专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US06548576B1 Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components 失效
标题翻译：适用于电子部件中无铅焊料的环氧树脂配方
公开(公告)号：US06548576B1
公开(公告)日：2003-04-15
申请号：US10045461
申请日：2001-11-07
申请人： Raymond L. Winter
发明人： Raymond L. Winter
IPC分类号： C08K336
CPC分类号： H05K3/285 , C08G59/226 , C08G59/5026 , C08L61/06 , C08L63/00 , H01L23/293 , H01L2924/0002 , C08L2666/14 , C08L61/04 , H01L2924/00
摘要： A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders comprises an intimate mixture of the following components: approximately 2 to 13 per cent by weight of diglycidyl ether bisphenol A resin; approximately 40 to 70% phenol formaldehyde resin and the following further components [(2-methylphenoxy)methyl]-oxirane or o-cresol glycidyl ether) 0.5-8% by weight; polypropyleneglycol-glycidyl ether resin (plasticizer) 2-10% by weight; cycloaliphatic polyamine (catalyst) 4-15% by weight; kaolin clay (filler) 2-20% by weight; magnesium alumino silicate (filler) 2-15% by weight; Sb2O3 (filler) 4-5% by weight, and hydrated Al2O3 (filler) 0-15% by weight.
摘要翻译：适用于封装和密封电子元件的一个零件，几个月的有用的保质期环氧树脂，并且与用于焊接调制解调器无铅焊料所需的大约255°C至275°C的高温兼容包括以下组分的紧密混合物：约2至13重量％的二缩水甘油醚双酚A树脂; 约40至70％的苯酚甲醛树脂和以下其它组分[（2-甲基苯氧基）甲基] - 环氧乙烷或邻甲酚缩水甘油醚）0.5-8重量％;聚丙二醇 - 缩水甘油醚树脂（增塑剂）2-10％重量比为4-15重量％的脂环族聚胺（催化剂）; 2-20重量％的高岭土（填料）; 2-15重量％的硅铝酸镁（填料）; Sb2O3（填料）4-5重量％水合Al2O3（填料）0-15重量％。

62. 发明申请

US20020155286A1 Adhesive composition and adhesive sheet for semiconductor devices 失效
标题翻译：用于半导体器件的粘合剂组合物和粘合片
公开(公告)号：US20020155286A1
公开(公告)日：2002-10-24
申请号：US10068945
申请日：2002-02-11
发明人： Masaharu Kobayashi , Osamu Oka , Yasuhiro Yoshii
IPC分类号： B32B007/12 , C08J003/00
CPC分类号： C09J163/08 , C08G59/504 , C08L53/025 , C08L61/04 , C08L2666/02 , C08L2666/14 , C09J7/22 , C09J7/38 , C09J153/025 , C09J163/00 , C09J2203/326 , C09J2453/00 , C09J2461/00 , C09J2463/00 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/06135 , H01L2224/06136 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3011 , Y10S428/901 , Y10T428/1476 , Y10T428/287 , Y10T428/31511 , Y10T428/31663 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.
摘要翻译：用于半导体器件的粘合剂组合物包含作为必需组分（A）环氧树脂，（B）语音树脂，（C）环氧化苯乙烯 - 丁二烯 - 苯乙烯嵌段共聚物和（D）二氨基硅氧烷化合物。粘合剂组合物的耐热性，热循环试验和耐湿性优异。还提供了使用上述粘合剂组合物的粘合片。

