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61. 发明申请

US20060043606A1 Semiconductor device having laminated structure 有权
标题翻译：具有层叠结构的半导体装置
公开(公告)号：US20060043606A1
公开(公告)日：2006-03-02
申请号：US11215121
申请日：2005-08-31
申请人： Toshikazu Imaoka , Ryosuke Usui
发明人： Toshikazu Imaoka , Ryosuke Usui
IPC分类号： H01L23/48
CPC分类号： H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L25/0652 , H01L2224/04105 , H01L2224/12105 , H01L2224/24145 , H01L2224/24195 , H01L2224/24226 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H05K1/183 , H05K1/185 , H05K3/284 , H05K3/4644 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A technique for reducing the size of a semiconductor device is provided. A semiconductor device comprises a base, a semiconductor chip, a chip component, an insulating base, a wiring pattern, a via plug, an external lead-out electrode, a recess, and a resin. The insulating base has a multi-layer structure formed by laminating a plurality of insulator films. The semiconductor chip and the chip component are mounted on the base and embedded in the insulating base. A recess is formed on the surface of the semiconductor device and reaches down to any of wiring conductor layers. The semiconductor chip and the chip component are mounted on the recess.
摘要翻译：提供了一种用于减小半导体器件的尺寸的技术。半导体器件包括基底，半导体芯片，芯片部件，绝缘基底，布线图案，通孔塞，外部引出电极，凹部和树脂。绝缘基底具有通过层叠多个绝缘膜形成的多层结构。半导体芯片和芯片组件安装在基座上并嵌入绝缘基座中。在半导体器件的表面上形成凹部，并且到达布线导体层中的任何一个。半导体芯片和芯片组件安装在凹槽上。

62. 发明申请

US20050218480A1 Device mounting board and semiconductor apparatus using device mounting board 审中-公开
标题翻译：装置安装板和使用装置安装板的半导体装置
公开(公告)号：US20050218480A1
公开(公告)日：2005-10-06
申请号：US11088137
申请日：2005-03-23
申请人： Ryosuke Usui , Takeshi Nakamura , Hideki Mizuhara
发明人： Ryosuke Usui , Takeshi Nakamura , Hideki Mizuhara
IPC分类号： H01L21/00 , H01L21/48 , H01L23/12 , H01L23/498 , H01L23/58 , H05K1/03 , H05K3/28 , H05K3/46
CPC分类号： H01L23/49894 , H01L21/4857 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16225 , H01L2224/45144 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K3/287 , H05K3/4602 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The device mounting board according to the first embodiment has the structure in which an dielectric resin film and a photoimageable solder resist film are sequentially laminated on an upper surface of a base material. The device mounting board also has the structure in which the dielectric resin film and the photoimageable solder resist film are sequentially laminated on a lower surface of the base material. The photoimageable solder resist film contains the cardo type polymer.
摘要翻译：根据第一实施例的装置安装板具有其中介电树脂膜和可光成像阻焊膜依次层压在基材的上表面上的结构。装置安装板还具有其中介电树脂膜和可光成像阻焊膜依次层压在基材的下表面上的结构。可光成像阻焊膜含有cardo型聚合物。

63. 发明申请

US20050067712A1 Semiconductor apparatus and method of fabricating the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050067712A1
公开(公告)日：2005-03-31
申请号：US10951214
申请日：2004-09-27
申请人： Toshikazu Imaoka , Ryosuke Usui , Atsushi Nakano , Atsushi Kato
发明人： Toshikazu Imaoka , Ryosuke Usui , Atsushi Nakano , Atsushi Kato
IPC分类号： H01L23/12 , H01L23/498 , H01L23/48
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49833 , H01L24/48 , H01L2224/48237 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor apparatus includes a first conductive film and a second conductive film provided on respective sides of an insulating resin film. A circuit element is mounted on the second conductive film. The circuit element is electrically connected to the second conductive film. The second conductive film is provided to cover a via plug. The via plug is tapered with a progressively smaller diameter toward the second conductive film and away from the first conductive film.
摘要翻译：半导体装置包括设置在绝缘树脂膜的两侧的第一导电膜和第二导电膜。电路元件安装在第二导电膜上。电路元件电连接到第二导电膜。第二导电膜被设置成覆盖通孔塞。通孔塞逐渐变细，朝向第二导电膜逐渐变小，并远离第一导电膜。

