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71. 发明授权

US07518871B2 Liquid-based cooling system for cooling a multi-component electronics system 有权
标题翻译：液体冷却系统，用于冷却多组件电子系统
公开(公告)号：US07518871B2
公开(公告)日：2009-04-14
申请号：US12168267
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
摘要翻译：提供了一种用于冷却电子系统的系统。冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂供给管分配到冷板以除去由各自的电子元件。

72. 发明申请

US20080310104A1 LIQUID-BASED COOLING APPARATUS FOR AN ELECTRONICS RACK 审中-公开
标题翻译：一种用于电子机架的基于液体的冷却装置
公开(公告)号：US20080310104A1
公开(公告)日：2008-12-18
申请号：US12174826
申请日：2008-07-17
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20781 , F28F9/0275 , H05K7/20772 , Y10T29/5313
摘要： A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.
摘要翻译：提供了一种用于促进电子机架的电子抽屉的冷却的冷却装置。该装置包括构造成用于安装到电子机架的双折门组件。门组件包括第一门和第二门，每个门被配置为单独地铰接安装到电子机架上。该装置还包括冷却剂分配装置，其中冷却剂供应歧管安装到第一门，并且其冷却剂返回歧管安装到第二门。单独的连接与冷却剂供应和返回歧管流体连通地联接，以便于冷却剂供给和从歧管返回并且用于促进门相对于电子机架的枢转运动。多个冷却剂分配端口设置在供应和返回歧管内，并且设置成便于冷却剂供应和返回到电子抽屉。

73. 发明授权

US07420808B2 Liquid-based cooling system for cooling a multi-component electronics system 有权
标题翻译：液体冷却系统，用于冷却多组件电子系统
公开(公告)号：US07420808B2
公开(公告)日：2008-09-02
申请号：US11539910
申请日：2006-10-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
摘要翻译：提供了一种用于冷却电子系统的系统。冷却系统包括预先配置用于冷却电子系统的多个电子部件的单片结构，当与其耦合时。整体结构包括多个液冷冷板，其配置和间隔设置，以耦合到相应的电子部件; 多个与多个液冷冷却板流体连通地冶金结合的冷却剂供给管，以及与多个冷却剂供给管道流体连通地冶金结合的液体 - 冷却剂集管组件。头部组件包括冶金地结合到冷却剂供应管的冷却剂供应头和与冷却剂返回管冶金结合的冷却剂回流头。当使用时，多个液冷冷板接合电子系统的各个电子部件，并且液体冷却剂通过液体 - 冷却剂集管子组件和多个冷却剂输送管分配到冷板以除去由各自的电子元件。

74. 发明授权

US07385817B2 Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled 失效
标题翻译：冷却装置和方法采用设置在模块外壳和要冷却的电子部件之间的分立冷板
公开(公告)号：US07385817B2
公开(公告)日：2008-06-10
申请号：US11871334
申请日：2007-10-12
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.
摘要翻译：提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

75. 发明授权

US07375962B2 Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus 失效
公开(公告)号：US07375962B2
公开(公告)日：2008-05-20
申请号：US11940482
申请日：2007-11-15
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , H01L23/24 , F28D15/00
CPC分类号： H01L23/4735 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , Y10S165/908 , H01L2224/0401
摘要： A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

76. 发明申请

US20080060368A1 MULTI-FLUID COOLING SYSTEM AND METHOD WITH FREEZE PROTECTION FOR COOLING AN ELECTRONIC DEVICE 失效
标题翻译：用于冷却电子设备的多流体冷却系统和冷冻保护方法
公开(公告)号：US20080060368A1
公开(公告)日：2008-03-13
申请号：US11530992
申请日：2006-09-12
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25B45/00
CPC分类号： F25B23/00 , F25B9/006 , H05K7/20281
摘要： A multi-fluid cooling system and method for cooling an electronic device are provided which employ freeze protection when in a shipping state. The cooling system includes a coolant loop having an expansion tank containing first and second fluids, which are immiscible and of different densities, and the second fluid freezes at a lower temperature than the first. The coolant loop further includes a first valve for facilitating coupling of the first fluid into the coolant loop and a second valve for facilitating coupling of the second fluid into the coolant loop, the first and second valves being independently controllable. Control logic electronically controls actuation of the first and second valves to automatically pass the first fluid through the coolant loop when the system is in an operational state and to automatically maintain the second fluid in the coolant loop when the system is in a shipping state.
摘要翻译：提供一种用于冷却电子设备的多流体冷却系统和方法，其在运输状态下采用防冻保护。冷却系统包括冷却剂回路，其具有包含第一和第二流体的膨胀罐，其不混溶并且具有不同的密度，并且第二流体在比第一流体低的温度下冻结。冷却剂回路还包括用于促进第一流体耦合到冷却剂回路中的第一阀和用于促进第二流体耦合到冷却剂回路中的第二阀，第一和第二阀是可独立控制的。当系统处于操作状态时，控制逻辑电子地控制第一和第二阀的致动，以自动地将第一流体通过冷却剂回路，并且当系统处于运输状态时，自动维持冷却剂回路中的第二流体。

