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61. 发明申请

US20160095198A1 CIRCUIT BOARD INCLUDING HEAT DISSIPATION STRUCTURE 有权
标题翻译：电路板包括散热结构
公开(公告)号：US20160095198A1
公开(公告)日：2016-03-31
申请号：US14870741
申请日：2015-09-30
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Tae Hong MIN , Myung Sam KANG , Young Gwan KO , Min Jae SEONG
IPC分类号： H05K1/02 , H05K1/18 , H05K1/11
CPC分类号： H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/2518 , H01L2924/15311 , H05K1/0207 , H05K1/023 , H05K1/141 , H05K1/185 , H05K3/4608 , H05K2201/041
摘要： Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.
摘要翻译：这里公开了一种电路板。根据本公开的示例性实施例，电路板具有其中将金属层和绝缘层交替堆叠的第一传热结构的至少一部分插入到绝缘部分中的结构。

62. 发明申请

US20160064301A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20160064301A1
公开(公告)日：2016-03-03
申请号：US14784632
申请日：2014-04-11
申请人： Atsushi TOMOHIRO , PS4 LUXCO S.A.R.L.
发明人： Atsushi Tomohiro
IPC分类号： H01L23/367 , H01L23/31 , H05K1/18 , H05K1/11 , H01L25/10 , H01L23/498 , H05K1/02
CPC分类号： H01L23/3675 , H01L21/561 , H01L23/3107 , H01L23/3128 , H01L23/3677 , H01L23/49805 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/04042 , H01L2224/05554 , H01L2224/06135 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10161 , H01L2924/1436 , H01L2924/15182 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/0206 , H05K1/0209 , H05K1/111 , H05K1/114 , H05K1/181 , H05K2201/09781 , H05K2203/049 , H01L2224/83 , H01L2224/85 , H01L2224/16225 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： One semiconductor device includes a wiring board, a semiconductor chip, and an encapsulation body. The wiring board includes an insulating base, a conductive pattern that is formed on one surface of the insulating base, and a heat dissipation via that is connected to the conductive pattern. The heat dissipation via is provided so as to penetrate through the insulating base from one surface to the other surface, while being exposed from the lateral side of the insulating base. The semiconductor chip is mounted on the wiring board so as to overlap the conductive pattern. The encapsulation body is formed on the wiring board so as to cover the semiconductor chip.
摘要翻译：一个半导体器件包括布线板，半导体芯片和封装体。布线板包括绝缘基底，形成在绝缘基底的一个表面上的导电图案和连接到导电图案的散热通孔。散热通孔设置成从绝缘基体的侧面露出而从一个表面穿过绝缘基底到另一个表面。半导体芯片安装在布线板上以与导电图案重叠。封装体形成在布线板上以覆盖半导体芯片。

63. 发明申请

US20160037620A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20160037620A1
公开(公告)日：2016-02-04
申请号：US14668804
申请日：2015-03-25
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Myung Sam KANG , Young Gwan KO , Tae Hong MIN , Jung Han LEE
IPC分类号： H05K1/02 , H05K3/42 , H05K3/00 , H05K3/32 , H05K1/11 , H05K1/18
CPC分类号： H05K1/0204 , H01L23/3677 , H01L23/49827 , H05K1/0206 , H05K3/4602 , H05K2201/10416
摘要： There is provided a printed circuit board including: a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and a lower surface of the core layer; and a heat dissipating via penetrating through the insulating layer to be in contact with the heat radiation body and dissipating heat externally, wherein the heat radiation body includes an insulating plate, a first metal block formed on an upper surface of the insulating plate, and a second metal block formed on a lower surface of the insulating plate.
摘要翻译：提供了一种印刷电路板，包括：其中形成有腔的芯层; 包括在腔中的散热体; 设置在所述芯层的上表面和下表面上的绝缘层; 以及通过贯穿所述绝缘层与所述散热体接触并从外部散热的散热部，其中所述散热体包括绝缘板，形成在所述绝缘板的上表面上的第一金属块，以及第二金属块形成在绝缘板的下表面上。

64. 发明申请

US20160014879A1 A PRINTED CIRCUIT BOARD (PCB) STRUCTURE 审中-公开
标题翻译：印刷电路板（PCB）结构
公开(公告)号：US20160014879A1
公开(公告)日：2016-01-14
申请号：US14769301
申请日：2013-11-18
申请人： HANGZHOU H3C TECHNOLOGIES CO., LTD.
发明人： Yi LI
IPC分类号： H05K1/02 , H05K1/18 , H05K1/11
CPC分类号： H05K1/0206 , H05K1/0209 , H05K1/115 , H05K1/18 , H05K2201/09036 , H05K2201/10189
摘要： According to an example, a printed circuit board (PCB) structure may include a substrate having a first surface and a second surface. The PCB structure may also include a heat radiating groove formed on the first surface of the substrate.
摘要翻译：根据示例，印刷电路板（PCB）结构可以包括具有第一表面和第二表面的基板。 PCB结构还可以包括形成在基板的第一表面上的散热槽。

