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61. 发明申请

US20150330856A1 PRESSURE SENSOR DEVICE WITH HIGH SENSITIVITY AND HIGH ACCURACY 有权
标题翻译：具有高灵敏度和高精度的压力传感器装置
公开(公告)号：US20150330856A1
公开(公告)日：2015-11-19
申请号：US14704012
申请日：2015-05-05
申请人： Continental Automotive Systems, Inc.
发明人： Jen-Huang Albert Chiou , Shiuh-Hui Steven Chen
IPC分类号： G01L9/00 , H01L41/113 , H01L41/312 , H01L41/332 , H01L41/23
CPC分类号： G01L9/0054 , B81B3/00 , B81B7/02 , B81C1/00 , G01L9/0042 , G01L9/0047 , G01L9/0052 , H01L41/1132 , H01L41/23 , H01L41/312 , H01L41/332
摘要： The voltages output from a low-pressure MEMS sensor are increased by increasing the sensitivity of the sensor. Sensitivity is increased by thinning the diaphragm of the low pressure sensor device with corner trench. Nonlinearity increased by thinning the diaphragm is reduced by simultaneously creating a cross stiffener to the bottom side of the diaphragm. A rim, anchors, and a stiffener pad can also be added to further stiffen the thinner diaphragm and further reduce pressure nonlinearity.
摘要翻译：通过提高传感器的灵敏度，可以提高从低压MEMS传感器输出的电压。通过用角沟槽减薄低压传感器装置的隔膜来增加灵敏度。通过同时在隔膜的底侧产生交叉加强筋来减小隔膜增加的非线性增加。还可以添加边缘，锚固件和加强垫，以进一步加固较薄的隔膜并进一步降低压力非线性。

62. 发明申请

US20150325780A1 MEMS Component and Method for Encapsulating MEMS Components 有权
标题翻译： MEMS组件和封装MEMS组件的方法
公开(公告)号：US20150325780A1
公开(公告)日：2015-11-12
申请号：US14650538
申请日：2013-10-14
申请人： EPCOS AG
发明人： Hans Krüger , Alois Stelzl , Christian Bauer , Jürgen Portmann , Wolfgang Pahl
IPC分类号： H01L41/23 , H01L41/293 , H01L41/053 , H01L41/27 , H01L41/113 , H01L41/083
CPC分类号： H01L41/23 , B81B7/007 , B81B2207/095 , H01L24/97 , H01L41/053 , H01L41/083 , H01L41/1132 , H01L41/27 , H01L41/293 , H01L2224/11 , H01L2224/16225
摘要： A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
摘要翻译： MEMS部件在基板上包括部件结构，连接到部件结构的接触区域，安置在接触区域上的金属柱结构以及围绕部件结构的金属框架结构。固化的抗蚀剂层位于框架结构和柱结构上，使得空腔被封装在基板，框架结构和抗蚀剂层之间。直接在抗蚀剂层上或位于抗蚀剂层上的载体层上提供结构化的金属化。结构化金属化包括至少该部件的外部触点并且与导电连接的金属结构和部件结构的接触区域。