64. 发明授权

US08476776B2 Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus 有权
标题翻译：半导体模块，半导体模块的制造方法以及移动装置
公开(公告)号：US08476776B2
公开(公告)日：2013-07-02
申请号：US12935854
申请日：2009-03-18
申请人： Ryosuke Usui , Yasunori Inoue , Mayumi Nakasato , Katsumi Ito
发明人： Ryosuke Usui , Yasunori Inoue , Mayumi Nakasato , Katsumi Ito
IPC分类号： H01L23/28 , H01L23/29
CPC分类号： H01L23/3107 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3135 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2221/68336 , H01L2224/02379 , H01L2224/03436 , H01L2224/0361 , H01L2224/03622 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/05647 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/215 , H01L2224/221 , H01L2224/96 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2224/82 , H01L2224/19 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor module manufacturing method includes a step of bonding a semiconductor wafer, which has a plurality of semiconductor elements each of which has an element electrode formed thereon, on an expansible first insulating resin layer; a step of dicing the semiconductor wafer; a step of expanding the first insulating resin layer to widen a gap between semiconductor elements; a pressure-bonding step of pressure-bonding a metal plate whereupon an electrode is arranged and the semiconductor elements with the widened gaps in between, by having a second insulating resin layer in between, and electrically connecting the electrode and the element electrodes; a step of forming a wiring layer which corresponds to each semiconductor element by selectively removing the metal plate and forming a plurality of semiconductor modules connected by the first insulating resin layer and the second insulating resin layer; and a step of separating the semiconductor modules by cutting the first insulating resin layer and the second insulating resin layer.
摘要翻译：一种半导体模块的制造方法，其特征在于，在可扩展的第一绝缘树脂层上粘接具有形成有元件电极的多个半导体元件的半导体晶片的工序; 切割半导体晶片的步骤; 扩大第一绝缘树脂层以扩大半导体元件之间的间隙的步骤; 通过在其间具有第二绝缘树脂层，并且电连接所述电极和所述元件电极，对金属板进行压接，由此布置电极和其间具有加宽的间隙的半导体元件的压接步骤; 通过选择性地去除所述金属板并形成由所述第一绝缘树脂层和所述第二绝缘树脂层连接的多个半导体模块，形成对应于每个半导体元件的布线层的步骤; 以及通过切割第一绝缘树脂层和第二绝缘树脂层来分离半导体模块的步骤。

65. 发明授权

US08304289B2 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof 有权
标题翻译：包括电路元件和电介质膜的半导体模块，其制造方法及其应用
公开(公告)号：US08304289B2
公开(公告)日：2012-11-06
申请号：US12603122
申请日：2009-10-21
申请人： Ryosuke Usui , Yasunori Inoue
发明人： Ryosuke Usui , Yasunori Inoue
IPC分类号： H01L21/98
CPC分类号： H01L24/85 , H01L21/568 , H01L23/3128 , H01L23/5389 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/96 , H01L24/97 , H01L25/16 , H01L25/50 , H01L2224/04105 , H01L2224/05554 , H01L2224/12105 , H01L2224/24137 , H01L2224/24146 , H01L2224/24195 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73267 , H01L2224/82001 , H01L2224/85001 , H01L2224/85203 , H01L2224/92244 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/3511 , H01L2224/85 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： Multiple semiconductor device components and passive device components fixed to a substrate are embedded within an electroconductive-film/insulating-resin-film structure, and are thermally bonded to an insulating resin film.
摘要翻译：固定在基板上的多个半导体器件部件和无源器件部件被嵌入到导电膜/绝缘树脂膜结构内，并且被热粘合到绝缘树脂膜上。

