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    • 71. 发明授权
    • High breakdown voltage semiconductor device
    • 高击穿电压半导体器件
    • US6163051A
    • 2000-12-19
    • US154041
    • 1998-09-16
    • Akio NakagawaTomoko MatsudaiHideyuki FunakiNorio Yasuhara
    • Akio NakagawaTomoko MatsudaiHideyuki FunakiNorio Yasuhara
    • H01L21/331H01L29/06H01L29/739H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L29/66325H01L29/0696H01L29/7394H01L29/7398
    • A high breakdown voltage semiconductor device comprising a first base region of a first conductivity type, a second base region of a second conductivity type, which is formed in a surface region of the first base region, a first gate insulation film formed on an inner wall of a first LOCOS groove formed passing through the second base region to reach the first base region, a first gate electrode formed on the first gate insulation film, a first source region of a first conductivity type, which is formed in a surface region of the second base region around the first LOCOS groove in such a manner as to contact with the first gate insulating film, a first drain region formed in a surface region of the first base region in such a manner as to be spaced apart from the second base region, a source electrode formed on the first source region and on the second base region, and a drain electrode formed on the first drain region.
    • 一种高耐压电压半导体器件,包括第一导电类型的第一基极区域和形成在第一基极区域的表面区域中的第二导电类型的第二基极区域,形成在内壁上的第一栅极绝缘膜 形成为穿过第二基极区域以到达第一基极区域的第一LOCOS沟槽,形成在第一栅极绝缘膜上的第一栅极电极,形成在第一栅极绝缘膜的表面区域中的第一导电类型的第一源极区域, 第二基区,以与第一栅极绝缘膜接触的方式围绕第一LOCOS沟槽;第一漏极区,形成在第一基极区域的表面区域中,以与第二基极区域隔开; 形成在第一源极区域和第二基极区域上的源电极以及形成在第一漏极区域上的漏电极。
    • 72. 发明授权
    • Semiconductor device
    • 半导体器件
    • US5994740A
    • 1999-11-30
    • US972148
    • 1997-11-17
    • Akio NakagawaYoshihiro YamaguchiTomoko Matsudai
    • Akio NakagawaYoshihiro YamaguchiTomoko Matsudai
    • H01L21/84H01L27/12H01L27/01H01L31/0392
    • H01L21/84H01L27/1203
    • An n.sup.- -type silicon active layer having a thickness of 6 .mu.m or less is formed on a silicon substrate via a silicon oxide film. An npn bipolar transistor with a low withstand voltage and an IGBT with a high withstand voltage are formed in the active layer. The two devices are insulated and isolated from each other through a trench. The bipolar transistor has an n-type well layer formed in the surface of the active layer. A p-type well layer is formed in the surface of the n-type well layer. The thickness of the n-type well layer under the p-type well layer is set to be 1 .mu.m or more. A first n.sup.+ -type diffusion layer is formed in the surface of the n-type well layer. A p.sup.+ -type diffusion layer and a second n.sup.+ -type diffusion layer are formed in the surface of the p-type well layer. The n-type well layer and the first n.sup.+ -type diffusion layer serve as a collector region. The p-type well layer and the p.sup.+ -type diffusion layer serve as a base region. The second n.sup.+ -type diffusion layer serves as an emitter region.
    • 通过氧化硅膜在硅衬底上形成厚度为6μm以下的n型硅有源层。 在有源层中形成具有低耐压的npn双极晶体管和具有高耐压的IGBT。 两个器件通过沟槽彼此绝缘和隔离。 双极晶体管在有源层的表面形成有n型阱层。 p型阱层形成于n型阱层的表面。 p型阱层下面的n型阱层的厚度设定为1μm以上。 在n型阱层的表面形成第一n +型扩散层。 在p型阱层的表面形成p +型扩散层和第n +型扩散层。 n型阱层和第一n +型扩散层用作集电极区域。 p型阱层和p +型扩散层用作基极区域。 第二n +型扩散层用作发射极区域。