专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

US20150054356A1 SOLID STATE RELAY 有权
标题翻译：固态继电器
公开(公告)号：US20150054356A1
公开(公告)日：2015-02-26
申请号：US14217179
申请日：2014-03-17
申请人： Zonit Structured Solutions, LLC
发明人： Steve Chapel , William Pachoud
IPC分类号： H05K1/02 , H05K7/20 , H05K3/30 , H03K17/687 , H03K17/13 , H05K1/18 , H05K5/00
CPC分类号： H03K17/133 , H03K17/687 , H05K1/0204 , H05K3/306 , H05K2201/042 , H05K2201/066 , H05K2201/10053 , H05K2201/10242 , H05K2201/10303 , H05K2201/10363 , H05K2201/2036 , Y10T29/4913 , Y10T307/937
摘要： A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.
摘要翻译：提供紧凑型固态继电器（7）。固态设备（74,75），例如Triacs或Thyristors用于实现继电器功能。该装置至少部分地封装在具有用于安装在电子板上的销的壳体中。在壳体中设有多个“U”型跳线（72）或其它跳线或电线，以作为散热片。微型风扇（70）被定位成在散热器上方产生空气流并从设备散发热量。

62. 发明申请

US20140376174A1 ELECTRONIC ASSEMBLY WITH THERMAL CHANNEL AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：具有热通道的电子组件及其制造方法
公开(公告)号：US20140376174A1
公开(公告)日：2014-12-25
申请号：US13922136
申请日：2013-06-19
申请人： SMART Storage Systems, Inc.
发明人： David Lee Dean , Dennis Bennett , Robert W. Ellis
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G01R31/20 , G06F1/186 , H05K1/118 , H05K1/14 , H05K1/144 , H05K1/148 , H05K5/0026 , H05K7/20 , H05K2201/042 , H05K2201/058 , Y10T29/49002
摘要： An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.
摘要翻译：电子组件和制造方法包括：具有圆形轨道和气流接头的气流支架，气流支架电连接圆形轨道和气流接头; 连接到圆形导轨的顶板，用于电连接顶板和圆形导轨; 以及附接到圆形导轨的底板，用于电连接顶板和圆形导轨，底板被定位成在顶板和底板之间形成热通道，用于引导空气通过圆形导轨的通风口。

63. 发明授权

US08916963B2 Power module for an automobile 有权
标题翻译：汽车电源模块
公开(公告)号：US08916963B2
公开(公告)日：2014-12-23
申请号：US13498919
申请日：2010-10-07
申请人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
发明人： Jean-Michel Morelle , Ky Lim Tan , Laurent Vivet , Sandra Dimelli , Stéphane Thomelin , Hervé Lorin , Patrick Dubus
IPC分类号： H01L23/34 , H05K3/30 , H05K7/00 , H01L23/498 , H01L23/00 , H01L23/36 , H01L25/18 , H01L25/07 , H05K1/14 , H01L23/10 , H05K3/00
CPC分类号： H05K1/144 , H01L23/10 , H01L23/36 , H01L23/49833 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/72 , H01L24/73 , H01L25/074 , H01L25/18 , H01L2224/0231 , H01L2224/0233 , H01L2224/02335 , H01L2224/0401 , H01L2224/13099 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/732 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H05K3/0061 , H05K2201/042 , H05K2201/1053 , Y10T29/4913 , H01L2224/13 , H01L2224/72 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.
摘要翻译：本发明涉及一种优选用于车辆，特别是电动车辆的功率模块（10），其特征在于，所述模块包括两个垂直相邻的半导体芯片（12,14），每个芯片具有第一表面（20,22）连接到散热器基板（24,26），以及与第一表面分开并且在其上布置至少一个电子部件（38a-44b）的第二表面（28,30），该模块被布置成使得芯片的第二表面彼此相对布置。

64. 发明授权

US08851733B2 Light signal transmitter and light receiver for an optical sensor 有权
标题翻译：用于光学传感器的光信号发射器和光接收器
公开(公告)号：US08851733B2
公开(公告)日：2014-10-07
申请号：US13504987
申请日：2010-10-28
申请人： Frank Lahner , Thomas Völkel
发明人： Frank Lahner , Thomas Völkel
IPC分类号： F21V7/04 , H05K3/46 , G01V8/10 , H05K1/14 , H05K1/02
CPC分类号： G01V8/10 , H05K1/0274 , H05K1/144 , H05K3/4697 , H05K2201/042 , H05K2201/10106 , H05K2201/2054
摘要： A light signal transmitter and a light receiver for an optical sensor may be used for an industrial automation system. The light signal transmitter has a semiconductor-based light source for generating light. The semiconductor-based light source is disposed in an installation space between outer layers of a multi-layer circuit board. The light emission direction of the semiconductor-based light source is oriented substantially parallel to the layers of the printed circuit board. A deflection unit deflects the light emitted by the semiconductor-based light source in a direction substantially perpendicular to the layers of the printed circuit board. In the case of the light receiver, a light sensor is provided in place of the light source. Such optical sensors can be designed in a particularly flat and installation-friendly manner.
摘要翻译：用于光学传感器的光信号发射器和光接收器可以用于工业自动化系统。光信号发射器具有用于产生光的基于半导体的光源。基于半导体的光源设置在多层电路板的外层之间的安装空间中。基于半导体的光源的发光方向被取向为基本上平行于印刷电路板的层。偏转单元使基于半导体的光源发射的光在基本上垂直于印刷电路板的层的方向上偏转。在光接收器的情况下，提供光传感器来代替光源。这种光学传感器可以以特别平坦和安装友好的方式设计。