66. 发明授权

US08022533B2 Circuit apparatus provided with asperities on substrate surface 失效
标题翻译：在基板表面上设置有凹凸的电路装置
公开(公告)号：US08022533B2
公开(公告)日：2011-09-20
申请号：US11168655
申请日：2005-06-29
申请人： Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
发明人： Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
IPC分类号： H01L23/34
CPC分类号： H01L24/82 , H01L23/142 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/25 , H01L24/45 , H01L24/48 , H01L27/013 , H01L27/016 , H01L28/20 , H01L28/40 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/24145 , H01L2224/24146 , H01L2224/24195 , H01L2224/32145 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/73267 , H01L2224/8203 , H01L2224/92244 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01088 , H01L2924/014 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H05K1/056 , H05K1/162 , H05K1/167 , H05K1/185 , H05K3/382 , H05K3/4644 , H05K2201/0187 , H05K2201/0338 , H05K2201/09745 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： Circuit elements including a plurality of semiconductor devices and passive elements embedded in an insulating resin film are formed on a metal substrate having a surface roughness Ra of 0.3 to 10 μm. This produces an anchoring effect occurs between the substrate and the insulating film, thereby improving the adhesiveness between the substrate and the insulating resin film.
摘要翻译：在表面粗糙度Ra为0.3〜10μm的金属基材上形成包含多个半导体器件和埋入绝缘树脂膜中的无源元件的电路元件。这样会在基板和绝缘膜之间产生锚定效应，从而提高基板与绝缘树脂膜之间的粘附性。

67. 发明授权

US07808114B2 Circuit device and method of manufacturing thereof 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US07808114B2
公开(公告)日：2010-10-05
申请号：US11410476
申请日：2006-04-24
申请人： Ryosuke Usui , Yasunori Inoue , Hideki Mizuhara
发明人： Ryosuke Usui , Yasunori Inoue , Hideki Mizuhara
IPC分类号： H01L23/52
CPC分类号： H01L23/3114 , H01L21/4828 , H01L21/561 , H01L23/4951 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68377 , H01L2224/0231 , H01L2224/02313 , H01L2224/02319 , H01L2224/0233 , H01L2224/0239 , H01L2224/0401 , H01L2224/05 , H01L2224/05548 , H01L2224/05567 , H01L2224/13022 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/274 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2224/05552 , H01L2924/00
摘要： A circuit device of preferred embodiments of the present invention includes: a circuit element with electrodes formed in a peripheral part thereof; connecting portions connected to surfaces of the electrodes; and redistribution lines which are continuous to the respective connecting portions and extended in parallel to the main surface of the circuit element. In preferred embodiments of the present invention, the connecting portions and the redistribution lines are integrally formed of one piece of metal. Accordingly, there is no place where different materials are connected in a portion between the connecting portions and the redistribution lines, thus improving a joint reliability of the entire device against a thermal stress or the like.
摘要翻译：本发明的优选实施例的电路装置包括：电路元件，其电极形成在其周边部分中; 与电极表面连接的连接部分; 以及与各连接部连续并且与电路元件的主面平行延伸的再分配线。在本发明的优选实施例中，连接部分和再分布线由一片金属一体地形成。因此，在连接部分和再分配线之间的部分中没有不同材料连接的地方，从而提高整个装置对热应力等的接合可靠性。