63. 发明申请

US20020128397A1 PHOSPHORUS-CONTAINING POLYMER HAVING PHENOLIC UNITS AND USES THEREOF 有权
标题翻译：含有PHOPHUS的聚合物具有酚醛单体及其用途
公开(公告)号：US20020128397A1
公开(公告)日：2002-09-12
申请号：US09431435
申请日：1999-11-01
发明人： KUEN-YUAN HWANG , HONG-HSING CHEN , AN-PANG TU , YING-LING LIU
IPC分类号： C08L061/00
CPC分类号： H01L23/293 , C08G8/28 , C08G59/3254 , C08G59/621 , C08G61/02 , C08G2261/1422 , C08G2261/312 , C08G2261/3325 , C08G2261/3424 , C08G2261/592 , C08L61/14 , C08L63/00 , C08L85/02 , H01L23/145 , H01L2924/0002 , H05K1/0326 , Y10T428/31511 , C08L61/04 , C08L2666/22 , H01L2924/00 , C08L65/00
摘要： This invention discloses a novel phosphorus-containing polymer having phenolic units. The polymer is comprised of the following repeating units: 1 wherein each symbol is defined the same as in the specification; (b) a phophorus-containing repeating unit which is selected from any one of following formulae (b1) or (b2): 2 wherein each symbol is defined the same as m the specification; or 3 wherein each symbol is defined the same as in the specification; and an unit of the following formula (c), which is an optional component: 4 wherein each symbol is defined the same as in the specification. This invention also discloses the use of said phosphorus-containing polymer having phenolic units for manufacturing prepregs, composite material, laminated entities, printed circuit boards and electronic packaging material. The products obtained from the phosphorus-containing polymer of this invention have good processing properties, excellent flame retardant properties and resistance to heat high enough that they do not require additional flame retardants.
摘要翻译：本发明公开了一种具有酚类单元的新型含磷聚合物。聚合物由以下重复单元组成：其中每个符号定义与说明书中相同; （b）选自下述式（b1）或（b2）中任一项所述的含磷的重复单元：其中每个符号定义为与说明书相同; 或其中每个符号被定义与说明书中相同; 和下列公式（c）的单元，其是可选组件：其中每个符号被定义与说明书中相同。本发明还公开了具有酚类单元的所述含磷聚合物用于制备预浸料，复合材料，层压体，印刷电路板和电子包装材料的用途。从本发明的含磷聚合物获得的产品具有良好的加工性能，优异的阻燃性能和耐热性足够高，使得它们不需要额外的阻燃剂。

64. 发明授权

US06410615B1 Semiconductor sealing epoxy resin composition and semiconductor device using the same 失效
标题翻译：半导体密封环氧树脂组合物和使用其的半导体器件
公开(公告)号：US06410615B1
公开(公告)日：2002-06-25
申请号：US09485389
申请日：2000-02-09
申请人： Takashi Taniguchi , Minoru Yamane , Tsutomu Nishioka , Tadaaki Harada , Toshitsugu Hosokawa , Kazuhiro Ikemura , Sadahito Misumi , Shinichi Ohizumi
发明人： Takashi Taniguchi , Minoru Yamane , Tsutomu Nishioka , Tadaaki Harada , Toshitsugu Hosokawa , Kazuhiro Ikemura , Sadahito Misumi , Shinichi Ohizumi
IPC分类号： C08L6300
CPC分类号： H01L23/293 , C08L63/00 , H01L2224/45144 , H01L2224/48091 , Y10S524/904 , Y10S525/934 , C08L61/04 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cause the chip tilting attributable to resin flow during resin encapsulation, such as semiconductor element shifting or gold wire deformation, and can obtain highly reliable semiconductor devices: (X) the viscosity thereof as measured with a flow tester at 175° C. is from 50 to 500 P; (Y) the minimum melt viscosity thereof as determined from the temperature dependence of viscosity thereof as measured with a dynamic viscoelastic meter at a shear rate of 5 (1/s) is 1×105 poise or lower; and (Z) the ratio of the viscosity thereof as measured at 90° C. (Z1) to that as measured at 110° C. (Z2) both with a dynamic viscoelastic meter at a shear rate of 5 (1/s), (Z1/Z2), is 2.0 or higher.
摘要翻译：一种用于半导体封装的环氧树脂组合物，包括环氧树脂，酚醛树脂，硬化促进剂和无机填料。具有以下特性（X）至（Z）的环氧树脂组合物不会由于树脂封装中的树脂流动（例如半导体元件偏移或金线变形）而引起芯片倾斜，并且可以获得高度可靠的半导体器件：（X）用流动测试仪在175℃下测得的粘度为50-500P;（Y）其最小熔体粘度由粘度的温度依赖性确定，其用动态粘弹性仪器在剪切速率 5（1 / s）为1×10 5泊或更低; 和（Z）在90℃（Z1）下测量的粘度与在110℃下测量的粘度（Z2）的比例，用剪切速率为5（1 / s）的动态粘弹性仪，（Z1 / Z2）为2.0以上。

