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    • 62. 发明申请
    • Molded chip fabrication method and apparatus
    • 成型芯片制造方法和装置
    • US20050062140A1
    • 2005-03-24
    • US10666399
    • 2003-09-18
    • Michael LeungEric TarsaJames Ibbetson
    • Michael LeungEric TarsaJames Ibbetson
    • H01L21/56H01L33/50H01L23/02
    • H01L33/504H01L21/565H01L24/96H01L27/15H01L33/50H01L2224/2518H01L2924/12041H01L2924/181H01L2924/1815H01L2933/0041H01L2924/00
    • A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.
    • 一种用于涂覆多个半导体器件的方法和设备,其特别适用于涂覆含有转化颗粒的涂层材料的LED。 根据本发明的一种方法包括提供具有地层腔的模具。 多个半导体器件安装在模具形成腔内,并且可固化涂层材料被注入或以其它方式被引入到模具中以填充模具形成腔并且至少部分地覆盖半导体器件。 固化涂层材料,使得半导体器件至少部分地嵌入固化的涂层材料中。 具有嵌入式半导体器件的固化的涂层材料从形成腔中移除。 半导体器件被分离成使得每个半导体器件至少部分被固化的涂层材料层覆盖。 根据本发明的用于涂覆多个半导体器件的设备的一个实施例包括具有布置成保持半导体器件的形成空腔的模具外壳。 形成空腔也被布置成使得可固化的涂层材料可以注入并填充地层腔以至少部分地覆盖半导体器件。