68. 发明授权

US07791120B2 Circuit device and manufacturing method thereof 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US07791120B2
公开(公告)日：2010-09-07
申请号：US11082151
申请日：2005-03-16
申请人： Ryosuke Usui , Yasunori Inoue
发明人： Ryosuke Usui , Yasunori Inoue
IPC分类号： H01L27/108 , H01L29/94
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/5389 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L2224/12105 , H01L2224/24145 , H01L2224/24195 , H01L2224/24265 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/82005 , H01L2224/8203 , H01L2225/06568 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01076 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/185 , H01L2924/00014 , H01L2924/00015 , H01L2924/00 , H01L2924/00012
摘要： A manufacturing method of a circuit device that is formed by embedding a circuit in an insulating film is provided, the method including pressure bonding by a vacuum adhesion method on a first film a film that contains an insulating film between elements and is provided with a recess or a penetrated portion to adhere a second film 160 that constitutes a recess 190; embedding a pasty material of an element constituent member inside of the recess 190 by squeegeeing means such as a squeegee; and applying treatment such as drying to the material to form embedding members such as a high resistance member that becomes a resistor 180 and a high dielectric constant member 170 that constitutes a capacitor.
摘要翻译：提供了一种通过在绝缘膜中嵌入电路而形成的电路器件的制造方法，该方法包括通过真空粘附方法对第一膜进行压接，该膜在元件之间包含绝缘膜并且设置有凹部或穿透部分以粘附构成凹部190的第二膜160; 通过诸如刮板等刮板装置将元件构件的糊状材料嵌入凹部190内部; 对材料进行干燥等处理，形成作为电容器的高电阻部件等的嵌入部件，构成电容器的高介电常数部件170。

69. 发明授权

US07759583B2 Circuit board 失效
标题翻译：电路板
公开(公告)号：US07759583B2
公开(公告)日：2010-07-20
申请号：US11528683
申请日：2006-09-28
申请人： Makoto Murai , Ryosuke Usui
发明人： Makoto Murai , Ryosuke Usui
IPC分类号： H05K1/11
CPC分类号： H05K3/421 , H05K1/0373 , H05K3/0055 , H05K3/4626 , H05K2201/0209 , H05K2201/09509 , Y10T428/24917 , Y10T428/24926
摘要： A circuit board, having improved adhesion between its via conductor and insulating layer, is provided. The circuit board includes a first wiring layer, a second wiring layer, the insulating layer, a filler, and the via conductor. The first wiring layer and the second wiring layer are electrically insulated from each other by the insulating layer. The filler which has a favorable thermal conductivity is added into the insulating layer. The via conductor establishing electrical connection between the first wiring layer and the second wiring layer is formed in a predetermined position of the insulating layer. The via conductor is in direct contact with part of the filler added into the insulating layer.
摘要翻译：提供了一种电路板，其通孔导体和绝缘层之间具有改善的粘合性。电路板包括第一布线层，第二布线层，绝缘层，填料和通孔导体。第一布线层和第二布线层通过绝缘层彼此电绝缘。将具有良好导热性的填料加入到绝缘层中。在第一布线层和第二布线层之间建立电连接的通孔导体形成在绝缘层的预定位置。通孔导体与添加到绝缘层中的填料的一部分直接接触。

70. 发明授权

US07737368B2 Circuit board and method of manufacturing circuit board 失效
标题翻译：电路板及制造电路板的方法
公开(公告)号：US07737368B2
公开(公告)日：2010-06-15
申请号：US11536317
申请日：2006-09-28
申请人： Yasuhiro Kohara , Ryosuke Usui , Noriaki Kojima
发明人： Yasuhiro Kohara , Ryosuke Usui , Noriaki Kojima
IPC分类号： H05K1/11
CPC分类号： H05K3/42 , H05K1/0366 , H05K3/002 , H05K3/0055 , H05K3/4602 , H05K2201/029 , H05K2201/0959 , Y10S428/901 , Y10T428/24917
摘要： A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.
摘要翻译：电路板包括：多个布线层; 绝缘层，其使所述多个布线层绝缘，所述绝缘层包含纤维填料和树脂; 以及形成在穿过绝缘层的通孔的侧壁上的导体部分。纤维填料从侧壁突出并被导体部分覆盖，其长度大于导体层的厚度。

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