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    • 66. 发明授权
    • Factor taking part in transcription control
    • 参与转录控制的因子
    • US08889408B2
    • 2014-11-18
    • US13296878
    • 2011-11-15
    • Shuki MizutaniTakayuki Yamada
    • Shuki MizutaniTakayuki Yamada
    • C12N15/85C12N15/11C07K14/47
    • C07K14/4702
    • HDART binds with HDAC (histone deacetylase) and functions as a repressor. HDART directly binds with Skip, which functions as a transcription co-activator of nuclear receptors, to repress the transcription by the nuclear receptor. Moreover, HDART is a transcription co-repressor of nuclear receptors, and binds with HDAC wherein transcription can be strongly repressed through the histone deacetylization of HDAC. On the other hand, a dominant negative peptide of HDART can be obtained, and it has been confirmed that, in contrast with the full-length HDART protein, this peptide activates transcription. In particular, the ability of this peptide to activate transcription by the retinoic acid receptor exceeds that of all-trans retinoic acid (ATRA).
    • HDART与HDAC结合(组蛋白脱乙酰酶),起到阻遏物的作用。 HDART与作为核受体的转录共激活子的Skip直接结合,以抑制核受体的转录。 此外,HDART是核受体的转录共抑制因子,并与HDAC结合,其中可以通过HDAC的组蛋白脱乙酰化强烈抑制转录。 另一方面,可以获得HDART的显性负性肽,并且已经证实,与全长HDART蛋白质相反,该肽激活转录。 特别地,该肽激活视黄酸受体转录的能力超过全反式视黄酸(ATRA)的能力。
    • 68. 发明授权
    • Semiconductor device having gate insulating film including high dielectric material
    • 具有包括高电介质材料的栅极绝缘膜的半导体器件
    • US08558321B2
    • 2013-10-15
    • US13005085
    • 2011-01-12
    • Hiroji ShimizuYoshihiro SatoHideyuki AraiTakayuki YamadaTsutomu Oosuka
    • Hiroji ShimizuYoshihiro SatoHideyuki AraiTakayuki YamadaTsutomu Oosuka
    • H01L21/40
    • H01L27/0629H01L28/20
    • A semiconductor device includes: a first MIS transistor of a first conductivity type having a first active region as a region of a semiconductor substrate surrounded by an element isolation region formed in an upper portion of the semiconductor substrate, a first gate insulating film having a first high dielectric film formed on the first active region, and a first gate electrode formed on the first gate insulating film; and a resistance element having a second high dielectric film formed on the element isolation region and a resistance layer made of silicon formed on the second high dielectric film. The first high dielectric film and the second high dielectric film include the same high dielectric material, and the first high dielectric film includes a first adjustment metal, but the second high dielectric film does not include the first adjustment metal.
    • 一种半导体器件包括:第一导电类型的第一MIS晶体管,具有作为由半导体衬底的上部形成的元件隔离区围绕的半导体衬底的区域的第一有源区,第一栅绝缘膜, 形成在第一有源区上的高电介质膜和形成在第一栅极绝缘膜上的第一栅电极; 以及电阻元件,其具有形成在元件隔离区域上的第二高电介质膜和形成在第二高介电膜上的由硅制成的电阻层。 第一高介电膜和第二高电介质膜包括相同的高介电材料,第一高电介质膜包括第一调节金属,但第二高电介质膜不包括第一调节金属。
    • 70. 发明授权
    • Semiconductor device and fabrication method for the same
    • 半导体器件及其制造方法相同
    • US08395219B2
    • 2013-03-12
    • US13167362
    • 2011-06-23
    • Riichirou MitsuhashiTakayuki Yamada
    • Riichirou MitsuhashiTakayuki Yamada
    • H01L21/70
    • H01L21/82345H01L21/823462H01L21/823842H01L21/823857H01L29/4966H01L29/513H01L29/517
    • The semiconductor device includes a first transistor and a second transistor formed in a semiconductor substrate. The first transistor includes: a first gate insulating film formed on the semiconductor substrate; and a first gate electrode formed on the first gate insulating film. The second transistor includes: a second gate insulating film formed on the semiconductor substrate; and a second gate electrode formed on the second gate insulating film. The first gate insulating film includes a first insulating material with a first element diffused therein, the second gate insulating film includes the first insulating material, and the amount of the first element contained in the first gate insulating film is greater than the amount of the first element contained in the second gate insulating film.
    • 半导体器件包括形成在半导体衬底中的第一晶体管和第二晶体管。 第一晶体管包括:形成在半导体衬底上的第一栅极绝缘膜; 以及形成在第一栅极绝缘膜上的第一栅电极。 第二晶体管包括:形成在半导体衬底上的第二栅极绝缘膜; 以及形成在第二栅极绝缘膜上的第二栅电极。 所述第一栅极绝缘膜包括第一绝缘材料,其中扩散有第一元素,所述第二栅极绝缘膜包括所述第一绝缘材料,并且所述第一栅极绝缘膜中包含的所述第一元素的量大于所述第一绝缘膜的量 元件包含在第二栅极绝缘膜中。