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    • 62. 发明授权
    • Methods of forming cooling channels using backstrike protection
    • 使用反冲击保护形成冷却通道的方法
    • US09242294B2
    • 2016-01-26
    • US13628204
    • 2012-09-27
    • GENERAL ELECTRIC COMPANY
    • Eric Richard BoniniRonald Scott Bunker
    • B22D25/02F01D5/18
    • B22D25/02B22C9/10B22D29/001B23H9/10B23P15/04B24C1/006B24C1/045B24C3/32F01D5/186F01D5/187F05D2230/11F05D2230/12F05D2230/13F05D2230/21F05D2260/202Y10T29/49352Y10T29/49815
    • A method of forming cooling channels in a component is provided. The component has a substrate having outer and inner surfaces. The inner surface defines at least one interior space, and a core is disposed within each interior space. The method includes forming at least one access hole in the substrate, while the core is disposed within the respective interior space, removing the core from the respective interior space, and forming at least one groove in the outer substrate surface (before or after the core is removed). Each access hole connects the groove in fluid communication with the respective interior space. The method further includes disposing a coating over at least a portion of the outer substrate surface, where the coating includes at least a structural coating that extends over the groove(s), such that the groove(s) and the structural coating together define one or more channels configured to convey a coolant from the respective interior space(s) for cooling the component.
    • 提供了一种在部件中形成冷却通道的方法。 该组件具有具有外表面和内表面的基底。 内表面限定至少一个内部空间,并且芯设置在每个内部空间内。 所述方法包括在所述基板中形成至少一个进入孔,同时所述芯设置在相应的内部空间内,从相应的内部空间移除所述芯,并在所述外部基板表面(在所述芯部之前或之后)形成至少一个凹槽 被删除)。 每个进入孔将凹槽与相应的内部空间流体连通。 该方法还包括在外基材表面的至少一部分上设置涂层,其中涂层至少包括在凹槽上延伸的结构涂层,使得凹槽和结构涂层一起限定一个 或多个通道,其构造成从相应的内部空间传送冷却剂以冷却部件。
    • 65. 发明申请
    • METHODS OF FORMING COOLING CHANNELS USING BACKSTRIKE PROTECTION
    • 使用背景保护形成冷却通道的方法
    • US20150367460A1
    • 2015-12-24
    • US13628204
    • 2012-09-27
    • GENERAL ELECTRIC COMPANY
    • Eric Richard BoniniRonald Scott Bunker
    • B23P15/26
    • B22D25/02B22C9/10B22D29/001B23H9/10B23P15/04B24C1/006B24C1/045B24C3/32F01D5/186F01D5/187F05D2230/11F05D2230/12F05D2230/13F05D2230/21F05D2260/202Y10T29/49352Y10T29/49815
    • A method of forming cooling channels in a component is provided. The component has a substrate having outer and inner surfaces. The inner surface defines at least one interior space, and a core is disposed within each interior space. The method includes forming at least one access hole in the substrate, while the core is disposed within the respective interior space, removing the core from the respective interior space, and forming at least one groove in the outer substrate surface (before or after the core is removed). Each access hole connects the groove in fluid communication with the respective interior space. The method further includes disposing a coating over at least a portion of the outer substrate surface, where the coating includes at least a structural coating that extends over the groove(s), such that the groove(s) and the structural coating together define one or more channels configured to convey a coolant from the respective interior space(s) for cooling the component.
    • 提供了一种在部件中形成冷却通道的方法。 该组件具有具有外表面和内表面的基底。 内表面限定至少一个内部空间,并且芯设置在每个内部空间内。 所述方法包括在所述基板中形成至少一个进入孔,同时所述芯设置在相应的内部空间内,从相应的内部空间移除所述芯,并在所述外部基板表面(在所述芯部之前或之后)形成至少一个凹槽 被删除)。 每个进入孔将凹槽与相应的内部空间流体连通。 该方法还包括在外基材表面的至少一部分上设置涂层,其中涂层至少包括在凹槽上延伸的结构涂层,使得凹槽和结构涂层一起限定一个 或多个通道,其构造成从相应的内部空间传送冷却剂以冷却部件。