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61. 发明申请

US20050064679A1 Consolidatable composite materials, articles of manufacture formed therefrom, and fabrication methods 审中-公开
标题翻译：可固化复合材料，由其制成的制品及其制造方法
公开(公告)号：US20050064679A1
公开(公告)日：2005-03-24
申请号：US10928381
申请日：2004-08-27
申请人： Warren Farnworth , Alan Wood
发明人： Warren Farnworth , Alan Wood
IPC分类号： E21B43/02 , G03F7/00 , G03F7/004 , H01L21/30 , H01L21/46
CPC分类号： G03F7/0037 , G03F7/0047
摘要： A composite material includes an unconsolidated, consolidatable component and a physical modifier component. The consolidatable component is configured to be selectively consolidated to form an article, while the physical modifier component provides desired physical properties. The physical modifier component may be an unconsolidated material dispersed throughout the consolidatable component or a preformed matrix including interstices within which the consolidatable component may be introduced. The consolidatable component of the composite material may be selectively consolidated to fix the at least one physical component therein. Alternatively, the consolidatable component may be nonselectively consolidated, then regions thereof selectively removed. Methods for fabricating articles from such composite materials are also disclosed, as are systems that are configured for use in fabricating articles from such composite materials.
摘要翻译：复合材料包括未固结的，可固结的组分和物理改性剂组分。可整合组件被配置为选择性地合并以形成物品，而物理修饰剂组分提供期望的物理性质。物理改性剂组分可以是分散在整个可整合组分中的未固结的材料或预先形成的基质，其中可以引入可固结组分的间隙。可以选择性地将复合材料的可固结部件固结以固定其中的至少一种物理组分。或者，可固化组分可以非选择性地固结，然后其区域被选择性地去除。还公开了从这种复合材料制造制品的方法，以及被配置用于从这种复合材料制造制品的系统。

62. 发明申请

US20070132104A1 Semiconductor component having plate, stacked dice and conductive vias 失效
标题翻译：半导体元件具有板，堆叠的骰子和导电通孔
公开(公告)号：US20070132104A1
公开(公告)日：2007-06-14
申请号：US11701927
申请日：2007-02-02
申请人： Warren Farnworth , Alan Wood , William Hiatt , James Wark , David Hembree , Kyle Kirby , Pete Benson
发明人： Warren Farnworth , Alan Wood , William Hiatt , James Wark , David Hembree , Kyle Kirby , Pete Benson
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/561 , B33Y70/00 , B33Y80/00 , H01L21/563 , H01L21/76898 , H01L23/3114 , H01L23/481 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2221/68331 , H01L2224/02372 , H01L2224/0401 , H01L2224/05111 , H01L2224/05118 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05178 , H01L2224/0518 , H01L2224/05181 , H01L2224/05184 , H01L2224/05559 , H01L2224/05569 , H01L2224/05572 , H01L2224/05624 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/13005 , H01L2224/13006 , H01L2224/13009 , H01L2224/13024 , H01L2224/13099 , H01L2224/16145 , H01L2224/73204 , H01L2224/97 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2225/06582 , H01L2225/06596 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/18161 , H01L2924/19015 , H01L2924/19041 , H01L2924/351 , H01L2924/207 , H01L2224/05552 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the base die. The component also includes an array of terminal contacts on the circuit side of the base die in electrical communication with the conductive vias. The component can also include an encapsulant on the back side of the base die, which substantially encapsulates the secondary die, and a polymer layer on the circuit side of the base die which functions as a protective layer, a rigidifying member and a stencil for forming the terminal contacts. A method for fabricating the component includes the step of bonding singulated secondary dice to base dice on a base wafer, or bonding a secondary wafer to the base wafer, or bonding singulated secondary dice to singulated base dice.
摘要翻译：半导体部件包括基模和层叠在基模上的二次模。基模具包括形成用于部件的内部信号传输系统的导电通孔，并允许二次管芯的电路侧接合到基座的后侧。该组件还包括与导电通孔电连通的基座芯片的电路侧上的端子触点阵列。该组件还可以包括在基模的背侧上的密封剂，其基本上封装次模，以及在用作保护层的基模的电路侧上的聚合物层，用于形成的用于固化的模板终端接触。一种用于制造该部件的方法包括将单个二次骰子接合到基底晶片上的基底骰子上，或将次晶片接合到基底晶片，或将单个二次骰子接合到单个基体骰子的步骤。

