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61. 发明申请

US20080191220A1 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices 审中-公开
标题翻译：卷对卷制造的光片和封装的半导体电路器件
公开(公告)号：US20080191220A1
公开(公告)日：2008-08-14
申请号：US12002556
申请日：2007-12-18
申请人： John J. Daniels , Gregory V. Nelson
发明人： John J. Daniels , Gregory V. Nelson
IPC分类号： H01L33/00
CPC分类号： H01L31/022425 , H01L24/29 , H01L24/33 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/0753 , H01L31/048 , H01L31/1876 , H01L31/188 , H01L33/52 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/75822 , H01L2224/83192 , H01L2224/8388 , H01L2224/95 , H01L2224/95145 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10336 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , Y02E10/50 , Y02P70/521 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298 , H01L2924/00012
摘要： A light active sheet, comprising a first substrate flexible sheet having an electrically conductive surface, a second transparent substrate flexible sheet having a transparent conductive layer disposed thereon, an electrically insulative adhesive flexible sheet and light active semiconductor elements fixed to the electrically insulative adhesive sheet. The light active semiconductor elements each have an n-side and a p-side. The electrically insulative adhesive sheet having the light active semiconductor elements fixed thereon is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination which is activated so that the electrically insulative adhesive electrically insulates and binds the second substrate sheet to the first substrate sheet. One of the n-side and p-side are in electrical communication with the transparent conductive layer and the other of the n-side or the p-side is in electrical communication with the electrically conductive surface.
摘要翻译：一种光活性片，包括具有导电表面的第一基底柔性片，具有设置在其上的透明导电层的第二透明基底柔性片，固定在电绝缘粘合片上的电绝缘粘合柔性片和光活性半导体元件。光活性半导体元件各自具有n侧和p侧。将固定有活性半导体元件的电绝缘性粘合片插入到导电表面和透明导电层之间，以形成层压，其被激活，使得电绝缘粘合剂将第二基底片电绝缘并结合到第一基底片。 n侧和p侧中的一个与透明导电层电连通，并且n侧或p侧中的另一个与导电表面电连通。

62. 发明授权

US07332361B2 Xerographic micro-assembler 有权
标题翻译：静电复印机
公开(公告)号：US07332361B2
公开(公告)日：2008-02-19
申请号：US11011652
申请日：2004-12-14
申请人： Jeng Ping Lu , Eugene M. Chow
发明人： Jeng Ping Lu , Eugene M. Chow
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： H01L25/50 , H01L21/67271 , H01L21/67282 , H01L21/67294 , H01L24/95 , H01L2224/95085 , H01L2224/95144 , H01L2224/95145 , H01L2924/14 , H01L2924/1461 , Y10T29/4913 , Y10T29/49133 , Y10T29/53004 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53278 , H01L2924/00
摘要： Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography. The substrate with the micro-objects is further processed to interconnect the micro-objects—through electrical wiring, for example—to form the final micro-assembly.
摘要翻译：公开了静电印刷微组装系统和方法。系统和方法涉及操纵电荷编码的微物体。电荷编码识别每个微物体并指定其排列方向。微物体在分类单元中排序，使得它们具有定义的位置和取向。分选单元具有基于其选择电荷编码的静电和磁性操纵微物体的能力。分类的微物体被提供给图像传送单元。图像传送单元适于接收分类的微物体，将它们保持在排列顺序和方位，并将其传送到基底。将排序的顺序作为微物体传送到基底可以通过使用静电图像来实现，如在静电复印中所做的那样。具有微物体的衬底被进一步处理以使例如微通孔电线互连，以形成最终的微组件。

