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61. 发明授权

US08237271B2 Direct edge connection for multi-chip integrated circuits 有权
标题翻译：直接边缘连接多芯片集成电路
公开(公告)号：US08237271B2
公开(公告)日：2012-08-07
申请号：US11765055
申请日：2007-06-19
申请人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L24/11 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2224/0401 , H01L2224/06183 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16137 , H01L2224/16238 , H01L2224/17183 , H01L2224/81005 , H01L2224/811 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81986 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30105 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2224/83851 , H01L2224/81
摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.
摘要翻译：本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

62. 发明申请

US20120187577A1 Direct Edge Connection for Multi-Chip Integrated Circuits 失效
标题翻译：直接边缘连接多芯片集成电路
公开(公告)号：US20120187577A1
公开(公告)日：2012-07-26
申请号：US13439198
申请日：2012-04-04
申请人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L21/6835 , H01L24/11 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2224/0401 , H01L2224/06183 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16137 , H01L2224/16238 , H01L2224/17183 , H01L2224/81005 , H01L2224/811 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81986 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30105 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2224/83851 , H01L2224/81
摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.
摘要翻译：本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

63. 发明授权

US08080876B2 Structure and method for creating reliable deep via connections in a silicon carrier 有权
标题翻译：用于在硅载体中创建可靠的深通孔连接的结构和方法
公开(公告)号：US08080876B2
公开(公告)日：2011-12-20
申请号：US12147466
申请日：2008-06-26
申请人： Paul S. Andry , John U. Knickerbocker , Michelle L. Steen , Cornelia K. Tsang
发明人： Paul S. Andry , John U. Knickerbocker , Michelle L. Steen , Cornelia K. Tsang
IPC分类号： H01L23/538
CPC分类号： H01L23/49827 , H01L21/486 , H01L21/76898 , H01L23/147 , H01L2924/0002 , H01L2924/00
摘要： A process and structure for enabling the creation of reliable electrical through-via connections in a semiconductor substrate and a process for filling vias. Problems associated with under etch, over etch and flaring of deep Si RIE etched through-vias are mitigated, thereby vastly improving the integrity of the insulation and metallization layers used to convert the through-vias into highly conductive pathways across the Si wafer thickness. By using an insulating collar structure in the substrate in one case and by filling the via in accordance with the invention in another case, whole wafer yield of electrically conductive through vias is greatly enhanced.
摘要翻译：一种用于在半导体衬底中创建可靠的电通孔连接的工艺和结构以及用于填充过孔的工艺。与深蚀刻Si RIE蚀刻通孔相切的蚀刻，过蚀刻和扩散相关的问题得到缓解，从而大大提高了用于将通孔转换成穿过Si晶片厚度的高导电通路的绝缘层和金属化层的完整性。通过在一种情况下通过在衬底中使用绝缘套环结构，并且在另一种情况下通过填充根据本发明的通孔，大大增强了导电通孔的整个晶片产量。