65. 发明申请

US20140198471A1 CONNECTING SYSTEM OF CIRCUIT BOARDS 审中-公开
标题翻译：电路板连接系统
公开(公告)号：US20140198471A1
公开(公告)日：2014-07-17
申请号：US14149864
申请日：2014-01-08
申请人： FUJITSU LIMITED
发明人： Naohiko Kajio , NAOFUMI KOSUGI , Yoshio Matsumoto
IPC分类号： H05K1/14
CPC分类号： H05K1/142 , H05K1/144 , H05K7/142 , H05K2201/0311 , H05K2201/042 , H05K2201/09827 , H05K2201/10189 , H05K2201/10409 , H05K2201/10568 , H05K2201/10803 , H05K2201/2036 , H05K2203/167
摘要： First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel. The first spacer is provided at one end part with a tapered part which fits with the first tapered hole and the second spacer is provided at one end part with a tapered part which fits with the second tapered hole. A spring is inserted between the two spacers. The first spacer is fit in the tapered hole and fastened by a screw to the first circuit board. The second circuit board is fastened by a screw to the first spacer in a state fitting the second tapered hole over the second spacer with the second circuit board approaching the first circuit board.
摘要翻译：第一和第二锥形孔设置在第一和第二电路板的相对位置处。包括第一和第二间隔件的弹性间隔件连接在它们之间以使两者平行连接，从而便于将两者附接到后面板。第一间隔件在一端部设置有与第一锥形孔配合的锥形部，第二间隔件在一端部设置有与第二锥形孔配合的锥形部。弹簧插入两个间隔件之间。第一间隔件装配在锥形孔中，并通过螺钉固定在第一电路板上。第二电路板通过螺钉固定在第一间隔件上，其状态是将第二锥形孔装配在第二间隔件上，而第二电路板接近第一电路板。

66. 发明申请

US20140187060A1 SUBSTRATE CONNECTION STRUCTURE 有权
标题翻译：基板连接结构
公开(公告)号：US20140187060A1
公开(公告)日：2014-07-03
申请号：US14165723
申请日：2014-01-28
申请人： OLYMPUS MEDICAL SYSTEMS CORP.
发明人： Takafumi KUBO
IPC分类号： H01R13/58 , H01R12/71
CPC分类号： H01R13/58 , A61B1/00124 , A61B1/04 , G02B23/24 , G02B23/2476 , H01R12/716 , H05K1/14 , H05K1/144 , H05K3/36 , H05K2201/042
摘要： A substrate connection structure includes: a first substrate having stiffness with a first connector mounted on a front face; a second substrate having stiffness with a second connector detachably attached to the first connector mounted on a front face facing the front face of the first substrate; and a restricting member including a projection portion, the restricting member including a plate-like member and being detachably attachable to the first substrate by being moved along a planar surface of the first substrate, the projection portion projecting from the front face of the first substrate and regulating a position of the second substrate relative to the first substrate in a state in which the restricting member is attached to the first substrate, and limiting a direction in which the second substrate is detached when the second connector mounted on the second substrate is detached from the first connector on the first substrate.
摘要翻译：基板连接结构包括：第一基板，具有刚性，第一连接器安装在前表面上; 具有刚度的第二基板，具有可拆卸地附接到安装在面向所述第一基板的前表面的正面上的所述第一连接器的第二连接器; 以及限制构件，其包括突出部，所述限制构件包括板状构件，并且通过沿着所述第一基板的平坦表面移动而可拆卸地附接到所述第一基板，所述突出部从所述第一基板的前表面突出以及在所述限制件附接到所述第一基板的状态下调节所述第二基板相对于所述第一基板的位置，并且当所述第二基板安装在所述第二基板上时，限制所述第二基板被拆卸的方向从第一基板上的第一连接器。

