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71. 发明申请

US20070296279A1 Power control system 有权
标题翻译：电源控制系统
公开(公告)号：US20070296279A1
公开(公告)日：2007-12-27
申请号：US11476960
申请日：2006-06-27
申请人： Weesyk Wang , Michael Yang
发明人： Weesyk Wang , Michael Yang
IPC分类号： H02B1/24
CPC分类号： H03K17/223 , H02H9/004 , H03K17/284 , Y10T307/766 , Y10T307/826
摘要： A power control system for use in an electronic device provided with a transforming module becoming self-contained upon connection with a power supply includes a switch module, a delay module, and a control module. The switch module turns on or off a power input route whereby the transforming module can supply power to the electronic device, and keeps the power input route at an off state while the transforming module remains unconnected to the power supply. The delay module performs a delay process and generates delay signals. The control module receives the delay signals generated and enables the switch module to turn on the power input route. The present invention prevents the stability of the electronic device from being deteriorated as a result of electric sparks induced by metallic friction and excessive instantaneous current while the electronic device is being connected to the power supply.
摘要翻译：一种用于电子设备的电力控制系统，包括开关模块，延迟模块和控制模块，所述电子设备具有与电源连接变得独立的变换模块。开关模块打开或关闭电源输入路由，由此变换模块可以向电子设备供电，并且在变换模块保持未连接到电源的同时将电力输入路线保持在关闭状态。延迟模块执行延迟处理并产生延迟信号。控制模块接收生成的延迟信号，使开关模块能够接通电力输入路线。本发明防止电子设备由于金属摩擦引起的电火花和电子设备连接到电源时的过大的瞬时电流而导致的稳定性降低。

72. 发明申请

US20070279811A1 Protection device 审中-公开
标题翻译：保护装置
公开(公告)号：US20070279811A1
公开(公告)日：2007-12-06
申请号：US11445826
申请日：2006-06-01
申请人： Weesyk Wang , Michael Yang
发明人： Weesyk Wang , Michael Yang
IPC分类号： H02H3/00
CPC分类号： H03K5/1254
摘要： A protection device applicable to an electronic device is disclosed. The electronic device includes an operating unit which outputs an on/off signal when a user turns on/off the electronic device is disclosed. The protection device includes a setting unit for setting a predetermined period, and a processing unit electrically connected to the operating unit and the setting unit. The processing unit outputs a trigger signal to turn on/off the electronic device when receiving an on/off signal provided by the operating unit during the predetermined period, and no longer outputs any trigger signal when receiving the on/off signal again during the predetermined period.
摘要翻译：公开了一种适用于电子设备的保护装置。电子设备包括当用户打开/关闭电子设备时输出开/关信号的操作单元。保护装置包括用于设定预定周期的设定单元，以及与操作单元和设定单元电连接的处理单元。处理单元在预定时段期间接收到由操作单元提供的开启/关闭信号时输出触发信号以接通/关闭电子设备，并且在预定时段期间再次接收到接通/断开信号时不再输出任何触发信号期。

