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61. 发明申请

US20080311768A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 失效
公开(公告)号：US20080311768A1
公开(公告)日：2008-12-18
申请号：US12047664
申请日：2008-03-13
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00 , H05K3/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

62. 发明申请

US20080280474A1 ELECTRICAL CONNECTOR ASSEMBLY HAVING CONNECTING PORTION 有权
标题翻译：具有连接部分的电气连接器总成
公开(公告)号：US20080280474A1
公开(公告)日：2008-11-13
申请号：US12151537
申请日：2008-05-07
申请人： Chia-Wei Fan , Hao-Yun Ma
发明人： Chia-Wei Fan , Hao-Yun Ma
IPC分类号： H01R12/16 , H01R13/62
CPC分类号： H05K7/1061 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An electrical connector assembly (100) is provided for connecting a heat sink thereto and has a housing (3), a number of contacts mounted into the housing, a stiffener (2), a clip (4) covering the housing and a lever (5). The stiffener includes a top plate (21) defining a number of mounting holes (252) thereon and a window (212) defined in a centre of the top plate. The electrical connector assembly further has a number of connecting portions (6) interfering with the inner surface of the mounting holes for connecting the heat sink to the stiffener.
摘要翻译：提供电连接器组件（100），用于将散热器连接到其上并具有壳体（3），安装到壳体中的多个触点，加强件（2），覆盖壳体的夹子（4）和杠杆 5）。加强件包括限定多个安装孔（252）的顶板（21）和限定在顶板中心的窗（212）。电连接器组件还具有与用于将散热器连接到加强件的安装孔的内表面干涉的多个连接部分（6）。

63. 发明申请

US20080188110A1 Ic Socket 失效
标题翻译： Ic插座
公开(公告)号：US20080188110A1
公开(公告)日：2008-08-07
申请号：US11568956
申请日：2005-04-13
申请人： Masahiko Kobayashi
发明人： Masahiko Kobayashi
IPC分类号： H01R13/62
CPC分类号： H05K7/1061
摘要： Problem: To provide an IC socket which reduces the operating force of a pressing member, enlarges the dimensions of a pressing surface of the pressing member, and prevents positional offset of the IC device while applying the pressing force. Means for Solution: An IC socket 10 is provided with a housing 14 having a support 12, a plurality of contacts 16, a pressing member 18 for pressing an IC device supported at the support toward a group of contacts, and a biasing mechanism 22 for generating a pressing force for pressing the IC device at the pressing member. The pressing member has a pivot 42 guided linearly on the housing and a pressing surface swingable about the pivot on the housing, while the biasing mechanism 22 applies a biasing force to the pivot of the pressing member so as to cause the pressing force at the pressing surface. The pressing surface of the pressing member moves in parallel displacement between an operating position where it is closest to the support and a first nonoperating position where it is away from the support and swings between the first nonoperating position and a second nonoperating position further away from the support.
摘要翻译：问题：为了提供降低按压部件的操作力的IC插座，能够扩大按压部件的按压面的尺寸，并且可以防止IC器件施加按压力时的位置偏移。解决方案：IC插座10设置有具有支撑件12的壳体14，多个触点16，用于将支撑在支撑件上的IC装置按压到一组触点的按压构件18，以及用于产生用于按压构件上的IC器件的按压力。按压构件具有在壳体上线性地引导的枢轴42和可围绕壳体的枢轴摆动的按压面，同时偏置机构22向按压构件的枢轴施加偏压力，以便在按压时产生压力表面。按压构件的按压表面在其最靠近支撑件的操作位置和远离支撑件的第一非操作位置之间平行移动，并且在第一非操作位置处远离支撑件并在第一非操作位置和远离该支撑件的第二非操作位置之间摆动支持。

