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    • 63. 发明授权
    • Holdup capacitor energy harvesting
    • 夹持电容器能量收集
    • US09443601B2
    • 2016-09-13
    • US14479559
    • 2014-09-08
    • SanDisk Enterprise IP LLC
    • Gregg S. LucasRobert W. Ellis
    • G11C16/04G11C16/30G06F1/30G06F11/14G11C5/14G11C16/22
    • G11C16/30G06F1/30G06F11/14G11C5/148G11C16/225
    • The various embodiments described herein include circuits, methods and/or devices used to protect data in a storage device. In one aspect, a method includes performing a power fail operation on a first section of the storage device. The power fail operation includes supplying power, via an energy storage device, to the first section of the storage device, where the energy storage device is distinct from a power source used during normal operation of the storage device, and where supplying power via the energy storage device includes switching the output of the energy storage device from an output of a boost regulator to an input of the boost regulator. The power fail operation also includes performing data hardening on the first section of the storage device.
    • 这里描述的各种实施例包括用于保护存储设备中的数据的电路,方法和/或设备。 一方面,一种方法包括在存储装置的第一部分上执行电源故障操作。 电源故障操作包括通过能量存储设备向存储设备的第一部分供电,其中能量存储设备不同于在存储设备的正常操作期间使用的电源,并且通过能量供应电力 存储装置包括将能量存储装置的输出从升压调节器的输出切换到升压调节器的输入。 电源故障操作还包括在存储设备的第一部分上执行数据硬化。
    • 67. 发明授权
    • Semiconductor storage device having an SRAM memory cell and control and precharge circuits
    • 具有SRAM存储单元和控制和预充电电路的半导体存储器件
    • US09390789B2
    • 2016-07-12
    • US14942861
    • 2015-11-16
    • Renesas Electronics Corporation
    • Yuichiro Ishii
    • G11C11/419
    • G11C11/419G11C5/148G11C7/12G11C2207/2227
    • A semiconductor storage device includes an SRAM memory cell composed of a drive transistor, a transfer transistor and a load transistor, an I/O circuit that is connected to bit lines connected to the memory cell, and an operating mode control circuit that switches an operating mode of the I/O circuit between a resume standby mode and a normal operation mode, wherein the I/O circuit includes a write driver that writes data to bit lines, a sense amplifier that reads data from the bit lines, a first switch inserted between the bit lines and the write driver, a second switch inserted between the bit lines and the sense amplifier, a precharge circuit that precharges the bit lines, and a control circuit that controls the first and second switches and the precharge circuit according to a signal from the operating mode control circuit.
    • 半导体存储装置包括由驱动晶体管,转移晶体管和负载晶体管组成的SRAM存储单元,连接到与存储单元连接的位线的I / O电路,以及操作模式控制电路, 在恢复待机模式和正常操作模式之间的I / O电路的模式,其中I / O电路包括将数据写入位线的写入驱动器,从位线读取数据的读出放大器,插入的第一开关 在位线和写入驱动器之间,插入在位线和读出放大器之间的第二开关,预充电位线的预充电电路,以及根据信号控制第一和第二开关和预充电电路的控制电路 从操作模式控制电路。
    • 70. 发明授权
    • Semiconductor device including a non-volatile memory preserving data stored in a volatile memory when powered off
    • 半导体装置包括非易失性存储器,用于在关闭电源时保存存储在易失性存储器中的数据
    • US09355723B1
    • 2016-05-31
    • US14732037
    • 2015-06-05
    • SK hynix Inc.
    • Sangkug Lym
    • G11C11/00G11C14/00
    • G11C14/00G11C5/143G11C5/148G11C7/20G11C11/005G11C16/225G11C16/30
    • A semiconductor device may include a controller configured to generate a data retention path control signal in response to a power condition change signal. The semiconductor device may include a plurality of data retention paths configured to sequentially couple a plurality of global input/output (I/O) lines coupled to a volatile memory to a dummy I/O line in response to the data retention path control signal. The semiconductor device may include a dummy I/O pad coupled to the dummy I/O line. The semiconductor device may include a non-volatile memory device coupled to the dummy I/O pad, configured to retain a plurality of storage data received from the volatile memory when the volatile memory is powered off, or provide data retained in the volatile memory as recovery data when power is recovered by the volatile memory.
    • 半导体器件可以包括被配置为响应于电力状况改变信号产生数据保持路径控制信号的控制器。 半导体器件可以包括多个数据保持路径,其被配置为响应于数据保持路径控制信号将耦合到易失性存储器的多个全局输入/输出(I / O)线顺序耦合到虚拟I / O线。 半导体器件可以包括耦合到虚拟I / O线的虚拟I / O焊盘。 半导体器件可以包括耦合到虚拟I / O焊盘的非易失性存储器件,其被配置为当易失性存储器断电时保持从易失性存储器接收的多个存储数据,或者将保留在易失性存储器中的数据提供为 当易失性存储器恢复供电时的恢复数据。