65. 发明申请

US20020043728A1 Resin composition for sealing semiconductor, semiconductor device using the same, semiconductor wafer and mounted structure of semiconductor device 审中-公开
标题翻译：用于密封半导体的树脂组合物，使用其的半导体器件，半导体晶片和半导体器件的安装结构
公开(公告)号：US20020043728A1
公开(公告)日：2002-04-18
申请号：US09935671
申请日：2001-08-24
发明人： Tadaaki Harada
IPC分类号： H01L023/28
CPC分类号： H01L23/293 , C08G59/188 , C08L61/06 , C08L63/00 , H01L21/563 , H01L24/29 , H01L2224/73203 , H01L2924/01004 , H01L2924/01012 , H01L2924/0102 , H01L2924/01029 , H01L2924/01077 , H01L2924/01079 , H01L2924/181 , C08L2666/22 , C08L61/04 , H01L2924/3512 , H01L2924/00
摘要： A resin composition for sealing a semiconductor device comprising (A) an epoxy resin; (B) a phenolic resin; and (C) a latent curing accelerator, wherein the resin composition is a solid at 25null C. or has a viscosity of not less than 400 Panulls at 25null C. and of not more than 200 Panulls at 80null C.; and a semiconductor device is obtained by mounting and sealing semiconductor elements on a wiring circuit substrate by using the resin composition.
摘要翻译：一种用于密封半导体器件的树脂组合物，包括（A）环氧树脂; （B）酚醛树脂; 和（C）潜在性固化促进剂，其中所述树脂组合物在25℃下为固体，或在25℃下具有不小于400Pa.s的粘度，并且在80℃下不大于200Pa.s C。; 并且通过使用树脂组合物将半导体元件安装并密封在布线电路基板上，获得半导体器件。

66. 发明申请

US20020026015A1 High-solids thermoset binders formed using hyperbranched polyols as reactive intermediates, coating compositions formed therewith, and methods of making and using same 有权
标题翻译：使用超支化多元醇作为反应性中间体形成的高固体热固性粘合剂，由其形成的涂料组合物，以及制备和使用它们的方法
公开(公告)号：US20020026015A1
公开(公告)日：2002-02-28
申请号：US09952732
申请日：2001-09-14
发明人： Swaminathan Ramesh
IPC分类号： C08F020/00
CPC分类号： C08G83/005 , C08G63/123 , C08G63/60 , C08G63/91 , C09D167/00 , C09D201/005 , Y10S977/754 , C08L2666/36 , C08L61/04
摘要： A binder for a coating composition is formed using a principal resin polyol, in combination with a hyper-branched polyol as a reactive intermediate, and at least one crosslinker. The principal resin polyol is at least one of a polyester polyol, a polyether polyol, and a polyacrylate. Hyper-branched polyester polyols may be used as reactive diluents, which will cross-link with isocyanates, isocyanurates, epoxides, anhydrides or their corresponding polyacids and/or aminoplasts to form a binder having particular properties, to help control the rheology of a coating system. The hyperbranched polyol, the principal resin polyol, or both may, optionally, include a carbamate functional group in the structure thereof. Coating compositions may be made using the binders together with additional components.
摘要翻译：使用主要树脂多元醇与作为反应性中间体的超支化多元醇和至少一种交联剂组合形成涂料组合物用粘合剂。主要树脂多元醇是聚酯多元醇，聚醚多元醇和聚丙烯酸酯中的至少一种。超支化聚酯多元醇可用作反应性稀释剂，其将与异氰酸酯，异氰脲酸酯，环氧化物，酸酐或其相应的多酸和/或氨基塑料交联以形成具有特定性质的粘合剂，以帮助控制涂料体系的流变性。超支化多元醇，主要树脂多元醇或两者可以任选地包括其结构中的氨基甲酸酯官能团。涂料组合物可以使用粘合剂和附加组分一起制备。