73. 发明申请

US20070255439A1 Product processing system 有权
标题翻译：产品加工系统
公开(公告)号：US20070255439A1
公开(公告)日：2007-11-01
申请号：US11523181
申请日：2006-09-18
申请人： Michael Yang , Guan-Yu Huang
发明人： Michael Yang , Guan-Yu Huang
IPC分类号： G06F19/00
CPC分类号： G06Q10/06
摘要： A product processing system applicable to a production process for producing an electronic device is disclosed. The product processing system includes a plurality of processing apparatuses installed according to processing stages in the production process of the electronic device and configured to process the electronic device in the processing stages accordingly, a carrier component for carrying the electronic device; a plurality of carrier bodies installed in each of the processing apparatuses, provided with power parts for supplying power, configured to carry the carrier component, and configured to convey the electronic device on the carrier component to the processing apparatuses according to planned routes of the production process; a plurality of power supply portions installed on the carrier component and electrically connected to the power parts of the carrier bodies, so as to supply power required to process the electronic device in the processing stages while the electronic device on the carrier component is being conveyed by the carrier bodies, wherein the power is multiphase alternating current power; and a phase switching module adapted to evenly switch phases of power during the production process according to the number of phases provided by the power supply portions, thereby achieving integration of the production process of the electronic device.
摘要翻译：公开了一种适用于生产电子设备的生产过程的产品处理系统。产品处理系统包括根据电子设备的生产过程中的处理阶段安装的多个处理设备，并且被配置为在处理阶段相应地处理电子设备，用于承载电子设备的载体组件; 设置在每个处理装置中的多个载体，设置有用于供电的电力部件，构造成承载载体部件，并且构造成根据计划的生产线路将载体部件上的电子装置传送到处理装置处理; 多个电源部分安装在载体部件上并电连接到载体主体的电源部分，以便在载体部件上的电子装置正在被传送的同时在处理阶段中提供处理电子装置所需的电力载体，其中功率是多相交流功率; 以及相位切换模块，其适于根据由电源部提供的相数量在生产过程中均匀地切换电力的相位，从而实现电子设备的生产过程的集成。

74. 发明申请

US20070111519A1 INTEGRATED ELECTROLESS DEPOSITION SYSTEM 审中-公开
标题翻译：集成电沉积系统
公开(公告)号：US20070111519A1
公开(公告)日：2007-05-17
申请号：US11428230
申请日：2006-06-30
申请人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Michael Stewart , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
发明人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Michael Stewart , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
IPC分类号： H01L21/44
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1653 , C23C18/168 , C23C18/1682 , C23C18/1685 , C23C18/1689 , C25D7/123 , C25D17/001 , H01L21/02063 , H01L21/02068 , H01L21/02087 , H01L21/28518 , H01L21/28562 , H01L21/67051 , H01L21/6719 , H01L21/6723 , H01L21/67751 , H01L21/68785 , H01L21/76814 , H01L21/76843 , H01L21/76856 , H01L21/76873 , H01L21/76874
摘要： Embodiments of the invention provide methods for depositing a material onto a surface of a substrate by using one or more electroless, electrochemical plating, CVD and/or ALD processes. Embodiments of the invention provide a method for depositing a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP process on a single substrate processing platform. Other aspects provide a method for depositing a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides a method for forming a capping layer over substrate interconnects. Methods include the use of a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.
摘要翻译：本发明的实施方案提供了通过使用一种或多种化学镀，CVD和/或ALD工艺将材料沉积到衬底的表面上的方法。本发明的实施方案提供了一种用于在基板上沉积种子层的方法，该方法具有无电解方法，并随后在单个基板处理平台上用ECP工艺填充基板上的互连特征。其它方面提供了一种用于在衬底上沉积种子层的方法，在衬底上填充互连特征，或者在衬底上顺序地沉积种子层和填充互连特征。一个实施例提供了一种在衬底互连上形成覆盖层的方法。方法包括使用蒸气干燥器进行基板的沉积前和沉积后清洁以及用于后沉积清洁的刷盒室。

75. 发明申请

US20070080051A1 Button structure applicable to a touch unit of an electronic device 审中-公开
标题翻译：适用于电子设备的触摸单元的按钮结构
公开(公告)号：US20070080051A1
公开(公告)日：2007-04-12
申请号：US11271106
申请日：2005-11-10
申请人： Michael Yang , Gen-Cai Zhang
发明人： Michael Yang , Gen-Cai Zhang
IPC分类号： H01H13/14
CPC分类号： H01H13/52 , H01H2221/044
摘要： A button structure applicable to a touch unit of an electronic device is disclosed. The button structure includes a main body for touching the touch unit, a connecting portion installed on both sides of the main body and having a curved structure, and a fixing portion connected to the connecting portion for fixing the button structure to the electronic device. Under torsion force provided by the connecting portion, the main body is able to touch the touch unit evenly, so as to solve the problems of the prior art.
摘要翻译：公开了一种适用于电子设备的触摸单元的按钮结构。按钮结构包括用于触摸触摸单元的主体，安装在主体两侧并具有弯曲结构的连接部分，以及连接到用于将按钮结构固定到电子设备的连接部分的固定部分。在由连接部提供的扭转力下，主体能够均匀地接触触摸单元，从而解决现有技术的问题。