63. 发明授权

US07323757B2 System for field assisted statistical assembly of wafers 失效
标题翻译：晶圆现场辅助统计装配系统
公开(公告)号：US07323757B2
公开(公告)日：2008-01-29
申请号：US10350778
申请日：2003-01-24
申请人： Clifton G. Fonstad, Jr. , Markus Zahn
发明人： Clifton G. Fonstad, Jr. , Markus Zahn
IPC分类号： H01L29/00
CPC分类号： H01L24/95 , H01L21/2007 , H01L21/6835 , H01L21/76251 , H01L21/8252 , H01L24/29 , H01L24/97 , H01L25/167 , H01L25/18 , H01L25/50 , H01L27/15 , H01L31/02 , H01L2224/29 , H01L2224/29101 , H01L2224/29298 , H01L2224/95085 , H01L2224/95144 , H01L2224/95145 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01082 , H01L2924/01094 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/12043 , H01L2924/13063 , H01L2924/14 , Y10T29/5313 , Y10T29/53196 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A wafer having heterostructure therein is formed using a substrate with recesses formed within a dielectric layer. A magnetized magnetic layer or a polarized electret material is formed at the bottom of each recess. The magnetized magnetic layer or a polarized electret material provides a predetermined magnetic or electrical field pattern. A plurality of heterostructures is formed from on an epitaxial wafer wherein each heterostructure has formed thereon a non-magnetized magnetic layer that is attracted to the magnetized magnetic layer formed at the bottom of each recess or dielectric layer that is attracted to the polarized electret material formed at the bottom of each recess. The plurality of heterostructures is etched from the epitaxial wafer to form a plurality of heterostructure pills. The plurality of heterostructure pills is slurried over the surface of the dielectric layer so that individual heterostructure pills can fall into a recess and be retained therein due to the strong short-range magnetic or electrical attractive force between the magnetized magnetic layer in the recess and the non-magnetized magnetic layer on the heterostructure pill or between the polarized electret material in the recess and the dielectric on the heterostructure pill. Any excess heterostructure pills that are not retained in a recess formed within the dielectric layer are removed and an overcoat is applied to form a substantial planar surface.
摘要翻译：其中具有异质结构的晶片使用在介电层内形成有凹陷的基板形成。在每个凹部的底部形成磁化的磁性层或极化的驻极体材料。磁化磁性层或极化驻极体材料提供预定的磁场或电场图案。从外延晶片上形成多个异质结构，其中每个异质结构形成有非磁化磁性层，该非磁化磁性层被吸引到被形成在被形成于所形成的极化驻极体材料的每个凹部或电介质层的底部的磁化磁性层在每个凹槽的底部。从外延晶片蚀刻多个异质结构以形成多个异质结构丸。多个异质结构丸在电介质层的表面上浆化，使得各个异质结构丸可以落入凹槽中并由于在凹陷中的磁化磁性层和非磁化磁性层在异质结构丸上或凹陷中的极化驻极体材料和异质结构丸上的电介质之间。除去不保留在电介质层内形成的凹部中的任何过量异质结构丸，并施加外涂层以形成基本的平坦表面。

64. 发明申请

US20080020946A1 Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags 审中-公开
标题翻译：用于DNA基因组和蛋白质组学芯片的薄膜热电冷却和加热装置，热光开关电路和IR标签
公开(公告)号：US20080020946A1
公开(公告)日：2008-01-24
申请号：US11643481
申请日：2006-12-21
申请人： Rama Venkatasubramanian
发明人： Rama Venkatasubramanian
IPC分类号： H01L35/32 , C07H21/04 , C25B3/00 , C40B50/00 , H04Q7/20 , C40B60/14 , H01L31/00
CPC分类号： B01L7/54 , B01L3/5085 , B01L7/52 , B01L2400/0448 , F25B21/04 , H01L23/38 , H01L27/14649 , H01L35/08 , H01L2224/95145 , H01L2224/95147 , H01L2924/01019 , H01L2924/01068 , H01L2924/01077 , H01L2924/1461 , H05B3/10 , H01L2924/00
摘要： A thermoelectric cooling and heating device including a substrate, a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling such that each thermoelectric element includes a thermoelectric material, a Peltier contact contacting the thermoelectric material and forming under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact. As such, the thermoelectric cooling and heating device selectively biases the thermoelectric elements to provide on one side of the thermolectric device a grid of localized heated or cooled junctions.
摘要翻译：一种热电冷却和加热装置，包括基板，多个热电元件，其布置在所述基板的一侧上并被配置为执行选择性加热和冷却中的至少一个，使得每个热电元件包括热电材料，接触所述热电材料，并且在电流流动下形成在加热结和冷却结中的至少一个，以及被配置成提供电流通过热电材料和珀尔帖接触的电极。因此，热电冷却和加热装置选择性地偏置热电元件，以在热电装置的一侧上提供局部加热或冷却接合的格栅。