64. 发明申请

US20100276813A1 INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENSIONAL STRUCTURES 有权
标题翻译：注射成型焊接工艺和三维结构布置
公开(公告)号：US20100276813A1
公开(公告)日：2010-11-04
申请号：US12839214
申请日：2010-07-19
申请人： Luc Belanger , David Danovitch , John U. Knickerbocker
发明人： Luc Belanger , David Danovitch , John U. Knickerbocker
IPC分类号： H01L23/488 , B23K31/02 , B23K1/20
CPC分类号： H01L24/11 , H01L25/0657 , H01L2224/13099 , H01L2224/48091 , H01L2225/06517 , H01L2225/06541 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2224/0401
摘要： A method of implementing an injection molded soldering process for three-dimensional structures, particularly, such as directed to three-dimensional semiconductor chip stacking. Also provide is an arrangement for implementing the injection molded soldering (IMS) process. Pursuant to an embodiment of the invention, the joining of the semiconductor chip layers with a substrate is implemented, rather than by means of currently known wire bond stacking, through the intermediary of columns of solder material formed by the IMS process, thereby providing electrical advantages imparted by the flip chip interconnect structures. In this connection, various diversely dimensioned solder column interconnects allow for simple and dependable connections to a substrate by a plurality of superimposed layers or stacked arrays of semiconductor components, such as semiconductor chips. In accordance with a further aspect, it is possible to derive a unique design for an IMS mold structure, which contains cavities for forming the columnar fill of solder, and which also incorporates further cavities acting as cutouts for dies or the positioning of other electronic packages or modules.
摘要翻译：一种实现用于三维结构的注射成型焊接工艺的方法，特别是诸如针对三维半导体芯片堆叠的方法。还提供了用于实现注射成型焊接（IMS）工艺的布置。根据本发明的实施例，通过由IMS工艺形成的焊料柱的中间层，实现了半导体芯片层与基板的接合，而不是通过目前已知的引线键合堆叠，从而提供电气优点由倒装芯片互连结构赋予。在这方面，各种不同尺寸的焊料柱互连允许通过多个叠加层或诸如半导体芯片的半导体部件的堆叠阵列对衬底进行简单且可靠的连接。根据另一方面，可以为IMS模具结构导出独特的设计，该模具结构包含用于形成焊料的柱状填充物的空腔，并且还包括用作模具的切口或其他电子封装的定位的另外的空腔或模块。

65. 发明授权

US07784664B2 Fill head for injection molding of solder 有权
标题翻译：填充头用于注射成型焊料
公开(公告)号：US07784664B2
公开(公告)日：2010-08-31
申请号：US12189822
申请日：2008-08-12
申请人： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： B23K37/00 , B23K31/02
CPC分类号： B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。该方法包括将填充头与表面对准。模具包括多个空腔。该方法还包括将填充头与表面实质接触。至少第一气体围绕填充头的第一区域引导。所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。导电接合材料从表面压出填料头。导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

66. 发明授权

US07694869B2 Universal mold for injection molding of solder 有权
标题翻译：通用模具用于注射成型焊料
公开(公告)号：US07694869B2
公开(公告)日：2010-04-13
申请号：US11409242
申请日：2006-04-21
申请人： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： B23K31/00 , H05K3/34
CPC分类号： B23K3/0638 , B23K1/0016 , B23K3/0623 , B23K2101/40 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H05K3/3478 , H05K3/3484 , H05K2201/09945 , H05K2203/0113 , H05K2203/043 , H01L2924/00
摘要： A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.
摘要翻译：公开了一种用于将导电接合材料施加到基底的系统，方法和装置。该方法包括在模具的多个空腔中提供导电接合材料。多个空腔中的空腔的总数大于对应于模具的电路支撑衬底的至少一个导电焊盘的总数。将模具中的导电接合材料加热至导电接合材料的回流温度。在至少一个空腔中至少一个可润湿表面被放置成与被加热的导电接合材料基本接触。模具和相应的电路支撑衬底彼此靠近，使得至少一个空腔中的加热的导电接合材料与相应的电路支撑衬底的至少一个导电焊盘接触。

67. 发明授权

US07669748B2 Conductive bonding material fill techniques 有权
标题翻译：导电接合材料填充技术
公开(公告)号：US07669748B2
公开(公告)日：2010-03-02
申请号：US12173346
申请日：2008-07-15
申请人： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： B23K31/02
CPC分类号： H05K3/3484 , B23K3/0607 , B23K2101/42 , H05K3/4038 , H05K2201/0305 , H05K2201/09472 , H05K2203/0126 , H05K2203/043 , H05K2203/0568
摘要： A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.
摘要翻译：系统将焊料提供到电路支撑衬底中的空腔中。该系统使填充头与电路支撑衬底基本接触。电路支撑衬底包括至少一个空腔。当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。焊料被迫从填充头朝向电路支撑基板。焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。