63. 发明授权

US09116057B2 Integrated reference vacuum pressure sensor with atomic layer deposition coated input port 有权
标题翻译：具有原子层沉积涂层输入端口的集成参考真空压力传感器
公开(公告)号：US09116057B2
公开(公告)日：2015-08-25
申请号：US13778445
申请日：2013-02-27
申请人： Honeywell International Inc.
发明人： Gregory C. Brown
IPC分类号： G01L7/00 , G01L9/00 , G01L19/14 , G01L19/06
CPC分类号： G01L19/0654 , G01L9/0033 , G01L9/0055 , G01L19/145 , H01L41/23 , H01L41/293 , H01L41/311 , H01L41/313
摘要： An integrated reference vacuum pressure sensor with an atomic layer deposition (ALD) coated input port comprises a housing with an port for a media to enter the housing; a substrate and stress isolation member in the housing; wherein a channel extends through the substrate and the stress isolation member, wherein a trace is embedded within the stress isolation member, wherein stress isolation member and substrate surfaces exposed to the channel are coated with an ALD; a sensor die bonded to the stress isolation member, the sensor die comprising a diaphragm having circuitry, wherein a side of the diaphragm is exposed to the channel and the circuitry is mounted to another side of the diaphragm; a via extending through the sensing die electrically connecting the circuitry to the trace; and a cover bonded to the stress isolation member, the cover having a recess, the sensor die in the recess.
摘要翻译：具有原子层沉积（ALD）涂覆输入端口的集成参考真空压力传感器包括具有用于介质进入壳体的端口的壳体; 壳体中的衬底和应力隔离构件; 其中通道延伸穿过所述基板和所述应力隔离构件，其中迹线嵌入所述应力隔离构件内，其中暴露于所述通道的应力隔离构件和基板表面涂覆有ALD; 传感器芯片，其结合到所述应力隔离构件，所述传感器管芯包括具有电路的隔膜，其中所述隔膜的一侧暴露于所述通道，并且所述电路安装到所述隔膜的另一侧; 通过所述感测芯片延伸的通孔将所述电路电连接到所述迹线; 以及与所述应力隔离构件接合的盖，所述盖具有凹部，所述传感器模具位于所述凹部中。

64. 发明申请

US20150137664A1 PIEZOELECTRIC ACTUATOR ARRAY 有权
标题翻译：压电致动器阵列
公开(公告)号：US20150137664A1
公开(公告)日：2015-05-21
申请号：US14531475
申请日：2014-11-03
申请人： Océ-Technologies B.V.
发明人： Johannes L.M. CARIS , Johannes T.M. HERMANS , Robert N.J. JACOBS , Peter J.M. JANSSEN
IPC分类号： H01L41/09 , H01L41/23 , H01L41/31 , H01L41/047 , B41J2/14
CPC分类号： H01L41/09 , B41J2/14209 , B41J2/14233 , B41J2/14274 , B41J2/1609 , B41J2/1623 , B41J2/1632 , B41J2002/14217 , B41J2002/14491 , H01L41/047 , H01L41/0475 , H01L41/083 , H01L41/23 , H01L41/31 , H01L41/313 , Y10T29/42
摘要： A piezoelectric actuator array comprising a substrate plate (10) with a number of signal leads (14) and at least one common lead (18) formed on at least one surface (12) thereof, and a number of piezoelectric bodies (30, 32) arranged in a row (34) on one surface (12) of the substrate plate and formed by dividing a common piezoelectric block, said piezoelectric bodies comprising a number of active bodies (30) each of which has, on a first side of said row (34), a signal electrode (38) in contact with one of said signal leads (14) and, on an opposite second side of the row, a common electrode (40) in contact with said common lead (18), said substrate plate (10) having at least one connector lead (16) disposed on the first side of the row (34) and electrically connected to the common lead (18) on the second side of the row, wherein said piezoelectric bodies comprise at least one piezoelectric body (32) with a conductive outer surface layer (42) that establishes an electrically conductive path from the connector lead (16) to the common lead (18).
摘要翻译：一种压电致动器阵列，包括具有多个信号引线（14）的衬底板（10）和形成在其至少一个表面（12）上的至少一个公共引线（18），以及多个压电体（30,32）），其被布置在所述基板的一个表面（12）上并通过划分公共压电块而形成，所述压电体包括多个活性体（30），所述多个活性体（30）在所述第一侧上具有行（34），与所述信号引线（14）中的一个接触的信号电极（38），并且在所述行的相对的第二侧上具有与所述公共引线（18）接触的公共电极（40），所述公共电极衬底板（10），其具有设置在所述排（34）的第一侧上的至少一个连接器引线（16）并且电连接到所述行的第二侧上的公共引线（18），其中所述压电体至少包括一个具有导电外表面层（42）的压电体（32），其形成导电的从连接器引线（16）到公共引线（18）的路径。

