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61. 发明申请

US20080119214A1 Transmitter with improved power efficiency 有权
标题翻译：变送器具有更高的功率效率
公开(公告)号：US20080119214A1
公开(公告)日：2008-05-22
申请号：US11600351
申请日：2006-11-16
申请人： Lianjun Liu , Ricardo A. Uscola
发明人： Lianjun Liu , Ricardo A. Uscola
IPC分类号： H04B7/00 , H03H7/38
CPC分类号： H04B1/0458 , H03F1/02 , H03F3/24 , H03F3/72 , H03F2203/7239 , H03H7/38 , H04B2001/045
摘要： A power amplifier (PA) line-up (210) and a method (500) for more efficiently utilizing battery power are disclosed. PA line-up (210) includes a driver (220), a matching circuit (214), and a PA (230) coupled to a matching circuit (216), wherein matching circuit (216) is configured to be coupled to a filter (260). PA line-up (210) includes a transmission line (260) coupled to matching circuit (216) and a switch (262) configured to selectively couple driver (220) to either matching circuit (214) or matching circuit (216) such that signal (205) is capable of by-passing PA (230) when signal (205) does not need to be amplified by PA (230). Furthermore, PA line-up (210) may include a second transmission line (250) so that signal (205) is capable of by-passing a driver (220) and a PA (230) when signal (205) does not need to be amplified by driver (220) and PA (230).
摘要翻译：公开了一种用于更有效地利用电池电力的功率放大器（PA）阵容（210）和方法（500）。 PA阵列（210）包括驱动器（220），匹配电路（214）和耦合到匹配电路（216）的PA（230），其中匹配电路（216）被配置为耦合到滤波器（260）。 PA阵列（210）包括耦合到匹配电路（216）的传输线（260）和配置成将驱动器（220）选择性地耦合到匹配电路（214）或匹配电路（216）的开关（262），使得当信号（205）不需要被PA放大（230）时，信号（205）能够旁路PA（230）。此外，PA阵列（210）可以包括第二传输线（250），使得当信号（205）不需要时，信号（205）能够旁路驱动器（220）和PA（230）由驱动器（220）和PA（230）放大。

62. 发明申请

US20080102762A1 Methods and apparatus for a hybrid antenna switching system 审中-公开
标题翻译：混合天线切换系统的方法和装置
公开(公告)号：US20080102762A1
公开(公告)日：2008-05-01
申请号：US11590277
申请日：2006-10-30
申请人： Lianjun Liu , James R. Griffiths
发明人： Lianjun Liu , James R. Griffiths
IPC分类号： H04B1/44
CPC分类号： H04B1/48 , H04B1/006
摘要： A hybrid antenna switching system in a communications device generally includes an antenna, a first switching device, and a second switching device. The first switching device is configured to selectively couple the antenna to a first set of communication paths within the communications device, wherein the first set of communication paths includes at least one transmit path associated with a first type of wireless communication standard (e.g., a global system for communication (GSM) standard). The second switching device is configured to selectively couple the antenna to a second set of communication paths within the communications device, wherein the second set of communication paths includes at least one reception path associated with the first type of wireless communication standard. The second switching device is a micro-electromechanic system (MEMS) switch integrated with the first switching device on, for example, a common printed circuit board (PCB) or multi-chip module (MCM) substrate.
摘要翻译：通信设备中的混合天线切换系统通常包括天线，第一交换设备和第二交换设备。第一交换设备被配置为选择性地将天线耦合到通信设备内的第一组通信路径，其中第一组通信路径包括与第一类型的无线通信标准相关联的至少一个发送路径（例如，全局通信系统（GSM）标准）。第二交换设备被配置为选择性地将天线耦合到通信设备内的第二组通信路径，其中第二组通信路径包括与第一类型的无线通信标准相关联的至少一个接收路径。第二开关装置是与第一开关装置集成在例如普通印刷电路板（PCB）或多芯片模块（MCM））基板上的微机电系统（MEMS）开关。