65. 发明申请

US20060255013A1 Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate 审中-公开
标题翻译：用于产生具有应用于基板的表面的预定位置的分量的系统的方法和装置
公开(公告)号：US20060255013A1
公开(公告)日：2006-11-16
申请号：US11383136
申请日：2006-05-12
申请人： Karlheinz Bock
发明人： Karlheinz Bock
IPC分类号： B44C1/22
CPC分类号： H01L24/95 , B41J29/38 , B81C3/002 , H01L25/50 , H01L2224/95085 , H01L2224/95092 , H01L2224/95102 , H01L2224/95144 , H01L2224/95145 , H01L2924/01005 , H01L2924/01023 , H01L2924/01033 , H01L2924/01057 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/15787 , H05K3/303 , H05K2201/10636 , H05K2203/013 , H05K2203/048 , H05K2203/0776 , H05K2203/1173 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： A method for producing a system with a substrate with a surface and a component applied to a predetermined location of the surface of the substrate includes a step of generating a liquid volume containing the component and a step of applying the liquid volume containing the component on the surface of the substrate. At that, the liquid volume is sized so that it wets only a partial area of the surface of the substrate after its application. In the step of applying the liquid volume is placed on the surface of the substrate so that the partial area of the surface includes the predetermined location. The component or the predetermined location of the surface of the substrate is implemented so that after the application of the liquid volume a force acts on the component which is sufficient to drive the component within the liquid volume to the predetermined location. The method is completely independent of the speed of a gripper and its capability to grip and align a very small component.
摘要翻译：一种具有基板的系统的制造方法，所述基板具有施加到所述基板的表面的预定位置的表面和部件，包括产生包含所述部件的液体体积的步骤，以及将包含所述部件的液体体积施加到所述基板的步骤基板的表面。因此，液体体积的大小使得其在施用之后仅润湿基底表面的部分区域。在施加步骤中，将液体体积放置在基板的表面上，使得表面的局部区域包括预定位置。基板的表面的部件或预定位置被实施为使得在施加液体体积之后，力作用在足以将液体体积内的部件驱动到预定位置的部件上。该方法完全独立于夹具的速度及其夹紧和对齐非常小的部件的能力。

66. 发明申请

US20060231755A1 Process for precise arrangement of micro-bodies 失效
公开(公告)号：US20060231755A1
公开(公告)日：2006-10-19
申请号：US11349985
申请日：2006-02-09
申请人： Hiroshi Fudoji , Takeshi Konno , Mitsuru Egashira , Mikihiko Kobayashi , Norio Shinya
发明人： Hiroshi Fudoji , Takeshi Konno , Mitsuru Egashira , Mikihiko Kobayashi , Norio Shinya
IPC分类号： G21K7/00
CPC分类号： H01L24/95 , H01L21/4853 , H01L25/50 , H01L2224/95145 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12042 , H05K3/3478 , H01L2924/00
摘要： A process for arranging a number of micro-bodies efficiently and precisely as one on one spot on a substrate. Charged spots are formed by a converging ion beam or the like on a substrate having an insulating property or the like, and micro-bodies having a size of 200 microns or less are attracted and stuck to the charged spots.

67. 发明申请

US20060220989A1 Method of assembling displays on substrates 有权
公开(公告)号：US20060220989A1
公开(公告)日：2006-10-05
申请号：US11099682
申请日：2005-04-04
申请人： W. Hillis , Nathan Myhrvold , Clarence Tegreene , Victoria Wood , Lowell Wood
发明人： W. Hillis , Nathan Myhrvold , Clarence Tegreene , Victoria Wood , Lowell Wood
IPC分类号： G09G3/00
CPC分类号： G09G3/001 , G09G3/3433 , H01L24/95 , H01L2224/95136 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15157
摘要： Various embodiments of methods and systems for designing and constructing displays from multiple light-modulating elements are disclosed. Display elements having different light-modulating and self-assembling characteristics may be used during display assembly and operation.

68. 发明授权

US07018575B2 Method for assembly of complementary-shaped receptacle site and device microstructures 失效
公开(公告)号：US07018575B2
公开(公告)日：2006-03-28
申请号：US10218052
申请日：2002-08-12
申请人： Peter D. Brewer , Andrew T. Hunter , Luisa M. Deckard
发明人： Peter D. Brewer , Andrew T. Hunter , Luisa M. Deckard
IPC分类号： H01L21/00 , B29C59/00 , B28B5/00
CPC分类号： H01L24/95 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L24/26 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L29/0657 , H01L2224/8319 , H01L2224/8385 , H01L2224/95085 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01033 , H01L2924/01061 , H01L2924/01072 , H01L2924/01075 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/09701 , H01L2924/10158 , H01L2924/10329 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T428/12528 , H01L2924/00
摘要： A method for assembly including the steps of:(a) providing a plurality of microstructure components with each of the components having a bottom with the same three dimensional shape;(b) forming a mold with at least one protuberance from a surface thereof so that the at least one protuberance has the same shape;(c) molding a moldable substrate with the mold to form a molded substrate having a surface with at least one recess having the same shape; and(d) positioning a first of the plurality of microstructure components into said at least one recess. Each of the microstructure components may be formed by a masking and etching process, with the mold being formed by the same masking and etching process. The positioning step may consist of mixing the microstructure components with a fluid to form a slurry; and depositing the slurry on the surface of the molded substrate to cause the first of the plurality of microstructure components to self-align in the recess.

