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    • 61. 发明授权
    • Multi-function photopolymer for efficiently producing high resolution
images on printed wiring boards, and the like
    • 用于在印刷线路板上有效地产生高分辨率图像的多功能光聚合物等
    • US4582778A
    • 1986-04-15
    • US545169
    • 1983-10-25
    • Donald F. Sullivan
    • Donald F. Sullivan
    • G03F7/095H05K3/00H05K3/06H05K3/24H05K3/34H05K3/40H05K3/42G03C1/495G03C1/90G03C1/94
    • G03F7/0955H05K3/064H05K3/243H05K2203/0505H05K2203/0577H05K2203/0585H05K2203/0723H05K2203/1394H05K3/0094H05K3/3473H05K3/4007H05K3/427
    • A two layer photopolymer film pack is provided for producing a sequence of an intermediate and a final image on a substrate surface adjacent the film pack upon two successive cycles of exposure through a photo image pattern and development to remove soluble photopolymer. The two layers are of different photopolymers, which have differing solubility characteristics providing for both layers to be removed together by a first developing solution and only one layer to be removed by a different developing solution. This permits the process of this invention namely the successive exposure of a multi-layer photopolymer film to two different photo image patterns to develop intermediate and final hard photopolymer patterns for such methods as photomasking a printed wiring board by use of the intermediate step and producing high resolution printed wire traces in the final step covered by the photopolymer as an insulating solder mask layer. The two layers are of different thicknesses, a very thin layer thus affording very high circuit trace resolution. Two negative acting photopolymer layers are low in cost and sandwiched by an opaque film layer dissolvable in the first developing solution in one embodiment. In another embodiment a positive acting thin layer produces good resolution and a thicker polymer layer provides an electroplating barrier. Thus, a laminated printed wiring board assembly permits custom manufacture of specific circuit boards with less time, less cost, higher quality and fewer steps.
    • 提供了一个双层感光聚合物膜组件,用于在通过照相图像图案曝光和显影以除去可溶性光聚合物的两个连续循环之后,在邻近胶片组的基板表面上产生中间和最终图像序列。 这两层是不同的光聚合物,其具有不同的溶解性,其特征在于通过第一显影溶液一起除去两层,并且只有一层被不同的显影液除去。 这允许本发明的方法,即将多层光聚合物膜连续暴露于两种不同的照片图案以开发中等和最终的硬光聚合物图案,用于通过使用中间步骤对印刷线路板进行光掩模并产生高的 在作为绝缘焊料掩模层的光聚合物覆盖的最后步骤中的分辨率印刷线迹。 这两层具有不同的厚度,非常薄的层,从而提供非常高的电路迹线分辨率。 在一个实施方案中,两种负性光敏聚合物层的成本低并且被可溶解在第一显影液中的不透明膜层夹在中间。 在另一个实施方案中,正作用薄层产生良好的分辨率,较厚的聚合物层提供电镀屏障。 因此,层叠印刷线路板组件允许以更短的时间,更低的成本,更高的质量和更少的步骤来定制制造特定的电路板。