64. 发明授权

US07405940B1 Piston reset apparatus for a multichip module and method for resetting pistons in the same 有权
标题翻译：用于多芯片模块的活塞复位装置和用于复位活塞的活塞的方法
公开(公告)号：US07405940B1
公开(公告)日：2008-07-29
申请号：US11739773
申请日：2007-04-25
申请人： Gerald P. Audet , Sylvain Dussault , Pierre LaCasse , Jean-Luc Landreville
发明人： Gerald P. Audet , Sylvain Dussault , Pierre LaCasse , Jean-Luc Landreville
IPC分类号： H05K7/20
CPC分类号： H05K7/1061 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.
摘要翻译：公开了一种用于多芯片模块的活塞复位装置，其包括具有多个突起的基座和从基座的相对端延伸的两个单元关联钉，帽子设置在基座的上方，并且包括在帽子内可垂直调节的多个可调节活塞，所述多个可调节活塞与所述多个突起中的一个突起对准设置，所述质量当量板设置在所述帽子的上方并且被构造成保持弹簧加载的套筒，所述弹簧加载的套筒包括多个弹簧，每个所述弹簧为对准并构造成在多个活塞中的一个上施加压力，弹簧加载的夹具，其设置在板的上方并且包括弹簧加载部分和保持部分，所述保持部分限定两个空腔，其被构造成与由每个单位关联栓。

65. 发明授权

US07374428B2 Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
标题翻译：使用金属弹性体半环和其他多点接触几何的地面阵列（LGA）插入器
公开(公告)号：US07374428B2
公开(公告)日：2008-05-20
申请号：US11865395
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

66. 发明申请

US20080113545A1 Land grid array connector with retaing clip 有权
标题翻译：带格子夹的土地格栅阵列连接器
公开(公告)号：US20080113545A1
公开(公告)日：2008-05-15
申请号：US11985293
申请日：2007-11-13
申请人： Jie-Feng Zhang , Wen He
发明人： Jie-Feng Zhang , Wen He
IPC分类号： H01R13/62
CPC分类号： H05K7/1061
摘要： A land grid array connector (100) has a stiffener defining a window (305) thereon, a metal clip (40) pivotably coupling with stiffener, a lever (50) engaging on the stiffener, a housing (10) received in the window of the stiffener and a number of contacts mounted to the housing. The lever includes a pair of locating portions (501) and an offset actuating portion (503) disposed between the locating portions. The clip includes a projecting portion (400) having a depress portion (405) for receiving the offset actuating portion of the lever, a protruding portion (406) bending upwardly and inwardly from an end of the depress portion and a pair of guiding portions (4060) extending outwardly from the protruding portion for resisting against opposite ends of the offset actuating portion.
摘要翻译：地面阵列连接器（100）具有限定其上的窗口（305）的加强件，与加强件可枢转地联接的金属夹（40），接合在加强件上的杠杆（50），容纳在窗口加强件和安装到壳体的多个触点。杠杆包括设置在定位部分之间的一对定位部分（501）和偏移致动部分（503）。夹具包括具有用于接收杠杆的偏移致动部分的按压部分（405）的突出部分（400），从按压部分的端部向上和向内弯曲的突出部分（406）和一对引导部分 4060）从所述突出部分向外延伸以抵抗所述偏移致动部分的相对端。

67. 发明授权

US07361025B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
公开(公告)号：US07361025B2
公开(公告)日：2008-04-22
申请号：US11865423
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

68. 发明授权

US07361024B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
公开(公告)号：US07361024B2
公开(公告)日：2008-04-22
申请号：US11865217
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

69. 发明授权

US07358444B2 Folded substrate with interposer package for integrated circuit devices 有权
标题翻译：用于集成电路器件的带有插入器封装的折叠式衬底
公开(公告)号：US07358444B2
公开(公告)日：2008-04-15
申请号：US10964790
申请日：2004-10-13
申请人： Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
发明人： Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
IPC分类号： H05K1/00
CPC分类号： H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/141 , H05K1/147 , H05K1/189 , H05K7/1061 , H05K2201/056 , H05K2201/10378 , H05K2201/10734 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49144 , Y10T29/49146 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
摘要翻译：在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，所述第一集成电路封装使用中介层和围绕插入件折叠的衬底机械地和电连接。描述和要求保护其他实施例。

70. 发明授权

US07354277B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
公开(公告)号：US07354277B2
公开(公告)日：2008-04-08
申请号：US11865293
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

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