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61. 发明授权

US07013561B2 Method for producing a capacitor-embedded circuit board 有权
标题翻译：电容器嵌入式电路板的制造方法
公开(公告)号：US07013561B2
公开(公告)日：2006-03-21
申请号：US10314034
申请日：2002-12-05
申请人： Seiichi Nakatani , Koichi Hirano , Mikinari Shimada , Yasuhiro Sugaya
发明人： Seiichi Nakatani , Koichi Hirano , Mikinari Shimada , Yasuhiro Sugaya
IPC分类号： H01K3/10
CPC分类号： H01G9/26 , H01L23/642 , H01L2924/0002 , H01L2924/3011 , H05K1/162 , H05K3/383 , H05K3/4614 , H05K2201/0187 , H05K2201/0355 , H05K2203/0315 , Y10T29/417 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/5313 , H01L2924/00
摘要： A capacitor-mounted metal foil of the present invention is provided with a metal foil and a plurality of capacitors formed on the metal foil. Each of the capacitors includes a conductive layer disposed above the metal foil, and a dielectric layer disposed between the metal foil and the conductive layer.
摘要翻译：本发明的电容器安装的金属箔在金属箔上设置有金属箔和多个电容器。每个电容器包括设置在金属箔上方的导电层和设置在金属箔和导电层之间的电介质层。

62. 发明授权

US07001662B2 Transfer sheet and wiring board using the same, and method of manufacturing the same 有权
标题翻译：转印片和使用其的接线板及其制造方法
公开(公告)号：US07001662B2
公开(公告)日：2006-02-21
申请号：US10804612
申请日：2004-03-18
申请人： Yasuhiro Sugaya , Hiroyuki Ishitomi , Seiichi Nakatani
发明人： Yasuhiro Sugaya , Hiroyuki Ishitomi , Seiichi Nakatani
IPC分类号： B32B7/12
CPC分类号： H05K3/382 , H05K3/06 , H05K3/20 , H05K3/4069 , H05K2201/0355 , H05K2203/0156 , H05K2203/1461 , Y10T428/12451 , Y10T428/12472 , Y10T428/24917 , Y10T428/2804 , Y10T428/2839 , Y10T428/2843 , Y10T428/31681
摘要： A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60° C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 μm or more, while a face of the wiring pattern, which is in contact with the silicone resin layer, has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.
摘要翻译：本发明的转印片包括玻璃化转变温度不低于60℃的树脂膜，形成在树脂膜上的硅树脂层和形成在硅树脂层上的金属布线图案。金属布线图案具有形成粗糙面的露出面，粗糙面的平均表面粗糙度（Rz）为2μm以上，而与硅树脂接触的布线图案的面树脂层的表面粗糙度（Rz）低于露出面。因此，本发明提供了一种转印片材，其具有能够在低温下进行转印并提高尺寸稳定性以及通孔连接可靠性的转印性能。本发明还提供一种使用转印片的布线板及其制造方法。

63. 发明申请

US20140008104A1 RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：电阻形成的基板及其制造方法
公开(公告)号：US20140008104A1
公开(公告)日：2014-01-09
申请号：US14001517
申请日：2013-01-29
申请人： Yasuhiro Sugaya , Hiroyuki Ishitomi , Tadashi Nakamura
发明人： Yasuhiro Sugaya , Hiroyuki Ishitomi , Tadashi Nakamura
IPC分类号： H05K3/30 , H05K1/16
CPC分类号： H05K3/303 , H05K1/116 , H05K1/167 , H05K3/4069 , H05K3/465 , H05K3/4652 , H05K2201/0272 , H05K2201/0317 , H05K2201/0338 , H05K2201/0355 , H05K2203/0361 , Y10T29/49155
摘要： A resistance-formed substrate includes a first insulating layer, a first wiring formed on a first surface of the first insulating layer, a thin-film resistance layer formed on a second surface of the first insulating layer, and a first via-hole conductor. The first via-hole conductor penetrates through the first insulating layer, and is electrically connected to the first wiring and the thin-film resistance layer. The first via-hole conductor includes a metal part including a low-melting point metal and a high-melting point metal, and a paste resin part. The low-melting point metal includes tin and bismuth, and has a melting point of 300° C. or lower. The high-melting point metal includes at least one of copper and silver, and has a melting point of 900° C. or higher. The first via-hole conductor is in contact with the thin-film resistance layer at both the paste resin part and the metal part.
摘要翻译：电阻形成基板包括第一绝缘层，形成在第一绝缘层的第一表面上的第一布线，形成在第一绝缘层的第二表面上的薄膜电阻层和第一通孔导体。第一通孔导体穿过第一绝缘层，并且电连接到第一布线和薄膜电阻层。第一通孔导体包括包含低熔点金属和高熔点金属的金属部分和糊状树脂部分。低熔点金属包括锡和铋，并且具有300℃或更低的熔点。高熔点金属包括铜和银中的至少一种，并且具有900℃以上的熔点。第一通孔导体在糊状树脂部分和金属部分都与薄膜电阻层接触。

