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61. 发明申请

US20150181690A1 HEAT DISSIPATION PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：散热印刷电路板及其制造方法
公开(公告)号：US20150181690A1
公开(公告)日：2015-06-25
申请号：US14516487
申请日：2014-10-16
申请人： HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION , YURA CORPORATION CO., LTD.
发明人： Mun Jong KIM , Kwan Bum LEE , Jin Su YEOM
IPC分类号： H05K1/02 , H05K1/09 , H05K3/44 , H05K3/46 , H05K3/00 , H05K3/06
CPC分类号： H05K1/0201 , H05K1/0206 , H05K1/09 , H05K3/0097 , H05K3/06 , H05K3/067 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K2201/0338 , H05K2201/09045 , H05K2203/0278 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
摘要： A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.
摘要翻译：散热印刷电路板包括金属芯，下绝缘层和上绝缘层，第一下电极图案和第一上电路图案以及第二下电路图案和第二上电路图案。下绝缘层和上绝缘层分别设置在金属芯的下侧和上侧。第一下电极和第一上电路图案分别设置在下绝缘层的下侧和上绝缘层的上侧。第二下电路图案和第二上电路图案分别设置在第一下电路图案的下侧和第一上电路图案的上侧。第一下部电路图案中的蚀刻部分填充有下部绝缘层，并且第一上部电路图案中的蚀刻部分填充有上部绝缘层。

62. 发明授权

US09066446B1 Thermal extraction architecture for camera heads, inspection systems, and other devices and systems 有权
标题翻译：相机头，检测系统和其他设备和系统的热提取架构
公开(公告)号：US09066446B1
公开(公告)日：2015-06-23
申请号：US13775066
申请日：2013-02-22
申请人： Mark S. Olsson , Eric M. Chapman , Nicolas A. Smith
发明人： Mark S. Olsson , Eric M. Chapman , Nicolas A. Smith
IPC分类号： H04N5/225 , H05K7/20 , H01L27/146 , H05K1/02
CPC分类号： H04N5/2252 , H04N5/2256 , H04N5/2257 , H04N5/23203 , H04N2005/2255 , H05K1/0201 , H05K1/0207 , H05K1/0209 , H05K2201/09027 , H05K2201/10151
摘要： Thermal extraction architectures for heat-generating electronic devices such as cameras or lights are disclosed. An electronic device such as a camera head may include a housing, a printed circuit board (PCB) within the housing, and a thermal extraction element positioned between the housing and PCB to transfer heat from the PCB to the housing and external environment.
摘要翻译：公开了用于发热电子装置如照相机或灯的热提取结构。诸如相机头的电子设备可以包括壳体，壳体内的印刷电路板（PCB），以及定位在壳体和PCB之间的热提取元件，以将热量从PCB传递到壳体和外部环境。

63. 发明授权

US09054101B2 Multi-dimensional integrated circuit structures and methods of forming the same 有权
标题翻译：多维集成电路结构及其形成方法
公开(公告)号：US09054101B2
公开(公告)日：2015-06-09
申请号：US14169799
申请日：2014-01-31
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Mark Semmelmeyer , Sandeep Kumar Goel
IPC分类号： H01L21/44 , H01L25/00 , H01L25/065 , H01L23/31 , H01L21/56 , H01L21/66 , H01L23/00 , H01L23/538
CPC分类号： H05K1/0201 , H01L21/561 , H01L22/22 , H01L23/3128 , H01L23/5384 , H01L23/5385 , H01L24/14 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05009 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16225 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73207 , H01L2224/73257 , H01L2224/81005 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , H01L2924/12042 , H01L2924/1461 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H05K1/11 , H05K1/144 , H05K3/46 , H05K2201/10734 , Y10T29/49124 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/45099
摘要： An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die.
摘要翻译：实施例是一种方法，包括使用耦合到第一管芯和第二管芯的相应第一表面的相应的第一导电连接器将第一管芯和第二管芯附接到第一插入件的第一表面; 使用相应的第二导电连接器将第三管芯和第四管芯附接到第一插入件的第二表面，第一插入件的第二表面与插入件的第一表面相对; 以及使用耦合到所述第一管芯和所述第二管芯的相应第二表面的相应的第三导电连接器将所述第一管芯和所述第二管芯附接到衬底。