76. 发明申请

US20060251800A1 Contact metallization scheme using a barrier layer over a silicide layer 有权
公开(公告)号：US20060251800A1
公开(公告)日：2006-11-09
申请号：US11385344
申请日：2006-03-20
申请人： Timothy Weidman , Kapila Wijekoon , Zhize Zhu , Avgerinos Gelatos , Amit Khandelwal , Arulkumar Shanmugasundram , Michael Yang , Fang Mei , Farhad Moghadam
发明人： Timothy Weidman , Kapila Wijekoon , Zhize Zhu , Avgerinos Gelatos , Amit Khandelwal , Arulkumar Shanmugasundram , Michael Yang , Fang Mei , Farhad Moghadam
IPC分类号： B05D5/12
CPC分类号： C23C18/1678 , B82Y30/00 , C23C16/0227 , C23C16/0281 , C23C16/045 , C23C16/14 , C23C18/1608 , C23C18/1651 , C23C18/1653 , C23C18/31 , C23C18/32 , C23C18/34 , C23C18/38 , C23C18/40 , C23C18/48 , C25D5/34 , H01L21/02063 , H01L21/02074 , H01L21/28518 , H01L21/28556 , H01L21/288 , H01L21/2885 , H01L21/76814 , H01L21/76843 , H01L21/76844 , H01L21/76846 , H01L21/76847 , H01L21/76849 , H01L21/76855 , H01L21/76856 , H01L21/76861 , H01L21/76862 , H01L21/76874 , H01L21/76877 , H01L21/76879 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the invention generally provide methods of filling contact level features formed in a semiconductor device by depositing a barrier layer over the contact feature and then filing the layer using an PVD, CVD, ALD, electrochemical plating process (ECP) and/or electroless deposition processes. In one embodiment, the barrier layer has a catalytically active surface that will allow the electroless deposition of a metal on the barrier layer. In one aspect, the electrolessly deposited metal is copper or a copper alloy. In one aspect, the contact level feature is filled with a copper alloy by use of an electroless deposition process. In another aspect, a copper alloy is used to from a thin conductive copper layer that is used to subsequently fill features with a copper containing material by use of an ECP, PVD, CVD, and/or ALD deposition process. In one embodiment, a portion of the barrier layer is purposely allowed to react with traces of residual oxide at the silicon junction of the contact level feature to form a low resistance connection.

77. 外观设计

USD531142S1 Digital TV set-top box 有权
标题翻译：数字电视机顶盒
公开(公告)号：USD531142S1
公开(公告)日：2006-10-31
申请号：US29241980
申请日：2005-11-02
申请人： Michael Yang , Tian-Hao Li
设计人： Michael Yang , Tian-Hao Li

78. 发明申请

US20060230602A1 Process for fabricating a magnetic recording head with a laminated write gap 失效
公开(公告)号：US20060230602A1
公开(公告)日：2006-10-19
申请号：US11104212
申请日：2005-04-11
申请人： Wen-Chien Hsiao , Terence Lam , Yinshi Liu , Michael Yang , Samuel Yuan
发明人： Wen-Chien Hsiao , Terence Lam , Yinshi Liu , Michael Yang , Samuel Yuan
IPC分类号： G11B5/127 , H04R31/00 , G11B5/187
CPC分类号： G11B5/3116 , G11B5/23 , G11B5/3163 , Y10T29/49032 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： Embodiments of the present invention recite a process for fabricating a write gap structure for a magnetic recording head. In one embodiment, at least one layer of inert material is deposited which is disposed proximate to the P2 pole of a magnetic recording head. A layer of magnetic material is deposited which is disposed between the layer of inert material and the P1 pedestal (P1P) of the magnetic recording head. In embodiments of the present invention, a second layer of inert material is deposited which is disposed between the layer of magnetic material and the P1P of the magnetic recording head. In embodiments of the present invention, the throat height of the write gap structure is defined wherein the layer of magnetic material and the inert layer only overlie a portion of the P1 pedestal of the magnetic recording head.

