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61. 发明授权

US07335529B2 Manufacturing method of a semiconductor device utilizing a flexible adhesive tape 有权
标题翻译：利用柔性胶带的半导体器件的制造方法
公开(公告)号：US07335529B2
公开(公告)日：2008-02-26
申请号：US10510679
申请日：2003-04-07
申请人： Yoshinori Miyaki , Yoshihiko Shimanuki , Hiromichi Suzuki , Fujio Ito
发明人： Yoshinori Miyaki , Yoshihiko Shimanuki , Hiromichi Suzuki , Fujio Ito
IPC分类号： H01L21/16
CPC分类号： H01L21/568 , H01L21/561 , H01L21/566 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0657 , H01L2221/68331 , H01L2224/05554 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48245 , H01L2224/48247 , H01L2224/49171 , H01L2224/85001 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06582 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/07802 , H01L2924/10162 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing a thin, small-sized, inexpensive, non-leaded, resin-sealed type semiconductor device is disclosed. A flexible tape having plural terminals peelably through a first adhesive in a product forming portion formed on a main surface of the tape is provided, a semiconductor element is fixed to the main surface of the tape peelably through a second adhesive, electrodes formed on the semiconductor element and the terminals are connected together through conductive wires, an insulating resin layer is formed in an area including the semiconductor element and the wires on the main surface of the tape to cover the semiconductor element and the wires, and the tape on a back surface of the insulating resin layer is peeled, allowing the terminals to be exposed to the back surface of the insulating resin layer. Exposed surfaces of the terminals are each formed by a gold layer. The terminals each comprise a main metal layer of copper foil and one or plural auxiliary metal layers formed on each of a main surface and a back surface of the main metal layer. The auxiliary metal layer(s) on the main surface of the main metal layer is (are) formed using a material which affords a rough surface, thereby roughening the main surface side of each terminal.
摘要翻译：公开了制造薄型，小型，便宜，无铅的树脂密封型半导体器件的方法。提供了一种具有多个端子的可挠性带，其通过形成在带的主表面上的产品形成部分中的第一粘合剂可剥离，半导体元件通过第二粘合剂可剥离地固定到带的主表面上，形成在半导体元件和端子通过导线连接在一起，在包括半导体元件的区域和带的主表面上的电线的区域中形成绝缘树脂层以覆盖半导体元件和电线，并且带在背面的绝缘树脂层被剥离，使端子暴露于绝缘树脂层的背面。端子的露出面均由金层形成。端子各自包括铜箔的主金属层和形成在主金属层的主表面和后表面中的每一个上的一个或多个辅助金属层。使用提供粗糙表面的材料形成主金属层主表面上的辅助金属层，从而粗糙化每个端子的主表面侧。

62. 发明授权

US07261207B2 Method for carrying a semiconductor device 有权
标题翻译：携带半导体器件的方法
公开(公告)号：US07261207B2
公开(公告)日：2007-08-28
申请号：US10770581
申请日：2004-02-04
申请人： Hiromichi Suzuki , Wahei Kitamura , Tokuji Toida , Toshimasa Shirai
发明人： Hiromichi Suzuki , Wahei Kitamura , Tokuji Toida , Toshimasa Shirai
IPC分类号： B65D85/48
CPC分类号： H01L21/67294 , G05B19/128 , G05B2219/31095 , Y02P90/10 , Y10S414/14 , Y10T29/49121 , Y10T29/4913 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178
摘要： A method for carrying a semiconductor device includes: (a) providing semiconductor devices each having a main surface, a back surface, and a plurality of external terminals; (b) providing a tray having a front surface, a rear surface, an electronic tag imbedded in the tray, first concaved portions formed on the front surface, second concaved portions formed on the rear surface, the electronic tag constituted by a non-contact recognition type chip having a memory circuit in which recognizable information is stored, a depth of the first concaved portion is deeper than a depth of the second concaved portion; (c) housing the semiconductor devices into the first concaved portions respectively in such a manner that the back surface of the semiconductor device being oppose to a bottom of the first concaved portion; and (d) carrying the tray with the semiconductor devices.
摘要翻译：一种用于承载半导体器件的方法包括：（a）提供各自具有主表面，背表面和多个外部端子的半导体器件; （b）提供具有前表面，后表面，嵌入在托盘中的电子标签的托盘，形成在前表面上的第一凹部，形成在后表面上的第二凹部，由非接触形成的电子标签识别型芯片，其具有存储可识别信息的存储电路，所述第一凹部的深度比所述第二凹部的深度深; （c）分别将半导体器件分别容纳在第一凹部中，使得半导体器件的背面相对于第一凹部的底部; 和（d）用半导体器件托盘。

