 发明授权

US07168162B2 Method of manufacturing a probe card 失效
标题翻译：探针卡的制造方法
公开(公告)号：US07168162B2
公开(公告)日：2007-01-30
申请号：US10823437
申请日：2004-04-12
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu
IPC分类号： H01R9/00
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

74. 发明授权

US07073254B2 Method for mounting a plurality of spring contact elements 失效
标题翻译：用于安装多个弹簧接触元件的方法
公开(公告)号：US07073254B2
公开(公告)日：2006-07-11
申请号：US09753310
申请日：2000-12-29
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H05K3/00
CPC分类号： G01R3/00 , B23K2101/38 , G01R1/06727 , G01R1/06744 , H01L21/6835 , H01L23/4951 , H01L24/72 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01R12/57 , H05K3/4092 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , H01L2924/00
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译：通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。每个弹簧接触元件具有基端部分，接触端部分和中心体部分。接触端部在与中心体部分相同的z轴（不同高度）偏移。基端部优选地沿着与中心主体部分的z轴相反的方向偏移。以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸的电子元件。在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

75. 发明授权

US07071714B2 Method and system for compensating for thermally induced motion of probe cards 有权
标题翻译：用于补偿探针卡的热诱导运动的方法和系统
公开(公告)号：US07071714B2
公开(公告)日：2006-07-04
申请号：US10003012
申请日：2001-11-02
申请人： Benjamin N. Eldridge , Gary W. Grube , Ken S. Matsubayashi , Richard A. Larder , Makarand Shinde , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Ken S. Matsubayashi , Richard A. Larder , Makarand Shinde , Gaetan L. Mathieu
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R1/07342 , G01R1/44 , G01R31/2886
摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
摘要翻译：本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

76. 发明授权

US07048548B2 Interconnect for microelectronic structures with enhanced spring characteristics 失效
标题翻译：具有增强弹簧特性的微电子结构互连
公开(公告)号：US07048548B2
公开(公告)日：2006-05-23
申请号：US10715683
申请日：2003-11-17
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge
IPC分类号： H01R12/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/71 , H01L24/72 , H01L2224/05001 , H01L2224/05568 , H01L2224/11002 , H01L2224/11003 , H01L2224/13099 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/3011 , H01R12/57 , H01R12/718 , H01R13/03 , H01R13/24 , H05K3/326 , H05K3/4092 , H05K2201/0311 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.
摘要翻译：一种互连元件和形成互连元件的方法。在一个实施例中，互连元件包括耦合到第一结构的第一结构和第二结构。与第一材料耦合的第二结构具有大于单独的第一结构的弹簧常数的弹簧常数。在一个实施例中，互连元件适于耦合到从电子部件跟踪为导电路径的电子部件。在一个实施例中，该方法包括形成耦合到衬底的第一（互连）结构以限定适合于集成电路环境中的互连的形状，然后例如通过将第二（互连）结构涂覆到第一（互连）互连）结构以形成互连元件。总的来说，第一（互连）结构和第二（互连）结构具有大于第一（互连）结构的弹簧常数的弹簧常数。

77. 发明授权

US07047638B2 Method of making microelectronic spring contact array 失效
标题翻译：制造微电子弹簧接触阵列的方法
公开(公告)号：US07047638B2
公开(公告)日：2006-05-23
申请号：US10202712
申请日：2002-07-24
申请人： Benjamin N. Eldridge , Gaetan L. Mathieu , Carl V. Reynolds
发明人： Benjamin N. Eldridge , Gaetan L. Mathieu , Carl V. Reynolds
IPC分类号： H01R43/00
CPC分类号： G01R1/06744 , G01R1/06733 , G01R3/00 , Y10T29/49139 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222 , Y10T29/49224
摘要： A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.
摘要翻译：制造微电子弹簧接触阵列的方法包括在牺牲衬底上形成多个弹簧触点，然后从牺牲衬底释放弹簧触头。每个弹簧触点具有带有基端的细长梁。制造阵列的方法包括在它们已经从牺牲基板完全释放之后将其基端处的弹簧触点附接到基底基板，使得每个触点从基底延伸到其波束的远端。远端与预定阵列的尖端位置对准。在本发明的一个实施例中，通过在牺牲衬底上的牺牲层中图形地形成弹簧触点的轮廓来形成弹簧触点。牺牲层中的图案化凹槽的壁限定弹簧触点的侧面轮廓，并且导电材料沉积在凹部中以形成弹簧触点的细长梁。

