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61. 发明申请

US20060040473A1 Laser processing method and laser processing apparatus 有权
公开(公告)号：US20060040473A1
公开(公告)日：2006-02-23
申请号：US11250404
申请日：2005-10-17
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

62. 发明申请

US20050194364A1 Laser processing method and laser processing apparatus 有权
公开(公告)号：US20050194364A1
公开(公告)日：2005-09-08
申请号：US11106657
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301 , B23K26/14
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

63. 发明申请

US20050184037A1 Laser processing method and laser processing apparatus 有权
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20050184037A1
公开(公告)日：2005-08-25
申请号：US11106648
申请日：2005-04-15
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号： B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301
CPC分类号： H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
摘要翻译：一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合即使形成了修改区域。

64. 发明申请

US20080218735A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080218735A1
公开(公告)日：2008-09-11
申请号：US10585343
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： G01N21/00 , G02B27/02
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译：提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 在将透镜保持在初始位置的同时发射用于处理的第一激光束并沿着主表面相对于彼此移动透镜和物体的第一处理步骤（S11和S12），以形成修改区域在一端切割一条线; 以及在要切割的线的一个端部中形成修改区域之后将透镜释放保持在初始位置的第二处理步骤（S13和S14），然后相对于每个移动透镜和物体另外沿着主表面，同时在释放之后调整透镜和主表面之间的间隙，从而形成改质区域。

65. 发明申请

US20050202596A1 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US20050202596A1
公开(公告)日：2005-09-15
申请号：US10507392
申请日：2003-03-12
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu
IPC分类号： B23K26/38 , B28D1/22 , B28D5/00 , C03B33/02 , C03B33/033 , C03B33/07 , H01L21/301 , H01L21/78
CPC分类号： H01L21/78 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , C03B33/033 , C03B33/07 , C03B33/074 , H01L2924/01015
摘要： A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.
摘要翻译：提供了能够高精度地切割具有各种层叠结构的待处理物体的激光加工方法。在聚光点P至少位于基板内的状态下，用激光L照射设置在基板前表面上的基板和层叠体的被处理物，以形成由于至少在衬底内的多光子吸收，并且使改质区域形成切割起点区域。当沿着切割起点区域切割物体时，可以高精度地切割物体1。

66. 发明授权

US08598015B2 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US08598015B2
公开(公告)日：2013-12-03
申请号：US13614042
申请日：2012-09-13
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , C03B33/033 , C03B33/07 , C03B33/074 , H01L2924/01015
摘要： A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.
摘要翻译：提供了能够高精度地切割具有各种层叠结构的待处理物体的激光加工方法。在聚光点P至少位于基板内的状态下，用激光L照射设置在基板前表面上的基板和层叠体的被处理物，以形成由于至少在衬底内的多光子吸收，并且使改质区域形成切割起点区域。当沿着切割起点区域切割物体时，可以高精度地切割物体1。

67. 发明授权

US08361883B2 Laser processing method 有权
公开(公告)号：US08361883B2
公开(公告)日：2013-01-29
申请号：US10507392
申请日：2003-03-12
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , C03B33/033 , C03B33/07 , C03B33/074 , H01L2924/01015
摘要： A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.

68. 发明申请

US20060151443A1 Laser processing device 有权
标题翻译：激光加工装置
公开(公告)号：US20060151443A1
公开(公告)日：2006-07-13
申请号：US10537511
申请日：2003-12-04
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Tetsuya Osajima
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Tetsuya Osajima
IPC分类号： B23K26/00
CPC分类号： B28D1/221 , B23K26/066 , B23K26/1462 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： A laser processing apparatus which can suppress the positional fluctuation in light-converging point of laser light during laser processing is provided. On an optical path of laser light L1 connecting a beam expander 34 and a first light-transmitting hole 32 of a lens holder 29 to each other in a laser processing apparatus 20, a stop member 38 including a second light-transmitting hole 39 having the same diameter as that of the first light-transmitting hole 32 is disposed. Hence, the amount of laser light L1 cut by the surrounding part of the first light-transmitting hole 32 can substantially be eliminated, whereby the lens holder 29 can be prevented from being heated upon irradiation with the laser light L1. Also, even when the stop member 38 is heated by the laser light L1 cut by the surrounding part of the second light-transmitting hole 39, heat is prevented from being transmitted from the stop member 38 to the lens holder 29, since the stop member 38 is separated from the lens holder 29. Therefore, the positional fluctuation in light-converging point P1 of the laser light L1 during laser processing can be suppressed to a low level.
摘要翻译：提供了能够抑制激光加工时的激光的聚光点的位置波动的激光加工装置。在激光加工装置20中，将光束扩展器34和透镜保持件29的第一透光孔32彼此连接的激光L 1的光路上，具有包括第二透光孔39的止挡部件38，设置与第一透光孔32相同的直径。因此，可以基本上消除由第一透光孔32的周围部分切割的激光量L 1，由此可以防止在照射激光L 1时加热透镜保持件29。此外，即使当通过由第二透光孔39的周围部分切割的激光L 1来加热止挡构件38时，由于停止构件38的停止，防止热量从止动构件38传递到透镜保持器29 构件38与透镜保持器29分离。因此，可以将激光加工中的激光L 1的聚光点P 1的位置偏移抑制到低水平。