79. 发明申请

US20060091103A1 Write head fabrication by inverting order of process steps 失效
标题翻译：通过反转处理步骤的顺序来编写头部制造
公开(公告)号：US20060091103A1
公开(公告)日：2006-05-04
申请号：US10976588
申请日：2004-10-29
申请人： Douglas Tsang , Jorge Colonia , Yvette Winton , Michael Yang
发明人： Douglas Tsang , Jorge Colonia , Yvette Winton , Michael Yang
IPC分类号： B44C1/22 , G11B5/127
CPC分类号： G11B5/313 , G11B5/3163 , Y10T29/49037 , Y10T29/49046 , Y10T29/49048
摘要： During fabrication of a write head via holes are first opened in a gap layer, followed by formation of seed layers instead of the other way around. Moreover a first seed layer is formed, and without the first seed layer being used a second seed layer is formed. The second seed layer (which is the topmost layer) is used in plating to form coils (e.g. of copper) for the write head. After coil formation, the first seed layer is used for plating to form vias (e.g. of NiFe). The two seed layers may be formed in a single operation by using two different targets in a vacuum deposition chamber. Moreover, a single insulation layer is sufficient to insulate and protect all plated elements, regardless of whether they are formed by use of the first seed layer or the second seed layer.
摘要翻译：在写头的制造期间，首先在间隙层中打开通孔，然后形成种子层，而不是围绕其形成。此外，形成第一种子层，并且在不使用第一种子层的情况下形成第二种子层。第二种子层（其是最上层）用于电镀以形成用于写入头的线圈（例如铜）。在线圈形成之后，第一种子层用于电镀以形成通孔（例如NiFe）。两个种子层可以通过在真空沉积室中使用两个不同的靶而在一个操作中形成。此外，单个绝缘层足以绝缘和保护所有电镀元件，而不管它们是通过使用第一种子层或第二种子层形成的。

80. 发明申请

US20060033678A1 Integrated electroless deposition system 审中-公开
标题翻译：集成无电沉积系统
公开(公告)号：US20060033678A1
公开(公告)日：2006-02-16
申请号：US11192993
申请日：2005-07-29
申请人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
发明人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
IPC分类号： G09G3/00 , H05H1/24 , C23C16/00
CPC分类号： H01L21/67167 , C23C16/06 , C23C16/34 , C23C16/4488 , C23C18/1632 , C23C18/1653 , H01L21/28556 , H01L21/288 , H01L21/6719 , H01L21/67207 , H01L21/6723 , H01L21/67742 , H01L21/67745 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： Embodiments of the invention provide a cluster tool configured to deposit a material onto a substrate surface by using one or more electroless, electrochemical plating, CVD and/or ALD processing chambers. In one aspect, a ruthenium-containing catalytic layer is formed. Embodiments of the invention provide a hybrid deposition system configured to deposit a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP cell. Other aspects provide an electroless deposition system configured to deposit a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides an electroless deposition system configured to form a capping layer over substrate interconnects. The system includes a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.
摘要翻译：本发明的实施例提供了一种集群工具，其被配置为通过使用一个或多个化学镀，CVD和/或ALD处理室将材料沉积到衬底表面上。一方面，形成含钌催化剂层。本发明的实施例提供了一种混合沉积系统，其被配置为利用无电解方法将种子层沉积在衬底上，并随后用ECP单元填充衬底上的互连特征。其它方面提供一种无电镀沉积系统，其被配置为将衬底层沉积在衬底上，填充衬底上的互连特征，或者顺序地沉积衬底上的晶种层和填充互连特征。一个实施例提供了一种配置成在衬底互连上形成覆盖层的无电沉积系统。该系统包括蒸发干燥器，用于底物的沉积前和沉积后清洁以及用于后沉积清洁的刷盒室。

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