67. 发明申请

US20020007015A1 Sealants and potting formulations including polymers produced by the reaction of a polythiol and polyvinyl ether monomer 有权
公开(公告)号：US20020007015A1
公开(公告)日：2002-01-17
申请号：US09756080
申请日：2001-01-08
发明人： Susan E. DeMoss , Chandra B. Rao , Ahmed Sharaby , Hakam Singh , Jonathan D. Zook , David W. Jordan
IPC分类号： C08F228/02 , C08L041/00 , C08G075/00
CPC分类号： C08G75/12 , C08G75/045 , C08L61/06 , C08L81/02 , C09K3/1012 , C08L61/04
摘要： Sealant and potting formulations are provided which includes ungelled polymer(s) prepared from components including polyvinyl ether monomer(s) and polythiol material(s), the ungelled polymer being terminated with functional groups other than a thiol group; curing agent(s); and at least one additive selected from the group consisting of fillers, adhesion promoters, plasticizers and catalysts.

68. 发明授权

US06320013B1 Process for producing modified phenolic resin 失效
标题翻译：改性酚醛树脂生产工艺
公开(公告)号：US06320013B1
公开(公告)日：2001-11-20
申请号：US09601336
申请日：2000-08-10
申请人： Mitsunori Takeda , Masamichi Sato
发明人： Mitsunori Takeda , Masamichi Sato
IPC分类号： C08G1404
CPC分类号： C08G59/621 , C08G8/28 , C08G10/04 , C08G14/04 , C08L63/00 , C08L61/04
摘要： A process for producing a modified phenolic resin, comprising heating a heavy oil or pitch of given average molecular weight and, per mol, calculated from the average molecular weight, of the heavy oil or pitch; 0.3 to 25 mol, in terms of formaldehyde, a formaldehyde compound and 0.5 to 50 mol of a phenol of the formula (I) (wherein R1 represents a linear or branched unsaturated hydrocarbon group having 1 to 2 unsaturated bonds and having 2 to 10 carbon atoms, p is 1 or 2, X represents an alkyl group having 1 to 5 carbon atoms, and q is 0 or 1) under stirring in the presence of an acid catalyst to thereby effect a polycondensation. The modified phenolic resin obtained by this process, as compared with the conventional modified phenolic resin produced from a heavy oil or pitch as a feedstock, has an extremely low softening point so as to be flowable at about room temperature and has also a low melt viscosity, thereby ensuring very excellent moldability. Further, in combination with an epoxy resin, the modified phenolic resin can be formed into a molded article which is excellent in not only heat resistance, moisture resistance, corrosion resistance and adhesive force but also mechanical properties such as dimensional stability and strength.
摘要翻译：一种制备改性酚醛树脂的方法，包括加热重油或沥青的给定平均分子量，每摩尔由重油或沥青的平均分子量计算; 0.3〜25摩尔，以甲醛计，甲醛化合物和0.5〜50摩尔式（I）的苯酚（其中，R1表示具有1〜2个不饱和键且具有2〜10个碳原子的直链或支链的不饱和烃基原子，p为1或2，X表示碳原子数1〜5的烷基，q为0或1）在酸催化剂的存在下搅拌，进行缩聚。通过该方法获得的改性酚醛树脂与由重油或沥青作为原料生产的常规改性酚醛树脂相比具有极低的软化点，以便可在约室温下流动并且还具有低熔体粘度，从而确保非常优异的成型性。此外，与环氧树脂组合，可以将改性酚醛树脂形成为不仅具有耐热性，耐湿性，耐腐蚀性和粘合力优异的机械性能如尺寸稳定性和强度的成型品。