63. 发明申请

US20070004092A1 Semiconductor device manufacturing method 审中-公开
标题翻译：半导体器件制造方法
公开(公告)号：US20070004092A1
公开(公告)日：2007-01-04
申请号：US10569735
申请日：2003-08-29
申请人： Hiromichi Suzuki , Fujio Ito , Toshio Sasaki
发明人： Hiromichi Suzuki , Fujio Ito , Toshio Sasaki
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L21/565 , H01L23/4334 , H01L23/49558 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2924/00012
摘要： This manufacturing method of a semiconductor device prepares a lead frame to which a heat spreader, and the tip parts of a plurality of inner leads were joined via a thermoplastic insulating binding material, arranges a lead frame on a heat stage, and joins the semiconductor chip to the heat spreader via the thermoplastic binding material which was heated and softened after having arranged the semiconductor chip on the heat spreader. Die bonding can be performed without scattering inner leads by joining the semiconductor chip and the thermoplastic binding material, suppressing the tip parts of the inner leads to the heat stage side. Improvement in the assembling property of a semiconductor device can be aimed at.
摘要翻译：这种半导体装置的制造方法准备一个引线框架，散热器和多个内部引线的末端部分通过热塑性绝缘粘合材料接合，将引线框架布置在热台上，并连接半导体芯片通过在将散热器上布置半导体芯片之后被加热和软化的热塑性粘合材料到散热器。可以通过接合半导体芯片和热塑性粘合材料而不会使内部引线散射，从而将内部引线的顶端部分抑制到加热台侧来进行晶片接合。可以针对半导体器件的组装性能的改进。

64. 发明申请

US20070001271A1 Lead frame and method of manufacturing the lead frame 失效
标题翻译：引线框架和引线框架的制造方法
公开(公告)号：US20070001271A1
公开(公告)日：2007-01-04
申请号：US10569577
申请日：2003-08-29
申请人： Fujio Ito , Hiromichi Suzuki , Toshio Sasaki
发明人： Fujio Ito , Hiromichi Suzuki , Toshio Sasaki
IPC分类号： H01L23/495
CPC分类号： H01L23/49541 , H01L21/4842 , H01L23/49558 , H01L2924/0002 , H01L2924/00
摘要： A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.
摘要翻译：多个内部引线，多个外部引线，每个外部引线与内部引线中的每一个形成一个，方形环形状的引脚布置在多个内部引线内;角部引线，其设置在内部引线之间所述内引线组的与所述棒引线的每一侧相对应的四个内引线组中相邻的所述内引线组的端部与所述引线连接，以及与所述内引线的前端接合的带部件，并包括角落部分铅。由于角部引线形成为在相邻的内引线组之间加强框架体的对象，所以可以提高引线框架的刚性。

65. 发明授权

US07158820B2 Mobile communication terminal 失效
标题翻译：移动通信终端
公开(公告)号：US07158820B2
公开(公告)日：2007-01-02
申请号：US10948876
申请日：2004-09-24
申请人： Hiromichi Suzuki , Takashi Amano
发明人： Hiromichi Suzuki , Takashi Amano
IPC分类号： H04M1/00
CPC分类号： H01Q1/243 , H01Q1/245 , H01Q5/371 , H01Q5/378 , H01Q7/00
摘要： A mobile communication terminal of a portable telephone is housed in a casing having a first surface. A receiver section of the portable telephone capable of generating a voice is arranged on the first surface. A two-wavelength loop antenna arranged on a plane substantially parallel to the first plane and formed of a looped line having a right section and a left section that are in symmetry with respect to an imaginary vertical symmetric line is housed in the casing. A power supply point for supplying an electric power to the loop antenna is arranged in the vicinity of the intersection between the symmetric line and the looped line.
摘要翻译：便携式电话的移动通信终端被容纳在具有第一表面的壳体中。能够产生声音的便携式电话的接收器部分布置在第一表面上。布置在基本上平行于第一平面并且具有相对于虚拟垂直对称线对称的右部分和左部分的环形线的平面上的双波长环形天线被容纳在壳体中。用于向环形天线提供电力的电源点布置在对称线和环形线之间的交叉点附近。