63. 发明申请

US20070045808A1 Test carrier for semiconductor components having conductors defined by grooves 有权
标题翻译：具有由槽限定的导体的半导体部件的测试载体
公开(公告)号：US20070045808A1
公开(公告)日：2007-03-01
申请号：US11591744
申请日：2006-11-02
申请人： Warren Farnworth , Alan Wood
发明人： Warren Farnworth , Alan Wood
IPC分类号： H01L21/44 , H01L23/48 , H01L23/52
CPC分类号： H01L23/3128 , G01R1/0483 , G01R3/00 , G01R31/2867 , H01L21/4846 , H01L23/32 , H01L23/49816 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/72 , H01L2224/05554 , H01L2224/05599 , H01L2224/48227 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10161 , H01L2924/12042 , H01L2924/3011 , H01L2924/30111 , H05K1/0218 , H05K1/113 , H05K3/027 , H05K2201/09363 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A test carrier for a semiconductor component includes a base for retaining the component, and an interconnect on the base having contacts configured to electrically engage component contacts on the component. The base includes conductors in electrical communication with the contacts on the interconnect, which are defined by grooves in a conductive layer. In addition, the conductors include first portions of the conductive layer configured for electrical transmission, which are separated from one another by second portions of the conductive layer configured for no electrical transmission. The test carrier is configured for mounting to a burn in board in electrical communication with a test circuitry configured to apply test signals through the contacts on the interconnect to the component.
摘要翻译：用于半导体部件的测试载体包括用于保持部件的基座和在基部上的互连件，其具有被构造成电接合部件上的部件触点的触点。基座包括与互连上的触点电连通的导体，其由导电层中的沟槽限定。此外，导体包括被配置用于电传输的导电层的第一部分，它们被配置为不进行电传输的导电层的第二部分彼此分离。测试载体被配置为安装到板上的燃烧，与测试电路电连通，该测试电路经配置以通过互连件上的触点施加测试信号到组件。

64. 发明申请

US20060244475A1 Compliant contact pin test assembly and methods thereof 有权
标题翻译：符合接触针测试组件及其方法
公开(公告)号：US20060244475A1
公开(公告)日：2006-11-02
申请号：US11477217
申请日：2006-06-29
申请人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
发明人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
IPC分类号： G01R31/26
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly and a contactor card and methods for testing therewith are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.
摘要翻译：提供了一种柔性接触销组件和接触器卡以及用于测试的方法。柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

65. 发明申请

US20060118953A1 Semiconductor component having thinned die with conductive vias 有权
标题翻译：半导体元件具有导电通孔的薄模
公开(公告)号：US20060118953A1
公开(公告)日：2006-06-08
申请号：US11339177
申请日：2006-01-20
申请人： Warren Farnworth , Alan Wood , Trung Doan
发明人： Warren Farnworth , Alan Wood , Trung Doan
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/48 , B33Y70/00 , B33Y80/00 , H01L21/304 , H01L21/3043 , H01L21/56 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L21/76802 , H01L21/76898 , H01L21/78 , H01L23/24 , H01L23/3114 , H01L23/36 , H01L23/3672 , H01L23/481 , H01L23/49531 , H01L23/49575 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/94 , H01L24/96 , H01L25/105 , H01L25/50 , H01L29/0657 , H01L2221/68327 , H01L2221/68331 , H01L2221/68372 , H01L2224/0401 , H01L2224/05599 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/13009 , H01L2224/13022 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/16235 , H01L2224/274 , H01L2224/73104 , H01L2224/73253 , H01L2224/94 , H01L2225/06541 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/27
摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.
摘要翻译：半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

66. 发明申请

US20060115926A1 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials 有权
标题翻译：使用有机金属层和可流动的可固化导电材料形成导电元件的方法
公开(公告)号：US20060115926A1
公开(公告)日：2006-06-01
申请号：US11336540
申请日：2006-01-20
申请人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
发明人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
IPC分类号： H01L21/50
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.
摘要翻译：通过在基板表面的至少一部分上形成有机金属层，加热部分有机金属层，去除有机金属层的未加热部分，在基板上形成导电元件。在其他方法中，可流动的未固化的导电材料可以沉积在基底的表面上，可流动的未固化的导电材料可以选择性地固化在基底表面的至少一部分上，并且一部分固化的导电材料可能被删除。通过至少部分地穿过衬底的厚度形成孔，在孔的至少一部分内沉积有机金属材料并选择性地加热至少一部分有机金属材料来形成导电通孔。