65. 发明申请

US20160007468A1 CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电路基板及其制造方法
公开(公告)号：US20160007468A1
公开(公告)日：2016-01-07
申请号：US14791735
申请日：2015-07-06
申请人： IBIDEN CO., LTD.
发明人： Mitsuhiro TOMIKAWA , Koji ASANO
IPC分类号： H05K1/18 , H05K3/40 , H05K3/00 , H05K1/11
CPC分类号： H05K1/183 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H05K1/0204 , H05K1/0206 , H05K1/115 , H05K3/0014 , H05K3/4046 , H05K3/4084 , H05K3/4602 , H05K3/4697 , H05K2201/10416 , H01L2924/00012 , H01L2924/00014
摘要： A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat.
摘要翻译：电路基板包括具有空腔的芯基板，空腔中的金属块，第一和第二堆积层包括绝缘层，并且层叠在芯基板的第一和第二侧上，使得绝缘层覆盖空腔，并且填充空腔中的空腔和金属块之间形成树脂填充间隙。空腔穿透芯基板，芯基板具有从空腔的一个或多个侧表面突出的腔内投影结构，使得突出结构位于金属块之间并且分离金属块以在空腔中彼此接触第一累积层具有连接到金属块的第一导体，使得每个第一导体传导电或热，并且第二堆积层具有连接到金属块的第二导体，使得每个第二导体导电或加热。

66. 发明授权

US09226383B2 Group III nitride based flip-chip integrated circuit and method for fabricating 有权
标题翻译： III族氮化物倒装芯片集成电路及其制造方法
公开(公告)号：US09226383B2
公开(公告)日：2015-12-29
申请号：US14338686
申请日：2014-07-23
申请人： CREE, INC.
发明人： Umesh Mishra , Primit Parikh , Yifeng Wu
IPC分类号： H01L29/00 , H01L23/34 , H01L23/48 , H05K1/02 , H01L21/8252 , H01L23/66 , H01L27/06 , H05K1/18 , H01L23/14 , H01L23/367 , H01L29/20 , H01L29/778
CPC分类号： H05K1/0206 , H01L21/8252 , H01L23/147 , H01L23/367 , H01L23/3677 , H01L23/66 , H01L27/0605 , H01L29/2003 , H01L29/7787 , H01L2224/16235 , H01L2224/16238 , H01L2224/1703 , H01L2224/73253 , H01L2924/01002 , H01L2924/01004 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10329 , H01L2924/12032 , H01L2924/14 , H01L2924/1423 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/30105 , H05K1/181 , H05K2201/066 , Y10T29/4913 , H01L2924/0002 , H01L2924/00
摘要： A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device.
摘要翻译：电路基板在第一表面上具有一个或多个有源部件和多个无源电路元件。有源半导体器件具有材料层和多个端子的衬底。有源半导体器件被倒装芯片安装在电路基板上，并且器件的至少一个端子与电路基板上的有源元件电连接。基板上的有源元件和安装有倒装芯片的有源半导体器件与无源电路元件组合形成前置放大器和输出放大器。在电源开关配置中，电路基板在第一表面上具有逻辑控制电路。安装在电路基板上的半导体晶体管倒装芯片电连接到第一表面上的控制电路，从而控制倒装芯片安装器件的接通和断开。

67. 发明授权

US09209106B2 Thermal management circuit board for stacked semiconductor chip device 有权
标题翻译：用于堆叠半导体芯片器件的热管理电路板
公开(公告)号：US09209106B2
公开(公告)日：2015-12-08
申请号：US13529720
申请日：2012-06-21
申请人： Xiao Ling Shi , Suming Hu , Liane Martinez , Roden Topacio , Terence Cheung
发明人： Xiao Ling Shi , Suming Hu , Liane Martinez , Roden Topacio , Terence Cheung
IPC分类号： H05K7/20 , H01L23/367 , H01L23/498 , H05K1/02 , H05K3/34
CPC分类号： H01L23/3677 , H01L23/49833 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/15311 , H05K1/0206 , H05K3/3436 , H05K2201/10416 , Y10T29/49139
摘要： A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side.
摘要翻译：提供了组装半导体芯片器件的方法。该方法包括提供具有多个导热通孔的第一电路板。第二电路板安装在第一电路板上并与导热通孔热接触。第二电路板包括面向第一电路板的第一面和第二相对侧。