64. 发明申请

US20050236103A1 Dielectric resonator, dielectric filter and method of producing the same, filter device combined to a transmit-receive antenna and communication apparatus using the same 审中-公开
标题翻译：介质谐振器，介质滤波器及其制造方法，组合到发射 - 接收天线的滤波器装置和使用其的通信装置
公开(公告)号：US20050236103A1
公开(公告)日：2005-10-27
申请号：US11148347
申请日：2005-06-09
申请人： Yasuhiro Sugaya , Tomoya Maekawa , Toru Yamada , Seiichi Nakatani
发明人： Yasuhiro Sugaya , Tomoya Maekawa , Toru Yamada , Seiichi Nakatani
IPC分类号： H01P1/203 , H01P11/00 , C09J5/00
CPC分类号： H01P1/20345 , H01P11/007 , Y10T156/1052
摘要： A dielectric resonator includes a pair of dielectric substrates opposed to each other and resonator electrodes disposed between the pair of dielectric substrates. The resonator electrodes are disposed so as to be brought into contact with major surfaces of the pair of dielectric substrates, and a bonding layer is disposed around the resonator electrodes so as to bond the pair of dielectric substrates. The pair of dielectric substrates have been sintered in advance at sufficiently high temperature which is a dielectric having an fQ value at 1 GHz in the range of 3×103 to 1×105, and then achieve a high Q value as a filter. The pair of the substrates are provided with a surface roughness of a range of 0.1 to 2.0 μm, and flatness of 10 μm or less between both ends thereof to bring the resonant electrodes in close contact with the surfaces of the substrate. Such ceramic filters are used comfortably for a filter connecting a transmit-receive antenna to a transmitter and receiver, which can provide communication equipment having a good high frequency performance for cellular telephone systems.
摘要翻译：介质谐振器包括彼此相对的一对电介质基板和设置在该对电介质基板之间的谐振器电极。谐振器电极设置成与一对电介质基板的主表面接触，并且在谐振器电极周围设置接合层，以便结合该对电介质基板。预先将这对电介质基片预先烧成足够高的温度，该电介质具有3×10 3〜1×10 5范围内的1GHz的fQ值，然后实现高Q值作为滤波器。一对基板的两端之间的表面粗糙度为0.1〜2.0μm，平坦度为10μm以下，使谐振电极与基板的表面紧密接触。这种陶瓷滤波器被舒适地用于将发射 - 接收天线连接到发射机和接收机的滤波器，其可以为蜂窝电话系统提供具有良好高频性能的通信设备。

65. 发明授权

US5238507A Magnetic material 失效
标题翻译：磁性材料
公开(公告)号：US5238507A
公开(公告)日：1993-08-24
申请号：US535082
申请日：1990-06-08
申请人： Koichi Kugimiya , Yasuhiro Sugaya , Osamu Inoue , Ken Hirota , Mitsuo Satomi
发明人： Koichi Kugimiya , Yasuhiro Sugaya , Osamu Inoue , Ken Hirota , Mitsuo Satomi
IPC分类号： G11B5/133 , G11B5/193 , H01F1/08 , H01F1/24
CPC分类号： G11B5/133 , G11B5/193 , H01F1/083 , H01F1/24 , Y10S428/90 , Y10T428/115 , Y10T428/249956 , Y10T428/2991
摘要： A magnetic material is provided which includes a discrete phase including grains made of a first substance which comprises a magnetic metal; and a continuous phase including a thin coating film made of a second substance which comprises a dielectric or insulating substance. The thin coating film is formed on the surface of the grains and has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film.

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