77. 发明申请

US20070295480A1 MULTI-FLUID COOLING SYSTEM, COOLED ELECTRONICS MODULE, AND METHODS OF FABRICATION THEREOF 失效
标题翻译：多流体冷却系统，冷却电子模块及其制造方法
公开(公告)号：US20070295480A1
公开(公告)日：2007-12-27
申请号：US11426423
申请日：2006-06-26
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L23/427 , H01L2924/0002 , Y10S165/908 , Y10T29/49002 , H01L2924/00
摘要： A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.
摘要翻译：提供多流体冷却系统及其制造方法，用于从一个或多个电子设备去除热量。冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

78. 发明授权

US07283358B2 Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region 有权
标题翻译：通过将冷却器空气流与再循环气流中的再循环空气流混合来促进电子机架的冷却的装置和方法
公开(公告)号：US07283358B2
公开(公告)日：2007-10-16
申请号：US11184524
申请日：2005-07-19
申请人： Levi A. Campbell , Ricahrd C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Ricahrd C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20745 , F24F13/04 , H05K7/20736
摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.
摘要翻译：提供了一种装置和方法，用于促进使用联接到电子机架的空气输送结构的电子机架的冷却。空气输送结构在电子机架外部的位置处和在促进其混合的方向上传送空气流，并且从电子机架的空气出口侧到其进气侧再循环排出的入口到出口空气流。输送的空气流比再循环排出的入口到出口空气流更冷，并且当与再循环空气流混合时，有助于降低电子机架的空气入口侧的一部分处的进气温度，从而增强冷却的电子机架。

79. 发明授权

US07233494B2 Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins 有权
标题翻译：冷却装置，冷却电子模块及其采用集成歧管和多个导热翅片的制造方法
公开(公告)号：US07233494B2
公开(公告)日：2007-06-19
申请号：US11124064
申请日：2005-05-06
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. The fins facilitate transfer of heat from the surface to be cooled. The apparatus further includes an integrated manifold having a plurality of inlet orifices for injecting coolant onto the surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. Further, the integrated manifold and the surface to be cooled are disposed with the common surface of the manifold and the surface to be cooled in spaced, opposing relation, and with the plurality of thermally conductive fins disposed therebetween.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括耦合到待冷却表面并远离待冷却表面的多个导热翅片。散热片有助于从要冷却的表面传递热量。该装置还包括具有多个用于将冷却剂喷射到待冷却表面上的入口孔的集成歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。入口孔和出口开口散布在集成歧管的共同表面中。此外，集成歧管和要冷却的表面与歧管的共同表面和待冷却的表面以间隔相对的关系设置，并且多个导热翅片设置在它们之间。

80. 发明授权

US07206203B2 Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins 失效
标题翻译：电子设备冷却组件和使用保持多个导热销的弹性支撑材料的方法
公开(公告)号：US07206203B2
公开(公告)日：2007-04-17
申请号：US10873432
申请日：2004-06-22
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Roger R. Schmidt
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Roger R. Schmidt
IPC分类号： H05K7/20 , H01L23/34 , H02G3/03 , F28F7/00
CPC分类号： H01L23/4336 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar.
摘要翻译：提供了一种电子设备冷却组件和制造方法，其包括具有用于将冷却液体喷射到待冷却表面上的孔口的歧管以及具有与歧管孔口对准的开口的弹性销支撑材料。多个导热销安装在支撑材料内，从其延伸，并且其尺寸设计成物理接触要冷却的表面。支撑材料具有厚度和顺从性，其通过允许其第二端垂直移动和倾斜来促进销与表面的热接合。每个销的第二端具有垂直于销的轴线的平坦表面，并且支撑材料有助于第二销端的平面表面与待冷却的表面建立平面接触，尽管表面可以是其他比平面。

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