64. 发明申请

US20150075200A1 BOILING REFRIGERANT TYPE COOLING SYSTEM 有权
标题翻译：锅炉制冷式冷却系统
公开(公告)号：US20150075200A1
公开(公告)日：2015-03-19
申请号：US14551499
申请日：2014-11-24
申请人： HITACHI, LTD.
发明人： Kazuaki SUZUKI , Shigemasa SATO , Akio IDEI
IPC分类号： H05K1/02 , F25B39/04 , H05K7/20
CPC分类号： H05K1/0201 , F25B39/04 , F28D15/0266 , F28D15/046 , F28F13/187 , H01L23/427 , H01L2924/0002 , H05K7/20318 , H01L2924/00
摘要： A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.
摘要翻译：沸腾的制冷剂型冷却系统，在发热开始时抑制过冲，实现稳定的沸腾开始。在沸腾制冷剂型冷却系统中，金属沸腾传热单元具有与发热体热接触的基部。沸腾传热单元与液体制冷剂接触。沸腾传热单元具有多个平行的隧道，其与其外表面上的通孔或间隙连通，比通过所有隧道在与隧道正交的方向上形成的隧道直径更深的沟槽以及沟槽上的盖板。

65. 发明授权

US08955983B2 Thermal management for handheld projectors 有权
标题翻译：手持投影机的热管理
公开(公告)号：US08955983B2
公开(公告)日：2015-02-17
申请号：US13581006
申请日：2011-02-28
申请人： Bradley E. Reis , Robert A. Reynolds, III , Yin Xiong , Greg P. Kramer , Robert J. Umpleby
发明人： Bradley E. Reis , Robert A. Reynolds, III , Yin Xiong , Greg P. Kramer , Robert J. Umpleby
IPC分类号： G03B21/16 , H05K7/20 , H01L23/34 , F21V29/00 , H05K1/02 , H04N9/31
CPC分类号： G03B21/16 , F21V29/00 , F21V29/85 , F21V29/86 , F21V29/89 , H04N9/31 , H04N9/3144 , H05K1/02 , H05K1/0201 , H05K1/0203 , H05K7/20445
摘要： A handheld device (10), including a projector module (20) which includes a light source having a laser or at least one light emitting diode; a thermal management system which includes a heat collector (30) formed of a material having a thermo-mechanical design constant of at least 10 mm-W/m*K and having a non-planar shape, the heat collector in thermal contact with the light source; a heat spreader (40) having a surface area at least 1.5 times that of the surface area of the heat collector and a thermo-mechanical design constant of at least 10 mm-W/m*K, the heat spreader positioned in thermal contact with the heat collector, wherein thermo-mechanical design constant of a material is defined by thermal conductivity of the material multiplied by its average thickness.
摘要翻译：一种手持式设备（10），包括投影仪模块（20），其包括具有激光或至少一个发光二极管的光源; 一种热管理系统，其包括由具有至少10mm-W / m×K的热机械设计常数且具有非平面形状的材料形成的集热器（30），所述集热器与所述热收集器光源; 具有至少1.5倍于热收集器表面面积的表面积的散热器（40）和热机械设计常数至少为10mm-W / m×K，散热器定位成与热收集器，其中材料的热机械设计常数由材料的热导率乘以其平均厚度限定。

66. 发明授权

US08929073B2 Boiling refrigerant type cooling system 有权
标题翻译：沸腾制冷剂型冷却系统
公开(公告)号：US08929073B2
公开(公告)日：2015-01-06
申请号：US13494461
申请日：2012-06-12
申请人： Kazuaki Suzuki , Shigemasa Sato , Akio Idei
发明人： Kazuaki Suzuki , Shigemasa Sato , Akio Idei
IPC分类号： H05K7/20 , H01L23/427
CPC分类号： H05K1/0201 , F25B39/04 , F28D15/0266 , F28D15/046 , F28F13/187 , H01L23/427 , H01L2924/0002 , H05K7/20318 , H01L2924/00
摘要： A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.
摘要翻译：沸腾的制冷剂型冷却系统，在发热开始时抑制过冲，实现稳定的沸腾开始。在沸腾制冷剂型冷却系统中，金属沸腾传热单元具有与发热体热接触的基部。沸腾传热单元与液体制冷剂接触。沸腾传热单元具有多个平行的隧道，其与其外表面上的通孔或间隙连通，比通过所有隧道在与隧道正交的方向上形成的隧道直径更深的沟槽以及沟槽上的盖板。

67. 发明授权

US08895863B2 Multilayer printed circuit board 有权
标题翻译：多层印刷电路板
公开(公告)号：US08895863B2
公开(公告)日：2014-11-25
申请号：US13726827
申请日：2012-12-26
申请人： Denso Corporation
发明人： Masashi Inaba , Akito Itou
IPC分类号： H05K1/00 , H05K1/16 , H05K1/11 , H05K1/18 , H05K1/02
CPC分类号： H05K1/0201 , H05K1/0206 , H05K1/0207 , H05K2201/10166 , H05K2201/10969
摘要： A multilayer printed circuit board includes an insulating substrate, circuit layers arranged in the insulating substrate, an electronic component, an electrode disposed on the circuit layer exposed from a surface of the insulating substrate and including a soldered portion at which a terminal of the electronic component is soldered, an internal layer conductor disposed on the circuit layer located inside the insulating substrate and defining through holes in a radial manner centering on the soldered portion, a heat releasing conductor disposed on the circuit layer next to the circuit layer on which the internal layer conductor is disposed, and connection vias inserted in the through holes and coupling the electrode and the heat releasing conductor so as to enable a heat transfer between the electrode and the heat releasing conductor. The internal layer conductor and the heat releasing conductor overlap a whole area of the soldered portion.
摘要翻译：多层印刷电路板包括绝缘基板，布置在绝缘基板中的电路层，电子部件，设置在从绝缘基板的表面露出的电路层上的电极，并且包括焊接部分，电极部件的端子焊接，设置在位于绝缘基板内部的电路层上的内部层导体，以以焊接部分为中心的径向方式限定通孔;布置在电路层旁边的放热导体，其中内层布置导体，并且连接通孔插入到通孔中并联接电极和散热导体，以便能够在电极和放热导体之间传热。内层导体和散热导体与焊接部分的整个区域重叠。

