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    • 71. 发明授权
    • Method for fabricating a trench capacitor of DRAM
    • DRAM的沟槽电容器的制造方法
    • US06979613B1
    • 2005-12-27
    • US10707027
    • 2003-11-16
    • Kuo-Chien WuPing Hsu
    • Kuo-Chien WuPing Hsu
    • H01L21/20H01L21/334H01L21/8242
    • H01L27/1087H01L29/66181
    • A method for fabricating a deep trench capacitor. A substrate is provided having a pad oxide layer and a pad nitride layer stacked on a main surface thereof. A deep trench is etched into the substrate through the pad oxide layer and the pad nitride layer. A node dielectric is coated on the interior surface of the deep trench. A silicon spacer layer is formed on the sidewall of the deep trench over the node dielectric. An upper portion of the silicon spacer layer is doped with dopants such as BF2. The undoped portion of the silicon spacer layer is selectively removed to expose a portion of the node dielectric. The exposed node dielectric is stripped off to expose the substrate. The remaining node dielectric covered by the doped silicon spacer layer forms a protection spacer for protecting the pad oxide layer from corrosion during the subsequent etching processes.
    • 一种制造深沟槽电容器的方法。 提供了具有堆叠在其主表面上的衬垫氧化物层和衬垫氮化物层的衬底。 通过衬垫氧化物层和衬垫氮化物层将深沟槽蚀刻到衬底中。 节点电介质涂覆在深沟槽的内表面上。 硅间隔层形成在节点电介质上的深沟槽的侧壁上。 硅间隔层的上部掺杂有诸如BF 2 N的掺杂剂。 选择性地去除硅间隔层的未掺杂部分以暴露节点电介质的一部分。 将暴露的节点电介质剥离以露出衬底。 由掺杂硅间隔层覆盖的剩余节点电介质形成保护间隔物,用于在随后的蚀刻工艺期间保护衬垫氧化物层不受腐蚀。
    • 73. 发明授权
    • Wafer acceptance testing method and structure of a test key used in the method
    • 晶圆验收测试方法和方法中使用的测试键的结构
    • US06905897B1
    • 2005-06-14
    • US10707398
    • 2003-12-10
    • Ping Hsu
    • Ping Hsu
    • G01R31/28H01L21/66H01L23/544H01L23/58H01L29/06H01L31/0328
    • H01L22/34G01R31/2884
    • A wafer acceptance testing method for monitoring GC-DT misalignment and a test key structure are disclosed. The test key includes a deep trench capacitor structure biased to a first voltage (VDT). The deep trench capacitor structure includes a buried strap out diffusion region A GC-T electrode layout, which is biased to a second voltage (VGC-T), includes a plurality of columns of GC-T fingers. A GC-B electrode layout, which is biased to a third voltage (VGC-B), includes a plurality of columns of GC-B fingers that interdigitate the GC-T fingers. A first capacitance C1 of a first capacitor contributed by the GC-T fingers and the buried strap out diffusion region is measured. A second capacitance C2 of a second capacitor contributed by the GC-B fingers and the buried strap out diffusion region is measured. The first capacitance C1 and second capacitance C2 are compared, wherein when C1≠C2, GC-DT is misaligned.
    • 公开了用于监测GC-DT不对准的晶片验收测试方法和测试键结构。 测试键包括偏置到第一电压(V SUB DT)的深沟槽电容器结构。 深沟槽电容器结构包括被偏置到第二电压(V GC-T))的掩埋带出扩散区A GC-T电极布局,包括多列GC-T指 。 被偏置到第三电压(V GC-B))的GC-B电极布局包括多个GC-B指针列,其指示GC-T指状物。 测量由GC-T指状物和掩埋带出扩散区域贡献的第一电容器的第一电容C 1 1。 测量由GC-B手指和掩埋带出扩散区域贡献的第二电容器的第二电容C 2 2。 比较第一电容C 1和第二电容C 2 2,其中当C 1> C 2 时, GC-DT未对齐。
    • 75. 发明授权
    • Counter based design for temperature controlled refresh
    • 基于计数器的温度控制刷新设计
    • US09412433B2
    • 2016-08-09
    • US14161655
    • 2014-01-22
    • NANYA TECHNOLOGY CORP.
    • Donald Martin Morgan
    • G11C11/406
    • G11C11/40626G11C11/40611
    • A DRAM includes: a temperature sensor for monitoring a temperature operating condition of the DRAM; and a binary counter coupled to the temperature sensor, for receiving external commands to perform a refresh operation, and incrementing a count upon each received external command, wherein the refresh operation will be selectively skipped according to a value of the binary counter. The binary counter is activated to a first mode when the temperature sensor determines the temperature operating condition of the DRAM goes below a first threshold and activated to a second mode when the temperature sensor determines the temperature operating condition of the DRAM goes below a second threshold lower than the first threshold.
    • DRAM包括:用于监视DRAM的温度操作状态的温度传感器; 以及耦合到所述温度传感器的二进制计数器,用于接收执行刷新操作的外部命令,以及在每个所接收的外部命令时递增计数,其中根据二进制计数器的值选择性地跳过刷新操作。 当温度传感器确定DRAM的温度操作条件低于第一阈值时,二进制计数器被激活到第一模式,并且当温度传感器确定DRAM的温度操作条件低于第二阈值时激活到第二模式 比第一个门槛。
    • 76. 发明授权
    • Method of forming tight-pitched pattern
    • 形成紧密花纹图案的方法
    • US09091929B2
    • 2015-07-28
    • US14249371
    • 2014-04-10
    • NANYA TECHNOLOGY CORP.
    • Chun-Wei Wu
    • G03F7/20G03F1/50
    • G03F7/2022G03F1/50G03F7/203G03F7/70458G03F7/70466
    • A method of forming a tight-pitched pattern. A target pattern including a plurality of first stripe patterns is provided. Each of the first stripe patterns has a first width and a first length. A photomask includes a plurality of second stripe patterns corresponding to the first stripe patterns is provided. Each of the second stripe patterns has a second width and a second length. A first exposure process with the photomask is provided in an exposure system. The first exposure process uses a first light source with a higher resolution that is capable of resolving the second width of each of the second stripe patterns. Finally, a second exposure process with the photo-mask is provided in the exposure system. The second exposure process uses a second light source with a lower resolution that is not adequate to resolve the second width of each of the second stripe patterns.
    • 形成紧斜图案的方法。 提供包括多个第一条纹图案的目标图案。 每个第一条纹图案具有第一宽度和第一长度。 光掩模包括与第一条纹图案相对应的多个第二条纹。 每个第二条纹图案具有第二宽度和第二长度。 在曝光系统中提供了具有光掩模的第一曝光过程。 第一曝光过程使用具有更高分辨率的第一光源,其能够分辨每个第二条纹图案的第二宽度。 最后,在曝光系统中提供具有光掩模的第二曝光处理。 第二曝光过程使用具有较低分辨率的第二光源,其不足以解决每个第二条纹图案的第二宽度。