78. 发明授权

US06972578B2 Method and system for compensating thermally induced motion of probe cards 有权
标题翻译：用于补偿探针卡热诱导运动的方法和系统
公开(公告)号：US06972578B2
公开(公告)日：2005-12-06
申请号：US10159560
申请日：2002-05-31
申请人： Rod Martens , Benjamin N. Eldridge , Gary W. Grube , Ken S. Matsubayashi , Richard A. Larder , Makarand Shinde , Gaetan L. Mathieu
发明人： Rod Martens , Benjamin N. Eldridge , Gary W. Grube , Ken S. Matsubayashi , Richard A. Larder , Makarand Shinde , Gaetan L. Mathieu
IPC分类号： G01R1/067 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/00
CPC分类号： G01R31/2891 , G01R1/07342 , G01R31/2886
摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
摘要翻译：本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

79. 发明授权

US06937037B2 Probe card assembly for contacting a device with raised contact elements 失效
标题翻译：用于使设备与凸起的接触元件接触的探针卡组件
公开(公告)号：US06937037B2
公开(公告)日：2005-08-30
申请号：US10198198
申请日：2002-07-16
申请人： Benjamin N. Eldridge , Gary W. Grube , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Gaetan L. Mathieu
IPC分类号： G01R31/26 , B23K20/00 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H01R33/76 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： B23K20/004 , B23K2101/40 , G01R1/06711 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/13099 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H01L2924/00
摘要： A probe card is provided for probing a semiconductor wafer with raised contact elements. In particular, the present invention is useful with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.
摘要翻译：探针卡用于探测具有凸起接触元件的半导体晶片。特别地，本发明对弹性接触元件例如弹簧是有用的。探针卡被设计成具有与晶片上的接触元件配合的端子。在优选实施例中，终端是帖子。在优选实施例中，端子包括适于重复接触的接触材料。在一个特别优选的实施例中，空间变压器被制备成具有一侧的接触柱和相对侧上的端子。具有弹簧触点的插入件将空间变压器的相对侧上的触点连接到探针卡上的对应端子，该端子又连接到可连接到诸如常规测试器的测试装置的端子。

80. 发明授权

US06913468B2 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods 失效
标题翻译：将电子部件可拆卸地安装到电路板的方法以及通过该方法形成的插座
公开(公告)号：US06913468B2
公开(公告)日：2005-07-05
申请号：US10684094
申请日：2003-10-10
申请人： Thomas H. Dozier, II , Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Thomas H. Dozier, II , Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , H01R12/00
CPC分类号： B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07357 , G01R1/07378 , G01R3/00 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48
摘要： Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate.
摘要翻译：描述了允许诸如半导体封装的电子部件可释放地安装到电路板的表面贴装焊接插座。通常，插座包括从支撑衬底的顶表面延伸的弹性接触结构以及设置在支撑衬底的底表面上的焊球（或其它合适的）接触结构。复合互连元件被描述为用作设置在支撑基板顶上的弹性接触结构。在使用中，支撑基板被焊接到电路板上，支撑基板的底表面上的接触结构接触电路板上的相应的接触区域。以任何合适的方式，通过支撑衬底将支撑衬底上的弹性接触结构中的选定的接触结构连接到支撑衬底的底表面上的相应接触结构。

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