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61. 发明申请

US20040058143A1 Resin composition, process for producing the same and electrophotographic fixing member 失效
标题翻译：树脂组合物，其制造方法和电子照相固定构件
公开(公告)号：US20040058143A1
公开(公告)日：2004-03-25
申请号：US10252561
申请日：2002-09-24
申请人： Fuji Xerox Co., Ltd.
发明人： Hiroshi Tamemasa , Makoto Omata , Shigeo Ohta , Takahiro Okayasu
IPC分类号： B32B003/26
CPC分类号： C25D5/56 , C23C18/1648 , C23C18/1653 , C23C18/1865 , C23C18/1882 , C23C18/40 , H01L2924/0002 , H05K3/181 , H05K3/381 , H05K2201/0116 , H05K2201/0154 , H05K2203/0759 , H05K2203/0783 , Y10T428/1376 , Y10T428/249954 , Y10T428/249979 , Y10T428/24999 , Y10T428/249991 , Y10T428/249992 , H01L2924/00
摘要： A resin composition having a high adhesion between a resin layer and a metallic layer as well as an excellent durability, a process for producing the same, and an electrophotographic fixing member are provided. In the resin composition, a metallic layer is provided on a surface of a resin layer having a porous structure at least on the surface.
摘要翻译：提供了树脂层和金属层之间具有高粘附性以及优异的耐久性的树脂组合物，其制造方法和电子照相定影构件。在树脂组合物中，至少在表面上在具有多孔结构的树脂层的表面上设置金属层。

62. 发明申请

US20020192379A1 Pretreating agent for metal plating 有权
标题翻译：金属电镀预处理剂
公开(公告)号：US20020192379A1
公开(公告)日：2002-12-19
申请号：US10169894
申请日：2002-07-08
发明人： Toru Imori
IPC分类号： B05D003/10
CPC分类号： C23C18/1879 , C23C18/1882 , C23C18/34 , C23C18/40 , H05K3/181 , H05K3/389 , H05K2203/1157 , H05K2203/124
摘要： The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.
摘要翻译：本发明提供一种金属电镀方法，即使在难以施加化学镀的材料上也能以良好的方式进行无电解电镀以及该方法的预处理剂。将待镀敷的物品用预处理剂处理，所述预处理剂是通过在其分子中混合具有金属捕获官能团的硅烷偶联剂的溶液和含有在沉积镀层中显示催化活性的金属的溶液而制备的金属如铜，镍等从化学镀溶液涂覆到待镀制品的表面上，以使上述金属被上述硅烷偶联剂捕获，然后加入还原剂。之后，进行化学镀，使得在上述预处理物品的表面上形成金属薄膜。然后，可以进行所需的金属电镀。

63. 发明授权

US06449835B1 Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it 失效
标题翻译：可以获得制造成本便宜且具有足够的粘合强度的树脂结构体及其制造方法
公开(公告)号：US06449835B1
公开(公告)日：2002-09-17
申请号：US09553375
申请日：2000-04-20
申请人： Kikuo Oura , Kenzo Fujii
发明人： Kikuo Oura , Kenzo Fujii
IPC分类号： A05K336
CPC分类号： C23C18/22 , C23C18/1608 , C23C18/1651 , C23C18/1658 , C23C18/166 , C23C18/2013 , C23C18/285 , C23C18/30 , C23C18/40 , C25D5/56 , H01L2924/15151 , H05K3/381 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A resin structure includes a resin layer and a metal layer. The resin layer is formed of a single material. The metal layer is laminated directly on the resin layer without intervention of an adhesive layer between the resin layer and the metal layer. A surface of the resin layer, on which the metal layer is laminated, has a surface roughness of a value in a range of 0.1 microns to 10 microns, as a rough surface. The metal layer is formed on the rough surface of the resin layer.
摘要翻译：树脂结构体包括树脂层和金属层。树脂层由单一材料形成。金属层直接层压在树脂层上，而不会在树脂层和金属层之间介入粘合剂层。作为粗糙表面，层压有金属层的树脂层的表面的表面粗糙度为0.1微米至10微米的范围。金属层形成在树脂层的粗糙表面上。

64. 发明授权

US06286207B1 Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it 失效
标题翻译：可以获得制造成本便宜且具有足够的粘合强度的树脂结构体及其制造方法
公开(公告)号：US06286207B1
公开(公告)日：2001-09-11
申请号：US09307139
申请日：1999-05-07
申请人： Kikuo Oura , Kenzo Fujii
发明人： Kikuo Oura , Kenzo Fujii
IPC分类号： H05K302
CPC分类号： C23C18/22 , C23C18/1608 , C23C18/1651 , C23C18/1658 , C23C18/166 , C23C18/2013 , C23C18/285 , C23C18/30 , C23C18/40 , C25D5/56 , H01L2924/15151 , H05K3/381 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A resin structure includes a resin layer and a metal layer. The resin layer is formed of a single material. The metal layer is laminated directly on the resin layer without intervention of an adhesive layer between the resin layer and the metal layer. A surface of the resin layer, on which the metal layer is laminated, has a surface roughness of a value in a range of 0.1 microns to microns, as a rough surface. The metal layer is formed on the rough surface of the resin layer. (FIG. 4B)
摘要翻译：树脂结构体包括树脂层和金属层。树脂层由单一材料形成。金属层直接层压在树脂层上，而不会在树脂层和金属层之间介入粘合剂层。作为粗糙表面，层叠有金属层的树脂层的表面的表面粗糙度为0.1微米至微米的范围。金属层形成在树脂层的粗糙表面上。（图4B）