67. 发明申请

US20060115925A1 Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material 有权
标题翻译：制造微透镜的方法包括选择性固化可流动的未固化光学透射材料
公开(公告)号：US20060115925A1
公开(公告)日：2006-06-01
申请号：US11336228
申请日：2006-01-20
申请人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
发明人： Alan Wood , Warren Farnworth , Charles Watkins , Peter Benson
IPC分类号： H01L21/50
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： A microlens for use in an imaging device may be fabricated by disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate, selectively curing at least a portion of the flowable, uncured optically transmissive material, and removing the flowable, uncured optically transmissive material from the surface of the substrate.
摘要翻译：用于成像装置的微透镜可以通过将至少一层中的可流动的未固化的光学透射材料设置在基板的表面上来选择性地固化可流动的未固化的光学透射材料的至少一部分，可流动的，未固化的光学透射材料。

68. 发明申请

US20060040421A1 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers 有权
公开(公告)号：US20060040421A1
公开(公告)日：2006-02-23
申请号：US10922192
申请日：2004-08-19
申请人： Warren Farnworth , Alan Wood , James Wark , David Hembree , Rickie Lake
发明人： Warren Farnworth , Alan Wood , James Wark , David Hembree , Rickie Lake
IPC分类号： H01L21/50
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L27/14634 , H01L27/14683 , H01L2224/48227 , H01L2224/48091 , H01L2924/00014
摘要： Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web. As such, the web does not outgas contaminants into the compartments in which the image sensors are housed.

69. 发明申请

US20050278056A1 Machine vision systems for use with programmable material consolidation system and associated methods and structures 有权
标题翻译：机器视觉系统用于可编程材料合并系统及相关方法和结构
公开(公告)号：US20050278056A1
公开(公告)日：2005-12-15
申请号：US10867258
申请日：2004-06-14
申请人： Warren Farnworth , Alan Wood
发明人： Warren Farnworth , Alan Wood
IPC分类号： B29C67/00 , G03F7/20 , G06F19/00 , H01L21/60 , H01L51/00
CPC分类号： H01L24/76 , B29C64/112 , B29C64/129 , B33Y40/00 , G03F7/70416 , H01L24/82 , H01L51/0005 , H01L2924/01033 , H01L2924/01049 , H01L2924/0106 , H01L2924/01077 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： Programmable material consolidation systems employing a machine vision system for in combination with a 3-D printing system for accurately locating a position over a support element and optionally on a substrate on the support element, and forming structural features thereon. By use of the machine vision system, the precise location on a substrate or support element may be determined and communicated to the dispense element of the 3-D printing system such that a flowable material may be deposited and consolidated at a desired location to form a structural feature. Methods for forming various features and structures on a substrate employing the systems of the present invention are also disclosed.
摘要翻译：可编程材料固结系统采用机器视觉系统，与3-D打印系统组合，用于精确地定位支撑元件上的位置，并可选地在支撑元件上的基板上，并在其上形成结构特征。通过使用机器视觉系统，可以确定基板或支撑元件上的精确位置并将其传送到3-D打印系统的分配元件，使得可流动的材料可以在期望的位置被沉积和固结以形成结构特征。还公开了使用本发明的系统在基板上形成各种特征和结构的方法。

70. 发明申请

US20050275083A1 Compliant contact pin assembly and card system 失效
公开(公告)号：US20050275083A1
公开(公告)日：2005-12-15
申请号：US11151923
申请日：2005-06-14
申请人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
发明人： Kyle Kirby , Warren Farnworth , James Wark , William Hiatt , David Hembree , Alan Wood
IPC分类号： G01R1/073 , H01L21/66 , H01L23/48 , H01L23/498 , H01L23/58 , H01R13/24 , H05K3/32 , H05K3/40 , H05K7/06 , H05K7/10
CPC分类号： G01R1/0735 , G01R1/07314 , H01L23/13 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01R12/714 , H01R13/24 , H01R2201/20 , H05K3/326 , H05K7/1069 , H05K2201/0314 , H05K2201/09036 , H05K2201/10378 , Y10T29/49165 , Y10T29/49174 , Y10T29/49204 , Y10T29/49222 , H01L2224/05599
摘要： A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

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