67. 发明授权

US08767409B2 Stacked substrate structure 有权
标题翻译：堆叠的基板结构
公开(公告)号：US08767409B2
公开(公告)日：2014-07-01
申请号：US13470301
申请日：2012-05-12
申请人： Tsung-Jung Cheng
发明人： Tsung-Jung Cheng
IPC分类号： H01R12/16
CPC分类号： H05K1/144 , H01L23/552 , H01L25/16 , H01L2924/0002 , H05K3/284 , H05K2201/042 , H05K2201/2018 , H05K2203/1316 , H01L2924/00
摘要： The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.
摘要翻译：本公开提供一种自密封堆叠结构，其包括基板单元，第一框架，导电单元和阻挡单元。基板单元包括第一和第二基板以及夹在其间的第一框架。导电单元包括多个第一导体和电连接第一基板，第一框架和第二基板的第二导体。第一和第二导体电连接。包括至少两个第一和至少两个第二阻塞器的阻塞单元分别围绕多个第一和第二导体周围布置。第一基板和第一框架通过由焊料组合的第一阻挡件以密封方式连接，其中第一框架和第二基板以密封方式连接通过由焊料组合的第二阻挡件。

68. 发明申请

US20140104799A1 3D STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： 3D堆叠式包装结构及其制造方法
公开(公告)号：US20140104799A1
公开(公告)日：2014-04-17
申请号：US13783161
申请日：2013-03-01
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. , UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
发明人： JENCHUN CHEN , HSIN CHIN CHANG
IPC分类号： H05K1/02
CPC分类号： H05K1/0284 , H01L21/565 , H01L23/3121 , H01L23/49811 , H01L23/5389 , H01L25/105 , H01L25/162 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2225/1076 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/144 , H05K3/284 , H05K2201/042 , H05K2201/2018 , H05K2203/1316 , H01L2924/00012
摘要： A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit.
摘要翻译： 3D堆叠封装结构包括第一单元，模制单元，导电单元和第二单元。第一单元包括第一基板和至少一个第一电子部件，并且第一基板具有至少一个流道和至少一个第一导电垫。模制单元包括顶部，框架和连接在顶部和框架之间的至少一个连接。导电单元包括至少一个穿过框架并且电连接到第一导电垫的导体。因此，第一单元可以通过模制单元的框架堆叠在第二单元上，并且第一单元可以通过导电单元的导体与第二单元电连接。

69. 发明申请

US20140063768A1 ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT INCORPORATED SUBSTRATE 有权
标题翻译：电子元件合并基板和制造电子元件合并基板的方法
公开(公告)号：US20140063768A1
公开(公告)日：2014-03-06
申请号：US13968620
申请日：2013-08-16
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Koichi Tanaka , Nobuyuki KURASHIMA , Hajime IIZUKA , Tetsuya KOYAMA
IPC分类号： H05K1/18 , H05K3/36
CPC分类号： H05K1/185 , H01L21/4846 , H01L21/563 , H01L23/3121 , H01L23/5385 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/97 , H01L2224/131 , H01L2224/13144 , H01L2224/16237 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/12042 , H01L2924/12044 , H01L2924/1533 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H05K1/186 , H05K3/36 , H05K2201/042 , H05K2201/10674 , Y10T29/49126 , H01L2224/16225 , H01L2924/00012 , H01L24/81 , H01L24/83 , H01L2924/00014 , H01L2924/014 , H01L2924/00 , H01L2224/83 , H01L2224/81
摘要： An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate.
摘要翻译：电子元件结合基板包括通过间隔单元彼此电连接的第一基板和第二基板。电子部件安装在第一基板上并且布置在第一基板和第二基板之间。第一封装树脂形成在第一基板和第二基板之间以封装电子部件。在第一封装树脂的第一表面上形成第二封装树脂以填充第一封装树脂和第二基板之间的空间。间隔单元包括沿第一基板和第二基板的堆叠方向堆叠的第一焊球，金属柱和第二焊球的堆叠结构。

70. 发明申请

US20140028161A1 MOTOR CONTROL UNIT AND BRUSHLESS MOTOR 有权
标题翻译：电机控制单元和无刷电机
公开(公告)号：US20140028161A1
公开(公告)日：2014-01-30
申请号：US13821872
申请日：2012-07-23
申请人： Yutaka Kamogi
发明人： Yutaka Kamogi
IPC分类号： H02K11/00 , H05K1/14
CPC分类号： H02K11/0073 , H01R12/523 , H01R12/712 , H02K5/225 , H02K11/33 , H02K29/08 , H02K2211/03 , H05K1/144 , H05K2201/042 , H05K2201/10166 , H05K2201/10295 , H05K2201/10303 , H05K2201/10356 , H05K2201/10424
摘要： A motor control unit includes two circuit boards accommodated in a board housing, and a connection holder placed on an outer face of the board housing. The connection holder includes external connection terminals and connection pins. Each one of the circuit boards is provided with multiple through-holes for receiving the connection pins, each of which is formed of an external connection pin and an internal connection pin. The connection holder and the circuit boards are placed such that the connection pins penetrate the through-holes of the circuit boards respectively.
摘要翻译：电机控制单元包括容纳在电路板壳体中的两个电路板和放置在电路板外壳的外表面上的连接保持架。连接支架包括外部连接端子和连接引脚。每个电路板设有多个用于接收连接销的通孔，每个连接销由外部连接销和内部连接销形成。连接支架和电路板被放置成使得连接销分别穿过电路板的通孔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式