69. 发明授权

US06319619B1 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device 有权
标题翻译：半导体密封树脂组合物，用其密封的半导体器件，以及半导体器件的制备方法
公开(公告)号：US06319619B1
公开(公告)日：2001-11-20
申请号：US09403311
申请日：1999-10-20
申请人： Yuko Yamamoto , Miho Yamaguchi , Hitomi Shigyo
发明人： Yuko Yamamoto , Miho Yamaguchi , Hitomi Shigyo
IPC分类号： H01L2912
CPC分类号： H01L23/293 , C08K3/22 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , Y10T428/31529 , C08L61/04 , H01L2924/00
摘要： The present invention relates to a semiconductor encapsulating resin composition which is safe and superior in moisture resistance, flame retardance and moldability, and to a highly reliable semiconductor device which is fabricated by encapsulating a semiconductor element with such a semiconductor encapsulating resin composition. The resin composition according to the present invention comprises a thermosetting resin, a hardening agent and a compound metal hydroxide of polyhedral crystal form represented by the following general formula (1): m(MaOb).n(QdOe).cH2O (1) [wherein M and Q are different metal elements; Q is a metal element which belongs to a group selected from IVa, Va, VIa, VIIa, VIII, Ib and IIb groups in the periodic table; m, n, a, b, c, d and e, which may be the same or different, each represents a positive number]. In accordance with the present invention, reduction in the fluidity of the resin composition can be suppressed, so that transfer molding can be performed with an improved moldability without any trouble. Further, the resin composition ensures improvement in soldering resistance and mechanical strength.
摘要翻译：本发明涉及一种安全且优异的耐湿性，阻燃性和成型性的半导体封装树脂组合物以及通过用这种半导体封装树脂组合物包封半导体元件而制造的高可靠性半导体器件。根据本发明的树脂组合物包含热固性树脂，硬化剂和由以下通式（1）表示的多面体晶体的复合金属氢氧化物：[其中M和Q是不同的金属元素; Q是属于周期表中选自IVa，Va，VIa，VIIa，VIII，Ib和IIb族的基团的金属元素; m，n，a，b，c，d和e可以相同或不同，各自表示正数]。根据本发明，可以抑制树脂组合物的流动性的降低，从而可以在没有任何麻烦的情况下以改进的成型性进行传递模塑。此外，树脂组合物确保了耐焊接性和机械强度的提高。

70. 发明授权

US06316046B1 Wire enamels containing polyesterimides and/or polyamideimides with polyoxyalkylenediamines as molecular elements 失效
标题翻译：含有聚酰亚胺和/或聚酰胺酰亚胺与聚氧亚烷基二胺作为分子元素的线搪瓷
公开(公告)号：US06316046B1
公开(公告)日：2001-11-13
申请号：US09230919
申请日：1999-03-30
申请人： Klaus-Wilhelm Liener , Gerold Schmidt , Helmut Lehmann
发明人： Klaus-Wilhelm Liener , Gerold Schmidt , Helmut Lehmann
IPC分类号： C23D502
CPC分类号： H01B3/308 , C09D179/08 , H01B3/305 , H01B3/306 , C08L2666/16 , C08L61/20 , C08L61/04
摘要： The invention relates to wire enamels comprising as binders polyesterimide and/or polyamideimide, the binders comprising as monomeric building blocks polyoxyalkylenediamine having terminal amino groups. The polyoxyalkylenediamines are preferably selected from the group polyoxyethylenediamine, polyoxypropylenediamine and polyoxyethylenepropylenediamine. The invention also encompasses the use of the novel wire enamels for coating copper wires, especially thick round wires or profiled wires.
摘要翻译：本发明涉及包含作为粘合剂聚酯酰亚胺和/或聚酰胺酰亚胺的线搪瓷，所述粘合剂包含具有末端氨基的单体结构单元聚氧化烯二胺。聚氧化亚烷基二胺优选选自聚氧乙烯二胺，聚氧丙烯二胺和聚氧乙烯丙二胺。本发明还包括用于涂覆铜线，特别是粗圆形线或异形线的新型线釉的用途。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式