65. 发明申请

US20150050514A1 COATING METHOD, SURFACE LAYER STRUCTURE, AS WELL AS APPLICATIONS 有权
标题翻译：涂层方法，表面层结构，以及应用
公开(公告)号：US20150050514A1
公开(公告)日：2015-02-19
申请号：US14388708
申请日：2013-03-12
申请人： Airbus Defence and Space GmbH
发明人： Stefan Storm , Erhard Brandl , Dominik Raps
IPC分类号： H01L41/331 , H01L41/333 , B29C43/20 , H01L41/053
CPC分类号： H01L41/331 , B29C43/203 , B29L2009/005 , B32B15/01 , C21D10/005 , C23C4/01 , C23C4/06 , C23C14/024 , C23C14/028 , C23C14/14 , C23C24/04 , H01L41/0533 , H01L41/083 , H01L41/23 , H01L41/333 , Y10T428/12389 , Y10T428/24521 , Y10T428/24545
摘要： A coating method for producing a function layer on mechanically loaded components or surfaces includes providing or applying a first material layer of a first material or substrate matrix having a mechanical flexibility higher than that of a second material on a substrate constituting the component or the surface, respectively, structuring the first material layer such that the material layer surface of the first material layer, which is opposite to the substrate, obtains a three-dimensionally moulded basic structure with projections and recesses, and coating the material layer surface of the first material layer with a second material layer of the second material in such a way that the second material layer adopts substantially the basic structure of the material layer surface with the projections and recesses. Also, surface layer structures can be produced by this method.
摘要翻译：用于在机械加载的部件或表面上产生功能层的涂覆方法包括在构成部件或表面的基材上提供或施加具有比第二材料的机械柔性更高的机械柔性的第一材料或基底基质的第一材料层，分别构造第一材料层，使得与基板相对的第一材料层的材料层表面获得具有凸起和凹陷的三维模制基本结构，并且涂覆第一材料层的材料层表面与第二材料的第二材料层以这样的方式使得第二材料层基本上采用具有突起和凹陷的材料层表面的基本结构。此外，可以通过该方法制造表面层结构。

66. 发明申请

US20150035412A1 Piezo-Stack with Passivation, and a Method for the Passivation of a Piezo-Stack 有权
标题翻译：具有钝化的压电堆叠和压电叠层的钝化方法
公开(公告)号：US20150035412A1
公开(公告)日：2015-02-05
申请号：US14369377
申请日：2012-12-19
申请人： Continental Automotive GmbH
发明人： Thomas Richter , Harald Johannes Kastl , Claus Zumstrull
IPC分类号： H01L41/083 , H01L41/277 , H01L41/053 , H01L41/338 , H01L41/23
CPC分类号： H01L41/083 , H01L41/053 , H01L41/0533 , H01L41/23 , H01L41/277 , H01L41/338 , Y10T29/42
摘要： A piezo-stack includes a plurality of lateral surfaces and a first passivation layer applied to a first lateral surface. The first passivation layer terminates flush with opposing lateral surfaces that adjoin the first lateral surface.
摘要翻译：压电堆叠包括多个侧表面和施加到第一侧表面的第一钝化层。第一钝化层终止于与第一侧表面相邻的相对的侧表面平齐。

67. 发明授权

US08940359B2 Method of producing a microacoustic component 有权
标题翻译：微声部件的制造方法
公开(公告)号：US08940359B2
公开(公告)日：2015-01-27
申请号：US13223892
申请日：2011-09-01
申请人： Christoph Eggs , Gudrun Henn , Werner Ruile , Guenter Scheinbacher , Siegfried Menzel , Mario Spindler
发明人： Christoph Eggs , Gudrun Henn , Werner Ruile , Guenter Scheinbacher , Siegfried Menzel , Mario Spindler
IPC分类号： B05D5/12 , C23C16/44 , H03H3/02 , H01L41/23 , H01L41/29 , H01L41/316
CPC分类号： H03H3/02 , H01L41/23 , H01L41/29 , H01L41/316
摘要： The microacoustic component has a substrate that has at least one layer (composed of a dielectric or piezoelectric material, and a metallic strip structure. The layer is composed of a dielectric or piezoelectric material and/or the metallic strip structure have/has been produced or can be produced by the atomic layer deposition method.
摘要翻译：该微声部件具有至少一层（由电介质或压电材料构成的金属带结构）的基板，该层由电介质或压电材料构成，和/或已经生产或已经生成了金属带结构可以通过原子层沉积法生产。