66. 发明授权

US06962836B2 Method of manufacturing a semiconductor device having leads stabilized during die mounting 有权
标题翻译：具有在管芯安装期间稳定的引线的半导体器件的制造方法
公开(公告)号：US06962836B2
公开(公告)日：2005-11-08
申请号：US10644919
申请日：2003-08-21
申请人： Yoshinori Miyaki , Hiromichi Suzuki
发明人： Yoshinori Miyaki , Hiromichi Suzuki
IPC分类号： H01L23/50 , H01L23/495 , H01L21/48 , H01L21/44
CPC分类号： H01L23/49506 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01039 , H01L2924/01057 , H01L2924/01079 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device comprises a plurality of inner leads extending around a semiconductor chip, a tape substrate supporting the semiconductor chip and joined to respective end portions of the inner leads, wires connecting the inner leads and pads formed on a main surface of the semiconductor chip, a seal portion formed by resin-sealing the semiconductor chip and the wires, and a plurality of outer leads linking in a line with the inner leads and protruded from the seal portion to the exterior of four directions. A relationship between a length (a) of a shorter side of the semiconductor chip and a clearance (b) from the semiconductor chip, to a tip of the inner leads arranged at the farthest location from the semiconductor chip is a≦2b. It is possible to attain a narrow pad pitch, and mount the semiconductor chip formed in a small size, and standardize the lead frame.
摘要翻译：一种半导体器件，包括：半导体芯片周围延伸的多个内引线;支撑该半导体芯片的带基片，并与内引线的各端部连接，连接形成在半导体芯片主表面上的内引线和焊盘; 通过树脂密封半导体芯片和电线形成的密封部分，以及与内部引线成一直线并且从密封部分向四个方向外部突出的多个外部引线。半导体芯片的短边的长度（a）与半导体芯片的间隙（b）与布置在离半导体芯片最远的位置的内部引线的尖端之间的关系为<= 2b。可以获得窄的焊盘间距，并且安装形成为小尺寸的半导体芯片，并且使引线框架标准化。

67. 发明授权

US06803258B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06803258B2
公开(公告)日：2004-10-12
申请号：US10152727
申请日：2002-05-23
申请人： Fujio Ito , Hiroaki Tanaka , Hiromichi Suzuki , Tokuji Toida , Takafumi Konno , Kunihiro Tsubosaki , Shigeki Tanaka , Kazunari Suzuki , Akihiko Kameoka
发明人： Fujio Ito , Hiroaki Tanaka , Hiromichi Suzuki , Tokuji Toida , Takafumi Konno , Kunihiro Tsubosaki , Shigeki Tanaka , Kazunari Suzuki , Akihiko Kameoka
IPC分类号： H01L2150
CPC分类号： H01L24/32 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/29007 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/85385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/0132 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/00012 , H01L2924/3512 , H01L2224/85399 , H01L2224/05599
摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w
摘要翻译：在具有散热板的半导体器件中，连接到半导体芯片的内部引线的尖端具有引线宽度w和引线厚度t，宽度小于厚度。内引线固定在散热板上。将内部引线固定到散热板上，支撑后者，并且不需要悬挂引线。引线间距p，连接到半导体芯片的内引线头的引线宽度w和引线厚度t具有w

68. 发明授权

US06791182B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06791182B2
公开(公告)日：2004-09-14
申请号：US10103799
申请日：2002-03-25
申请人： Junpei Kusukawa , Ryozo Takeuchi , Toshiaki Ishii , Hiromichi Suzuki , Fujio Ito , Takafumi Nishita , Akihiko Kameoka , Masaru Yamada
发明人： Junpei Kusukawa , Ryozo Takeuchi , Toshiaki Ishii , Hiromichi Suzuki , Fujio Ito , Takafumi Nishita , Akihiko Kameoka , Masaru Yamada
IPC分类号： H01L2310
CPC分类号： H01L23/564 , H01L23/3128 , H01L23/4334 , H01L23/49582 , H01L23/49816 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： At least a part of the inner leads 1a of a lead frame 1 is covered with a plating for a metallic fine wire connection, at least the entire portion where the lead frame 1 joins with the adhesive layer 2 is covered by at least one metal or alloy thereof different from the metallic fine wire connecting use plating. The metal or alloy is selected from the group consisting of gold, platinum, iridium, rhodium, palladium, ruthenium, indium, tin, molybdenum, tungsten, gallium, zinc, chromium, niobium, tantalum, titanium and zirconium. Thereby, generation of defects, such as leakage and shorting, due to ion migration can be prevented.
摘要翻译：引线框架1的内部引线1a的至少一部分被用金属细线连接的电镀覆盖，至少引线框架1与粘合剂层2连接的整个部分被至少一种金属或它们与金属细线不同的连接用电镀的合金。金属或合金选自金，铂，铱，铑，钯，钌，铟，锡，钼，钨，镓，锌，铬，铌，钽，钛和锆。因此，可以防止由于离子迁移而产生诸如泄漏和短路的缺陷。

