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61. 发明授权

US5502614A Solid electrolytic capacitor 失效
标题翻译：固体电解电容器
公开(公告)号：US5502614A
公开(公告)日：1996-03-26
申请号：US335593
申请日：1994-11-08
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G9/00 , H01G9/15
CPC分类号： H01G9/0003
摘要： A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chip body and the cathode lead, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the first fuse wire. The capacitor further comprises an auxiliary lead separate from the anode and cathode leads, and a second fuse wire for electrically connecting the auxiliary lead to one of the chip body and the anode lead within the resin package. In an alternative embodiment, there is only a single fuse wire, the fuse wire acting both as a temperature fuse and as an overcurrent fuse.
摘要翻译：固体电解电容器包括电容器元件，其包括芯片体和从芯片体突出的阳极线，与阳极线电连接的阳极引线，与阳极引线成对的阴极引线，在芯片之间电连接的第一熔丝主体和阴极引线，以及包围电容器元件，阳极引线的一部分，阴极引线的一部分和第一熔丝的树脂封装。电容器还包括与阳极和阴极引线分离的辅助引线，以及用于将辅助引线电连接到树脂封装内的芯片体和阳极引线之一的第二熔丝。在替代实施例中，仅有一根熔丝，熔丝线作为温度保险丝和过电流保险丝。

62. 发明授权

US5461538A Capacitor element for solid electrolytic capacitor 失效
标题翻译：固体电解电容器电容元件
公开(公告)号：US5461538A
公开(公告)日：1995-10-24
申请号：US224556
申请日：1994-04-07
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G9/048 , B30B11/02 , H01G9/00 , H01G9/032 , H01G9/04 , H01G9/052 , H01G9/15
CPC分类号： H01G9/052 , B30B11/02
摘要： A capacitor element for a solid electrolytic capacitor is provided which comprises a sintered chip of metal powder, the chip having a first end and a second end opposite to the first end. The chip includes a tapered body whose cross-sectional area reduces from the first end to the second end, and a cathode layer covering the chip excepting at least the first end.
摘要翻译：提供一种用于固体电解电容器的电容器元件，其包括金属粉末的烧结芯片，该芯片具有第一端和与第一端相对的第二端。该芯片包括其截面积从第一端减小到第二端的锥体，以及至少覆盖第一端的除了芯片的阴极层。

63. 发明授权

US5424909A Package-type solid electrolytic capacitor 失效
标题翻译：封装型固体电解电容器
公开(公告)号：US5424909A
公开(公告)日：1995-06-13
申请号：US253556
申请日：1994-06-03
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G4/40 , H01G9/00 , H01G9/004 , H01G9/12 , H01G2/10
CPC分类号： H01G9/00 , H01G9/0003
摘要： A package-type solid electrolytic capacitor is provided which comprises a capacitor element including a chip from which an anode wire partially projects out, a resin package enclosing the capacitor element, and a diode also enclosed in the package. The diode has a negative pole electrically connected to the anode wire, and a positive pole electrically connected to the chip. The diode is designed to allow passage therethrough of a forward current under a forward bias which is lower than the reverse dielectric breakdown voltage of the capacitor element.
摘要翻译：提供一种封装型固体电解电容器，其包括电容器元件，该电容器元件包括阳极导线部分突出的芯片，封装电容器元件的树脂封装以及封装在封装中的二极管。二极管具有与阳极线电连接的负极和与芯片电连接的正极。二极管被设计成允许正向电流在正向偏压下通过，该正向电压低于电容器元件的反向介质击穿电压。

64. 发明授权

US5329421A Solid electrolytic capacitor 失效
标题翻译：固体电解电容器
公开(公告)号：US5329421A
公开(公告)日：1994-07-12
申请号：US41972
申请日：1993-04-02
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G9/00 , H01G1/10
CPC分类号： H01G9/0003
摘要： A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chip body and the cathode lead, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the first fuse wire. The capacitor further comprises an auxiliary lead separate from the anode and cathode leads, and a second fuse wire for electrically connecting the auxiliary lead to one of the chip body and the anode lead within the resin package.
摘要翻译：固体电解电容器包括电容器元件，其包括芯片体和从芯片体突出的阳极线，与阳极线电连接的阳极引线，与阳极引线成对的阴极引线;在芯片之间电连接的第一熔丝主体和阴极引线，以及包围电容器元件，阳极引线的一部分，阴极引线的一部分和第一熔丝的树脂封装。电容器还包括与阳极和阴极引线分离的辅助引线，以及用于将辅助引线电连接到树脂封装内的芯片体和阳极引线之一的第二熔丝。

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