69. 发明申请

US20050214963A1 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices 有权
标题翻译：卷对卷制造的光片和封装的半导体电路器件
公开(公告)号：US20050214963A1
公开(公告)日：2005-09-29
申请号：US11029129
申请日：2005-01-04
申请人： John Daniels , Gregory Nelson
发明人： John Daniels , Gregory Nelson
IPC分类号： H01L21/00 , H01L25/075 , H01L27/00 , H01L33/52
CPC分类号： H01L31/022425 , H01L24/29 , H01L24/33 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/0753 , H01L31/048 , H01L31/1876 , H01L31/188 , H01L33/52 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/75822 , H01L2224/83192 , H01L2224/8388 , H01L2224/95 , H01L2224/95145 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10336 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , Y02E10/50 , Y02P70/521 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298 , H01L2924/00012
摘要： A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the transparent conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate. Thus, the p and n sides of each LED die are automatically connected to the top conductive layer and the bottom conductive surface. Each LED die is encapsulated and secured between the substrates in the flexible, hotmelt adhesive sheet layer. The bottom substrate, the hotmelt adhesive (with the embedded LED die) and the top substrate can be provided as rolls of material. The rolls are brought together in a continuous roll fabrication process, resulting in a flexible sheet of lighting material.
摘要翻译：制备轻活性片材的方法。提供具有导电表面的底部基板。提供热熔粘合片。诸如LED模具的光活性半导体元件被嵌入热熔粘合片中。 LED芯片各自具有顶部电极和底部电极。提供具有透明导电层的顶部透明基板。将具有嵌入式LED管芯的热熔粘合片插入在导电表面和透明导电层之间以形成层压。层压通过加热的压力辊系统来熔化热熔粘合片并将顶部基底电绝缘并结合到底部基底。当热熔片被软化时，LED管芯突破，使得顶部电极与顶部基板的透明导电层电接触，并且底部电极与底部基板的导电表面电接触。因此，每个LED管芯的p侧和n侧自动连接到顶部导电层和底部导电表面。每个LED芯片被封装并固定在柔性热熔粘合片层中的基板之间。底部基材，热熔粘合剂（具有嵌入式LED模具）和顶部基材可以以卷材料形式提供。辊以连续的辊制造工艺聚集在一起，产生柔性的照明材料片。

70. 发明授权

US06850312B2 Apparatuses and methods for flexible displays 有权
标题翻译：柔性显示器的装置和方法
公开(公告)号：US06850312B2
公开(公告)日：2005-02-01
申请号：US10812788
申请日：2004-03-29
申请人： Jeffrey Jay Jacobsen , John Stephen Smith , Mark A. Hadley
发明人： Jeffrey Jay Jacobsen , John Stephen Smith , Mark A. Hadley
IPC分类号： G02F1/1333 , G02F1/1343 , G02F1/1362 , H01L21/77 , H01L21/84 , H01L21/98 , H01L25/075 , H01L31/0304 , H01L31/103 , H01L31/109 , G02F1/13 , G02F1/136 , H01L21/44
CPC分类号： H01L27/1214 , G02F1/133305 , G02F1/1362 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L25/50 , H01L29/0657 , H01L2224/24101 , H01L2224/24137 , H01L2224/24227 , H01L2224/76155 , H01L2224/7665 , H01L2224/82102 , H01L2224/95085 , H01L2224/95145 , H01L2224/97 , H01L2251/5338 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/10158 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/30105 , H01S5/0201 , H01L2224/82 , H01L2924/00
摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming a flexible active matrix display along a length of flexible substrate. Another embodiment of the invention relates to forming multiple flexible displays along a continuous flexible substrate. Another embodiment of the invention relates to forming a flexible display along a flexible reflective substrate. Another embodiment of the invention relates to using FSA generally with a flexible web process material. Another embodiment of the invention relates to using FSA and a deterministic method such as “pick and place” to place objects onto a rigid substrate or onto a web process material. Another embodiment of the invention relates to using web processing to deposit and/or pattern display material through an in-line process.
摘要翻译：要求保护用于形成显示器的装置和方法。本发明的一个实施例涉及沿柔性基底的长度形成柔性有源矩阵显示器。本发明的另一个实施例涉及沿着连续柔性基底形成多个柔性显示器。本发明的另一个实施例涉及沿柔性反射衬底形成柔性显示器。本发明的另一个实施方案涉及一般使用FSA柔性网状物料的FSA。本发明的另一个实施例涉及使用FSA和诸如“拾取和放置”的确定性方法将物体放置在刚性基底上或网状加工材料上。本发明的另一个实施例涉及使用网络处理来通过在线处理来沉积和/或图案显示材料。

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