68. 发明申请

US20090301685A1 FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER 审中-公开
标题翻译：用于注射成型焊枪的柔性喷嘴
公开(公告)号：US20090301685A1
公开(公告)日：2009-12-10
申请号：US12542016
申请日：2009-08-17
申请人： Peter A. Gruber , John U. Knickerbocker
发明人： Peter A. Gruber , John U. Knickerbocker
IPC分类号： B22D17/00
CPC分类号： B22D17/2023 , B22D17/30 , B22D18/04 , B23K3/0623 , B23K3/0638 , H05K3/3457 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A flexible nozzle for injection molded solder of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.
摘要翻译：用于注射成型焊料的柔性喷嘴，其利用用于注射成型焊料应用的柔性喷嘴。为了能够有效地执行注射成型的焊接工艺，采用柔性或柔性的焊料分配喷嘴结构，其特别有利地适用于圆形或圆形模具。在这方面，提供用于排出焊料的喷嘴的尖端提供一系列小孔或孔，用于在至少一个焊料储存器的压力下挤出焊料。在一个实施例中，可以使用单个焊料储存器，其中连通多个排出孔或孔，用于挤出焊料，以填充形成在用于注射成型焊料的模具的相对表面中的合适的空腔或凹部。或者，而不是通过多个孔或排出孔从单个储存器分配或挤出焊料，每个相应的孔或一组孔可以分别连接到经受压力的多个储存器的单独的焊料储存器有助于将焊料挤出到模具表面上。

69. 发明授权

US07518225B2 Chip system architecture for performance enhancement, power reduction and cost reduction 有权
标题翻译：芯片系统架构，用于性能提升，功耗降低和成本降低
公开(公告)号：US07518225B2
公开(公告)日：2009-04-14
申请号：US11538567
申请日：2006-10-04
申请人： Philip G. Emma , John U. Knickerbocker , Chirag S. Patel
发明人： Philip G. Emma , John U. Knickerbocker , Chirag S. Patel
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/642 , H01L25/0652 , H01L25/18 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2225/06589 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： A computer chip is structured to have at least one single-layered chip, at least one multi-layered chip stack, and a carrier package characterized by electrical interconnections of less than 100 microns diameter, wherein the single-layered chip and the multi-layered chip stack are each electrically coupled to the electrical interconnections of the carrier package, and the single-layered chip is communicatively coupled to the multi-layered chip stack through the carrier package so that an electrical signal propagates over a given distance between the single-layered chip and the multi-layered chip stack at substantially a speed of propagation for a single layer chip over the given distance. The single-layered chip can be a processor having multi-cores and the multi-layered chip stack can be a memory cache stack. Interconnect vias, having a density at least as great as 2500 interconnects/cm2 electrically couple the single-layered chip and the multi-layered chip stack to the carrier package.
摘要翻译：计算机芯片被构造成具有至少一个单层芯片，至少一个多层芯片堆叠和以小于100微米直径的电互连为特征的载体封装，其中单层芯片和多层芯片芯片堆叠都电耦合到载体封装的电互连，并且单层芯片通过载体封装通信地耦合到多层芯片堆叠，使得电信号在单层之间传递给定距离芯片和多层芯片堆栈，在给定距离内的单层芯片基本上是传播速度。单层芯片可以是具有多核的处理器，并且多层芯片堆栈可以是存储器高速缓存堆栈。具有至少高达2500个互连/ cm2的密度的互连通孔将单层芯片和多层芯片堆叠电耦合到载体封装。

70. 发明授权

US07497366B2 Global vacuum injection molded solder system and method 失效
标题翻译：全球真空注射成型焊料系统及方法
公开(公告)号：US07497366B2
公开(公告)日：2009-03-03
申请号：US11758752
申请日：2007-06-06
申请人： S. Jay Chey , Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： S. Jay Chey , Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： B23K31/02
CPC分类号： B23K3/0638 , B23K35/02 , B23K2101/40 , H01L2224/11
摘要： A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.
摘要翻译：提供了一种系统和方法，用于将导电接合材料注射到真空室内的模具中的多个空腔中。模具和填充头位于真空室内，其中模具包括多个空腔。在真空室内产生真空，从而从腔室和空腔中除去空气。可选地，当填充头与模具基本接触时，将旋转运动提供给模具和填充头中的至少一个。当在真空室中保持真空时，导电接合材料被迫从灌装头朝向模具，并进入至少一个空腔中。

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