68. 发明授权

US08859907B2 Method for assembling a circuit board 有权
标题翻译：组装电路板的方法
公开(公告)号：US08859907B2
公开(公告)日：2014-10-14
申请号：US13599984
申请日：2012-08-30
申请人： Jan Hendrik Berkel
发明人： Jan Hendrik Berkel
IPC分类号： H05K1/02 , F28F21/00 , H05K3/30 , H01L23/367 , H01L23/36 , H05K3/00 , H01L23/00 , H01L25/065
CPC分类号： H05K1/0201 , F28F21/00 , H01L23/36 , H01L23/3677 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/2919 , H01L2224/32245 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H05K1/0204 , H05K1/021 , H05K3/0061 , H05K3/30 , H05K2201/068 , H05K2201/09745 , H05K2201/10416 , H05K2201/1059 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step.
摘要翻译：本文公开了一种用于组装电路板的方法，该电路板在一个或两个侧面上具有至少一层铜包层或设置有导体轨道，其中在一个组装步骤中，至少一个刚性凸缘插入件插入到相关联的凹部中电路板或与电路板相关联的部件，并且其中半导体部件的至少一个半导体管芯在随后的施加步骤中被施加到插入的法兰插入件上。

69. 发明申请

US20140251659A1 CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD 审中-公开
标题翻译：电路板和电路板的制造方法
公开(公告)号：US20140251659A1
公开(公告)日：2014-09-11
申请号：US14129408
申请日：2012-07-02
申请人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Hiroaki Asano , Yasuhiro Koike , Kiminori Ozaki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H05K1/11 , H05K3/30 , H05K1/09 , H05K3/00 , H05K1/02 , H05K1/18
CPC分类号： H05K1/115 , H05K1/0201 , H05K1/0272 , H05K1/09 , H05K1/185 , H05K3/0058 , H05K3/0061 , H05K3/30 , H05K3/341 , H05K3/38 , H05K3/4038 , H05K2201/0305 , H05K2201/09063 , H05K2201/0969 , H05K2203/1178 , Y10T29/4913
摘要： A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole.
摘要翻译：安装有电子部件的电路板设置有绝缘芯基板和图案化的金属板。金属板结合到绝缘芯基板的至少一侧。绝缘芯基板和金属板形成层压体，其中设有排气孔。排气孔形成为使得当安装电子部件时，存在于绝缘芯基板和金属板之间的气体膨胀并且经由排气孔被释放到大气开放的一侧。

70. 发明申请

US20140226283A1 Isolation Of Thermal Ground For Multiple Heat-Generating Devices On A Substrate 审中-公开
标题翻译：在基板上分离多个发热装置的热地面
公开(公告)号：US20140226283A1
公开(公告)日：2014-08-14
申请号：US13928380
申请日：2013-06-27
申请人： Gerald Ho Kim , Jay Eunjae Kim
发明人： Gerald Ho Kim , Jay Eunjae Kim
IPC分类号： H05K1/02
CPC分类号： H05K1/0201 , H05K1/0206 , H05K1/0207 , H05K2201/062 , H05K2201/066 , H05K2201/09663
摘要： Embodiments of a mechanism of thermal isolation for multiple heat-generating devices on a substrate are described. In one aspect, a substrate is configured for a plurality of heat-generating devices to be disposed thereon. The substrate comprises an electrically-conductive layer that is electrically coupled to the heat-generating devices when the heat-generating devices are disposed on the substrate. The electrically-conductive layer is configured to thermally isolate the heat-generating devices such that there is no thermal coupling through the electrically-conductive layer amongst the heat-generating devices.
摘要翻译：对衬底上的多个发热装置的热隔离机理的实施例进行了说明。在一个方面，衬底被配置用于要放置在其上的多个发热装置。衬底包括当发热器件设置在衬底上时电耦合到发热器件的导电层。导电层被配置为热分离发热器件，使得在发热器件中不存在通过导电层的热耦合。

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