69. 发明授权

US07749867B2 Method of cutting processed object 有权
标题翻译：切割加工对象的方法
公开(公告)号：US07749867B2
公开(公告)日：2010-07-06
申请号：US10507340
申请日：2003-03-11
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu
IPC分类号： H01L21/301
CPC分类号： H01L21/78 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , C03B33/033 , C03B33/07 , C03B33/074 , H01L2924/01015
摘要： A method of cutting an object which can accurately cut the object is provided. An object to be processed 1 such as a silicon wafer is irradiated with laser light L while a light-converging point P is positioned therewithin, so as to form a modified region 7 due to multiphoton absorption within the object 1, and cause the modified region 7 to form a starting point region for cutting 8 shifted from the center line CL of the thickness of the object 1 toward the front face 3 of the object 1 along a line along which the object should be cut. Subsequently, the object 1 is pressed from the rear face 21 side thereof. This can generate a fracture from the starting point region for cutting 8 acting as a start point, thereby accurately cutting the object 1 along the line along which the object should be cut.
摘要翻译：提供了一种切割能够精确地切割物体的物体的方法。在聚光点P位于其中的同时用激光L照射诸如硅晶片的物体，从而由于在物体1内由于多光子吸收而形成改质区域7，并使改质区域形成从物体1的厚度的中心线CL向物体1的前面3移动的起始点区域，沿着被切割物体的线。随后，物体1从其背面21侧被按压。这可以从作为起始点的切割起点区域8产生断裂，从而沿着物体应该被切割的线路精确地切割物体1。

70. 发明授权

US07489454B2 Laser processing device 有权
标题翻译：激光加工装置
公开(公告)号：US07489454B2
公开(公告)日：2009-02-10
申请号：US10537511
申请日：2003-12-04
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Tetsuya Osajima
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Tetsuya Osajima
IPC分类号： G02B9/00 , B23K26/06
CPC分类号： B28D1/221 , B23K26/066 , B23K26/1462 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： A laser processing apparatus which can suppress the positional fluctuation in light-converging point of laser light during laser processing is provided. On an optical path of laser light L1 connecting a beam expander 34 and a first light-transmitting hole 32 of a lens holder 29 to each other in a laser processing apparatus 20, a stop member 38 including a second light-transmitting hole 39 having the same diameter as that of the first light-transmitting hole 32 is disposed. Hence, the amount of laser light L1 cut by the surrounding part of the first light-transmitting hole 32 can substantially be eliminated, whereby the lens holder 29 can be prevented from being heated upon irradiation with the laser light L1. Also, even when the stop member 38 is heated by the laser light L1 cut by the surrounding part of the second light-transmitting hole 39, heat is prevented from being transmitted from the stop member 38 to the lens holder 29, since the stop member 38 is separated from the lens holder 29. Therefore, the positional fluctuation in light-converging point P1 of the laser light L1 during laser processing can be suppressed to a low level.
摘要翻译：提供了能够抑制激光加工时的激光的聚光点的位置波动的激光加工装置。在激光加工装置20中将光束扩展器34和透镜保持器29的第一透光孔32彼此连接的激光L1的光路上设置有具有第二透光孔39的止挡部件38，设置与第一透光孔32相同的直径。因此，可以基本上消除由第一透光孔32的周围部分切割的激光L1的量，从而可以防止在照射激光L1时透镜保持器29被加热。此外，即使当通过由第二透光孔39的周围部分切割的激光L1对止挡构件38进行加热时，由于阻挡构件38的阻挡构件38的阻挡构件因此，能够将激光加工时的激光L1的聚光点P1的位置偏移抑制到低水平。

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