68. 发明申请

US20140327341A1 Crystal Resonation Device and Production Method Therefor 有权
标题翻译：晶体谐振器及其制作方法
公开(公告)号：US20140327341A1
公开(公告)日：2014-11-06
申请号：US14332561
申请日：2014-07-16
申请人： Murata Manufacturing Co., Ltd.
发明人： Yoshifumi Saito , Toshiyuki Yasugi
IPC分类号： H01L41/053 , H01L41/23
CPC分类号： H01L41/053 , B81B2201/0271 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01L23/053 , H01L41/23 , H01L2924/0002 , H03H9/1021 , Y10T156/10 , H01L2924/00
摘要： A crystal resonation device that includes a base plate, a cap, a joining material, and a crystal resonator. The cap is provided on the base plate. The cap forms a sealed space with the base plate. The joining material joins the base plate and the cap. The joining material contains a cured material of thermosetting resin. The crystal resonator is provided on the base plate in the sealed space. The joining material is located in an outer side portion of a wall of the cap joined to the joining material.
摘要翻译：一种晶体谐振装置，包括基板，盖，接合材料和晶体谐振器。盖子设在底板上。盖与基板形成密封空间。接合材料连接基板和盖。接合材料含有热固性树脂的固化物。晶体谐振器设置在密封空间中的基板上。接合材料位于与接合材料接合的帽的壁的外侧部分中。

69. 发明申请

US20140184026A1 Wirebonding Fixture and Casting Mold 有权
公开(公告)号：US20140184026A1
公开(公告)日：2014-07-03
申请号：US14143843
申请日：2013-12-30
申请人： Volcano Corporation
发明人： Michael Reiter
IPC分类号： A61B8/00 , H01L41/25 , H01L41/333 , H01L41/04
CPC分类号： A61B8/4483 , A61B8/12 , A61B8/445 , B06B1/0651 , B06B1/0688 , B29C45/03 , B29C45/14418 , B29C45/14467 , B29C45/14639 , B29C45/34 , B29C45/401 , H01L41/23 , H03H3/02 , Y10T29/42 , Y10T29/4957
摘要： The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.

70. 发明申请

US20140165381A1 Method for producing a housing structure at least partially enclosing at least one component and housing structure produced by said method 有权
标题翻译：用于制造至少部分地包围由所述方法产生的至少一个部件和壳体结构的壳体结构的方法
公开(公告)号：US20140165381A1
公开(公告)日：2014-06-19
申请号：US14127986
申请日：2012-06-21
申请人： TECHNISCHE UNIVERSITÄT DARMSTADT , FRAUNHOFER-GESELLSCHAFT zur Förderung der angewandten Forschung e.V.
发明人： Matthias Rauschenbach , David Flaschentraeger , Tobias Melz , Eberhard Abele , Jakob Fischer , Hanns Stoffregen
IPC分类号： H05K13/00
CPC分类号： H05K13/00 , B22F3/1055 , B29C64/153 , B29C67/0077 , B29C70/70 , H01L41/0536 , H01L41/23 , H01L41/257 , Y02P10/295 , Y10T29/49002
摘要： A method for producing a housing structure at least partially enclosing at least one component, wherein the housing structure is produced with a construction process utilizing at least one of repeated layered deposition and solidification of material, which is interrupted at least once before completion of the housing structure, and during at least one interruption at least one component, which is not produced by the construction process, is joined to or disposed in a partially finished housing structure, and the construction process is then continued after the interruption until the housing is completed, wherein at least one of an actuator and sensor comprising at least partially a transformer material selected as the at least one component to be joined to or disposed in the housing structure.
摘要翻译：一种用于制造至少部分地包围至少一个部件的壳体结构的方法，其中所述壳体结构利用施加工艺生产，所述构造工艺利用重复分层沉积和材料固化中的至少一种，其在壳体完成之前中断至少一次并且在至少一个中断期间，不是由施工过程产生的至少一个部件被连接到或设置在部分成型的壳体结构中，然后在中断之后继续施工过程直到壳体完成，其中致动器和传感器中的至少一个至少部分地包括被选择为要连接到或设置在壳体结构中的至少一个部件的变压器材料。

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