69. 发明授权

US06274359B1 25-hydroxyvitamin D3-1&agr;-hydroxylase and DNA encoding the hydroxylase 失效
标题翻译： 25-羟基维生素D3-1alpha-羟化酶和编码羟化酶的DNA
公开(公告)号：US06274359B1
公开(公告)日：2001-08-14
申请号：US09111730
申请日：1998-07-08
申请人： Hideharu Anazawa , Hiroko Shimada , Seiji Sugimoto , Tatsuo Suda , Toshimasa Shinki , Takao Saruta , Yuzuru Ishimura , Matsuhiko Hayashi , Shu Wakino , Toshiaki Monkawa , Tadashi Yoshida , Hiromichi Suzuki
发明人： Hideharu Anazawa , Hiroko Shimada , Seiji Sugimoto , Tatsuo Suda , Toshimasa Shinki , Takao Saruta , Yuzuru Ishimura , Matsuhiko Hayashi , Shu Wakino , Toshiaki Monkawa , Tadashi Yoshida , Hiromichi Suzuki
IPC分类号： C12N902
CPC分类号： C12N9/0071 , A01K2217/05 , A61K38/00 , A61K39/00
摘要： The present invention relates to a polypeptide having 25-hydroxyvitamin D3-1&agr;-hydroxylase activity, being useful for the prevention, diagnosis and therapeutic treatment of adult diseases such as osteoporosis induced by the decrease of active type vitamin D3 and catalyzing the final stage of vitamin D3 activation; and the gene encoding the polypeptide. In accordance with the present invention, the following can be provided; a polypeptide having 25-hydroxyvitamin D3-1&agr;-hydroxylase activity, DNA encoding the polypeptide, a recombinant DNA prepared by inserting the DNA in a vector, a transformant carrying the recombinant DNA, a method for preparing 25-hydroxyvitamin D3-1&agr;-hydroxylase by using the transformant, a method for preparing 1&agr;, 25-dihydroxyvitamin D3 comprising using the polypeptide having 25-hydroxyvitamin D3-1&agr;-hydroxylase activity, and an antibody recognizing the polypeptide.
摘要翻译：本发明涉及具有25-羟基维生素D3-1alpha-羟化酶活性的多肽，可用于预防，诊断和治疗成人疾病如由活性型维生素D3的减少引起的骨质疏松症并催化维生素的最终阶段 D3激活; 和编码多肽的基因。根据本发明，可以提供以下：具有25-羟基维生素D3-1alpha-羟化酶活性的多肽，编码该多肽的DNA，通过将DNA插入载体制备的重组DNA，携带重组DNA的转化体，通过以下方法制备25-羟基维生素D3-1alpha-羟化酶的方法使用转化体，制备包含使用具有25-羟基维生素D3-1α-羟化酶活性的多肽的1α，25-二羟基维生素D 3的方法和识别该多肽的抗体。

70. 发明授权

US06260026B1 Credit card information management system 失效
标题翻译：信用卡信息管理系统
公开(公告)号：US06260026B1
公开(公告)日：2001-07-10
申请号：US08900839
申请日：1997-07-25
申请人： Yoshikazu Tomida , Tatsuo Hiramatsu , Naruto Nishimura , Hironori Mitoh , Seiji Suzuki , Masahiro Sata , Masahiro Seto , Ryuuji Yoshihara , Hiromichi Suzuki , Tadashi Etoh
发明人： Yoshikazu Tomida , Tatsuo Hiramatsu , Naruto Nishimura , Hironori Mitoh , Seiji Suzuki , Masahiro Sata , Masahiro Seto , Ryuuji Yoshihara , Hiromichi Suzuki , Tadashi Etoh
IPC分类号： G06F1760
CPC分类号： G07F7/08 , G06Q20/04 , G06Q20/20 , G06Q20/204 , G06Q20/403 , G06Q40/025 , G07F7/1008
摘要： The credit card information management system checks the creditability of a credit card intended to be used for purchase of goods or service by using the card information owned by member stores of credit companies. A host computer of the card management center outputs information regarding the validity or invalidity of a credit card of a customer member of a credit company as card information, a transmission facility wirelessly transmits digital data of the card information. A receiving facility of a member store receives radio signals of the card information and checks whether or not there is any missing of data. If any missing occurs, a transfer of the missed data is requested to the host computer. A terminal computer extracts only the card information necessary for one's own store from the data outputted by the host computer and data outputted in response to the transfer request and stores the same in memory, and the terminal computer outputs judgement of validity or invalidity of a credit card inputted into a card reader.
摘要翻译：信用卡信息管理系统通过使用信用公司会员商店所拥有的信用卡信息来检查旨在用于购买商品或服务的信用卡的可信度。卡管理中心的主计算机输出有关信用卡客户成员的信用卡的有效性或无效信息作为卡信息，传输设备无线发送卡信息的数字数据。成员商店的接收设施接收卡信息的无线电信号，并检查是否有数据丢失。如果发生任何缺失，则向主计算机请求丢失数据的传输。终端计算机仅从主计算机输出的数据中提取自己存储所需的卡信息，并根据转移请求输出数据，并将其存储在存储器中，终端计算机输出信用证的有效性或无效判定卡输入到读卡器。

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