65. 发明授权

US5736065A Chemical reducing solution for copper oxide 失效
标题翻译：氧化铜的化学还原溶液
公开(公告)号：US5736065A
公开(公告)日：1998-04-07
申请号：US815599
申请日：1997-03-12
申请人： Akishi Nakaso , Youichi Kaneko
发明人： Akishi Nakaso , Youichi Kaneko
IPC分类号： C23F1/00 , C22B15/00 , C23C18/40 , C23C22/83 , C23C30/00 , H05K3/38 , H05K3/46 , C01B6/10 , C09K15/02
CPC分类号： C22B15/0065 , C22B15/008 , C23C18/40 , C23C22/83 , H05K3/385 , H05K2203/0315 , H05K2203/1157 , H05K3/4611 , Y02P10/236
摘要： A chemical reducing solution obtained by using an alkali boron hydride as a reductant and adding thereto a water-soluble, polyoxyethylene chain-containing organic compound having a molecular weight of 200 or above molecule as an additive has merits in that it can reduce copper oxide to metallic copper while maintaining the needle-like form of copper oxide as completely as possible and the reduction can be completed in a short period of time by a simple procedure, so that the chemical reducing solution is successfully usable in a process for producing a multi-layer printed circuit board.
摘要翻译：通过使用碱金属硼氢化物作为还原剂并向其中加入分子量为200以上的水溶性聚氧乙烯链有机化合物作为添加剂而得到的化学还原溶液的优点在于，可以将氧化铜还原为金属铜，同时尽可能完全地保持氧化铜的针状形式，并且可以通过简单的程序在短时间内完成还原，使得化学还原溶液成功地用于生产多孔铜的方法中，层印刷电路板。

66. 发明授权

US5562760A Plating bath, and corresponding method, for electrolessly depositing a metal onto a substrate, and resulting metallized substrate 失效
标题翻译：电镀浴和相应的方法，用于将金属无电沉积到基底上，以及所得的金属化基底
公开(公告)号：US5562760A
公开(公告)日：1996-10-08
申请号：US437755
申请日：1995-05-09
申请人： Gerald L. Ballard , John G. Gaudiello
发明人： Gerald L. Ballard , John G. Gaudiello
IPC分类号： H05K1/09 , C23C18/40 , C23C18/48 , H01L23/14 , H05K3/24 , C23C18/52 , C23C18/38
CPC分类号： H05K3/244 , C23C18/40 , H05K3/24 , Y10S428/936 , Y10T428/12535 , Y10T428/12903
摘要： An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemically reduce at, and deposit onto, the substrate surface of interest, and a complexing agent for the metal ions. In addition, the bath composition includes a soluble source of any one or more of a select group of what are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver (Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as a complexing agent for the mediator ions. Moreover, the bath composition includes a chemical reducing agent, which primarily serves to chemically reduce the mediator ions at the substrate surface of interest. Significantly, by using an appropriate ratio of the concentration of the metal ions in solution to the concentration of the mediator ions in solution, and depending upon which mediator ions are used, the inventive bath composition serves to electrolessly deposit the metal of interest onto the substrate surface of interest, with the resulting deposited metal containing less than or equal to about 3.0 atomic percent, or less than or equal to about 2.0 atomic percent, or even less than or equal to about 1.0 atomic percent, of the corresponding mediator metal.
摘要翻译：公开了一种无电金属电镀浴组合物，用于将金属无电沉积到衬底表面上的相应方法，以及所得到的金属化衬底。本发明的浴组合物包括水，需要化学还原并沉积到感兴趣的基底表面上的金属离子的可溶性源，以及用于金属离子的络合剂。此外，浴组合物包括任何一种或多种所谓的介体离子的选择组的可溶性源，该组包括钯（Pd），铂（Pt），银（Ag），钌（Ru），铱（Ir），锇（Os）和铑（Rh）离子，以及介体离子的络合剂。此外，浴组合物包括化学还原剂，其主要用于化学还原感兴趣的基底表面处的介体离子。重要的是，通过使用溶液中的金属离子的浓度与溶液中的介体离子的浓度的适当比例，并且取决于使用哪种介体离子，本发明的浴组合物用于将感兴趣的金属无电沉积到衬底上所形成的沉积金属含有相应的介体金属的小于或等于约3.0原子百分比，或小于或等于约2.0原子百分比，或甚至小于或等于约1.0原子百分比。