68. 发明申请

US20150351219A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20150351219A1
公开(公告)日：2015-12-03
申请号：US14811825
申请日：2015-07-28
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Chang Gun Oh , Tae Kyun Bae , Ho Sik Park
IPC分类号： H05K1/02 , H05K3/46 , H05K3/18 , H05K1/11
CPC分类号： H05K1/0206 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K3/0094 , H05K3/181 , H05K3/205 , H05K3/4608 , H05K3/4644 , H05K2201/09563 , H05K2201/096 , H05K2201/09727 , H05K2201/10674 , H05K2203/1476 , Y10T29/49156 , H01L2924/00014
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for heat radiation formed therein and having circuit layers formed on both surfaces thereof, the circuit layers including connection pads; a signal via formed in an inner portion of the via hole for signal transfer by performing a plating process using a conductive metal; and a heat radiation via formed in an inner portion of the via hole for heat radiation by performing a plating process using a conductive metal, wherein the heat radiation via is formed to have a diameter larger than that of the signal via.
摘要翻译：这里公开了一种印刷电路板及其制造方法。印刷电路板包括：具有用于信号传送的通孔的基底基板和形成在其中的热辐射通孔，并且在其两个表面上形成电路层，电路层包括连接焊盘; 通过使用导电金属进行电镀处理而形成在用于信号传送的通孔的内部的信号通孔; 以及通过使用导电金属进行电镀处理而形成在用于散热的通孔的内部的散热通路，其中，所述散热通孔的直径大于所述信号通路的直径。

69. 发明申请

US20150351218A1 COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND MOUNTING BODY 审中-公开
标题翻译：组件内置板及其制造方法及安装体
公开(公告)号：US20150351218A1
公开(公告)日：2015-12-03
申请号：US14685924
申请日：2015-04-14
申请人： FUJIKURA LTD.
发明人： Koji Munakata
IPC分类号： H05K1/02 , H05K1/18 , H05K3/46
CPC分类号： H05K1/0206 , H01L23/49811 , H01L23/5385 , H01L23/5389 , H01L25/0657 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/2518 , H01L2224/81815 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1094 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/1533 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H05K1/0207 , H05K1/186 , H05K3/4623 , H05K2203/063 , Y10T29/49128
摘要： A component built-in board comprises a multi-layer structure comprising a plurality of unit boards stacked therein a plurality of electronic components built in thereto in a stacking direction, the plurality of electronic components include a first electronic component, and the plurality of unit boards including: a first board having a first insulating layer and comprising an opening in which the first electronic component is housed; and an intermediate board adjacent to the first board and comprising: a second insulating layer; a first wiring layer formed on a surface on a side of the first board of the second insulating layer; a first adhesive layer provided on at least the side of the first board of the second insulating layer; and a first thermal via that penetrates the first adhesive layer above the first wiring layer and is connected to the first wiring layer, and the first wiring layer of the intermediate board being connected to the first electronic component via the first thermal via.
摘要翻译：组件内置板包括多层结构，其包括多个单元板，堆叠在堆叠方向上的多个电子部件，多个电子部件包括第一电子部件和多个单元板包括：第一板，其具有第一绝缘层，并且包括容纳所述第一电子部件的开口; 以及与所述第一板相邻的中间板，包括：第二绝缘层; 第一布线层，形成在所述第二绝缘层的所述第一基板的一侧的表面上; 设置在所述第二绝缘层的所述第一基板的至少一侧的第一粘合层; 以及第一热通孔，其穿过第一布线层上方的第一粘合剂层并连接到第一布线层，并且中间板的第一布线层经由第一热通孔连接到第一电子部件。

70. 发明授权

US09203008B2 Multilayered LED printed circuit board 有权
标题翻译：多层LED印刷电路板
公开(公告)号：US09203008B2
公开(公告)日：2015-12-01
申请号：US14017351
申请日：2013-09-04
申请人： OSRAM GmbH
发明人： Thomas Preuschl
IPC分类号： H01L33/64 , H05K1/02 , H05K1/18
CPC分类号： H01L33/641 , H01L25/167 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/185 , H05K2201/0187 , H05K2201/10106 , H01L2924/00
摘要： A multilayered LED printed circuit board with electrically insulating layers includes at least one electrically insulating material and electrically conductive layers consisting of an electrically conductive material, wherein at least one of the electrically conductive layers is structured with a conductor track structure, wherein the at least one structured electrically conductive layer is arranged on an upper side of the LED printed circuit board, and wherein a plurality of LEDs is arranged on the at least one structured electrically conductive layer on the upper side. The LED printed circuit board further includes: a thermally conducting element, and thermal paths comprising an electrically conductive material, which are arranged, in each case in contact-making fashion, between the LEDs and the thermally conducting element.
摘要翻译：具有电绝缘层的多层LED印刷电路板包括至少一个电绝缘材料和由导电材料组成的导电层，其中至少一个导电层由导体轨道结构构成，其中至少一个结构化导电层设置在LED印刷电路板的上侧，并且其中多个LED布置在上侧的至少一个结构化导电层上。 LED印刷电路板还包括：导热元件，以及包括导电材料的热路径，其以接触方式在LED和导热元件之间以接触方式布置。

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