67. 发明授权

US5298058A Electroless copper plating bath 失效
标题翻译：无电镀铜浴
公开(公告)号：US5298058A
公开(公告)日：1994-03-29
申请号：US982892
申请日：1992-11-30
申请人： Fujio Matsui , Yasuyuki Yamamoto
发明人： Fujio Matsui , Yasuyuki Yamamoto
IPC分类号： C23C18/40
CPC分类号： C23C18/40
摘要： An electroless copper plating bath comprises a water soluble copper salt, a complexing agent, and a reducing agent consisting of phosphorous acid or a phosphite. As compared with conventional acidic bath using hypophosphorous acid, the bath is less expensive while depositing a uniform copper film at equivalent efficiency.
摘要翻译：化学镀铜浴包含水溶性铜盐，络合剂和由亚磷酸或亚磷酸酯组成的还原剂。与使用次磷酸的常规酸性浴相比，在相当效率地沉积均匀的铜膜的同时，浴更便宜。

68. 发明授权

US4956014A Electroless copper plating solution 失效
标题翻译：化学镀铜溶液
公开(公告)号：US4956014A
公开(公告)日：1990-09-11
申请号：US325536
申请日：1989-03-20
申请人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
IPC分类号： C23C18/40
CPC分类号： C23C18/40
摘要： A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methylpiperidine, and diethylaminoethanol.

69. 发明授权

US4954369A Chemical deposition of copper from alkaline aqueous baths 失效
标题翻译：从碱性水浴中化学沉积铜
公开(公告)号：US4954369A
公开(公告)日：1990-09-04
申请号：US312926
申请日：1989-02-21
申请人： Alfred Oftring , Chung-Ji Tschang , Ekhard Winkler , Guenther Gotsmann , Klaus Glaser
发明人： Alfred Oftring , Chung-Ji Tschang , Ekhard Winkler , Guenther Gotsmann , Klaus Glaser
IPC分类号： C23C18/40 , H05K3/18
CPC分类号： C23C18/40 , H05K3/181
摘要： Copper is chemically deposited from alkaline aqueous baths containing polyacetal complexing agents obtainable by reacting(a) dialdehydes of the formula ##STR1## and n is 0 or 1, with (b) polyolcarboxylic acids which contain 2 or more OH groups and have from 4 to 7 carbon atoms in a molar ratio of (a):(b) of from 1:0.5 to 1:3.
摘要翻译：从含有聚缩醛络合剂的碱性水溶液中，使（a）式为OHCAnCHO，其中A为CH2，CH2CH2，CH2CH2CH2，...，n为0或1的二醛与（b）多元醇羧酸含有2个或更多个OH基团并且具有4至7个碳原子，（a）：（b）的摩尔比为1:0.5至1:3。

70. 发明授权

US4935267A Process for electrolessly plating copper and plating solution therefor 失效
标题翻译：无电镀铜及其电镀液的方法
公开(公告)号：US4935267A
公开(公告)日：1990-06-19
申请号：US190854
申请日：1988-05-06
申请人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
IPC分类号： C23C18/40 , H05K3/18
CPC分类号： H05K3/181 , C23C18/40
摘要： By forming a first copper layer on a substrate by using a complexing agent for copper ion, which has a low copper complex stability constant, a uniform second layer can be stably formed by a second complexing agent for a copper ion, which has a high copper complex stability constant, even if the substrate is composed of a material having a low catalytic activity, such as tungsten, or even if the catalytic activity of the substrate is uneven. A similar effect can also be obtained by adding a small amount of a complexing agent for a copper ion, having a low stability constant, to an electroless copper plating bath containing a complexing agent for a copper ion, having a low stability constant. In this case, an effect of preventing stopping of the reaction of the complexing agent of a copper ion, having a high stability constant, is attained. Most preferably, after formation of a uniform first copper layer by an electroless copper plating solution containing a complexing agent for a copper ion, having a low stability constant, a second copper layer is formed by an electroless copper plating solution containing a complexing agent for a copper ion, having a high stability constant and also in this case, a small amount of a complexing agent for a copper ion, having a low stability constant, is added.
摘要翻译：通过使用铜络合物的稳定常数低的铜离子络合剂，在基板上形成第一铜层，可以通过第二铜离子络合剂稳定地形成均匀的第二层，铜离子配位剂复合稳定性常数即使基材由具有低催化活性的材料如钨构成，或即使基材的催化活性不均匀也是如此。通过向具有低稳定性常数的含有铜离子络合剂的化学镀铜浴中加入少量用于具有低稳定性常数的铜离子络合剂也可以获得类似的效果。在这种情况下，可以获得阻止具有高稳定性常数的铜离子络合剂的反应停止的效果。最优选的是，通过含有铜离子络合剂的化学镀铜溶液形成均匀的第一铜层，具有低稳定性常数，第二铜层由含有络合剂的化学镀铜溶液形成，铜离子，具有高稳定性常数，并且在这种情况下，加入少量的具有低稳定常数的铜离子络合剂。

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