63. 发明申请

US20080036035A1 METHOD FOR MANUFACTURING A PASSIVE INTEGRATED MATCHING NETWORK FOR POWER AMPLIFIERS 有权
标题翻译：用于功率放大器的被动集成匹配网络的制造方法
公开(公告)号：US20080036035A1
公开(公告)日：2008-02-14
申请号：US11830577
申请日：2007-07-30
申请人： Lianjun Liu , Qiang Li , Melvy Miller , Sergio Pacheco
发明人： Lianjun Liu , Qiang Li , Melvy Miller , Sergio Pacheco
IPC分类号： H01L29/00
CPC分类号： H01L25/16 , H01L23/642 , H01L23/645 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/18 , H01L28/10 , H01L28/40 , H01L2223/6655 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48472 , H01L2224/49175 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H03H7/38 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An impedance matching network is integrated on a first die and coupled to a second die, with the first and second dies mounted on a conductive back plate. The impedance matching network comprises a first inductor bridging between the first and second dies, a second inductor coupled to the first inductor and disposed on the first die, and a metal-insulator-metal (MIM) capacitor disposed on the first die. The MIM capacitor has a first metal layer coupled to the second inductor, and a second metal layer grounded to the conductive back plate. A method for manufacturing the integrated impedance matching network comprises the steps of forming an inductor on a die, forming a capacitor on the die, coupling the capacitor to the inductor, coupling the die bottom surface and the capacitor to a conductive plate, and coupling the inductor to another inductor that bridges between the die and another die.
摘要翻译：阻抗匹配网络集成在第一裸片上并耦合到第二裸片，第一和第二裸片安装在导电背板上。阻抗匹配网络包括桥接在第一和第二管芯之间的第一电感器，耦合到第一电感器并且设置在第一管芯上的第二电感器和设置在第一管芯上的金属 - 绝缘体 - 金属（MIM）电容器。 MIM电容器具有耦合到第二电感器的第一金属层和接地到导电背板的第二金属层。一种用于制造集成阻抗匹配网络的方法包括以下步骤：在管芯上形成电感器，在管芯上形成电容器，将电容器耦合到电感器，将管芯底表面和电容器耦合到导电板上，电感器到另一个电感器，其在管芯和另一个管芯之间桥接。

64. 发明授权

US07305223B2 Radio frequency circuit with integrated on-chip radio frequency signal coupler 有权
标题翻译：具有集成片上射频信号耦合器的射频电路
公开(公告)号：US07305223B2
公开(公告)日：2007-12-04
申请号：US11021843
申请日：2004-12-23
申请人： Lianjun Liu , Jonathan K. Abrokwah , Marcus R. Ray
发明人： Lianjun Liu , Jonathan K. Abrokwah , Marcus R. Ray
IPC分类号： H04B1/28
CPC分类号： H01L23/5227 , H01L23/66 , H01L27/016 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01P5/185 , H01L2924/00
摘要： A radio frequency (“RF”) circuit configured in accordance with an embodiment of the invention is fabricated on a substrate using integrated passive device (“IPD”) process technology. The RF circuit includes at least one RF signal line section and an integrated RF coupler located proximate to the RF signal line section. The integrated RF coupler, its output and grounding contact pads, and its matching network are fabricated on the same substrate using the same IPD process technology. The integrated RF coupler provides efficient and reproducible RF coupling without increasing the die footprint of the RF circuit.
摘要翻译：根据本发明的实施例构造的射频（“RF”）电路使用集成无源器件（“IPD”）处理技术在基板上制造。 RF电路包括至少一个RF信号线部分和位于RF信号线部分附近的集成RF耦合器。使用相同的IPD工艺技术，在同一基板上制造集成RF耦合器，其输出和接地接触焊盘及其匹配网络。集成RF耦合器提供高效和可重复的射频耦合，而不增加射频电路的裸片占空比。

65. 发明申请

US20070236307A1 Methods and apparatus for a packaged MEMS switch 审中-公开
标题翻译：封装MEMS开关的方法和装置
公开(公告)号：US20070236307A1
公开(公告)日：2007-10-11
申请号：US11401797
申请日：2006-04-10
申请人： Lianjun Liu
发明人： Lianjun Liu
IPC分类号： H01P1/10
CPC分类号： H01P1/127 , H01H1/0036 , H01H59/0009
摘要： A micro-electro mechanical system (NEMS) device, such as a MEMS switch (100), includes a package seal (104) bonded to a substrate (102), wherein an electrode 106 (e.g., an actuation electrode associated with a switch) is provided on an inner surface (103) of the package seal (104). The MEMS switch (100) might include, for example, a central switch structure implementing a double-pole, single-throw switch using a push-pull arrangement of internal activation electrodes (106, 108). The central switch structure might include a cantilevered moveable actuation electrode (122) or an electrode supported in two or more peripheral regions.
摘要翻译：诸如MEMS开关（100）的微机电系统（NEMS）装置包括结合到基板（102）的封装密封件（104），其中电极106（例如与开关相关联的致动电极）设置在包装密封件（104）的内表面（103）上。 MEMS开关（100）可以包括例如使用内部激活电极（106,108）的推挽布置来实现双极单掷开关的中央开关结构。中心开关结构可以包括悬臂可移动致动电极（122）或支撑在两个或更多个周边区域中的电极。

66. 发明授权

US07141989B1 Methods and apparatus for a MEMS varactor 有权
标题翻译： MEMS变容二极管的方法和装置
公开(公告)号：US07141989B1
公开(公告)日：2006-11-28
申请号：US11401592
申请日：2006-04-10
申请人： Lianjun Liu
发明人： Lianjun Liu
IPC分类号： G01R27/26 , H01L21/20 , B01B7/02
CPC分类号： H01G5/18 , H01G5/014 , H01G5/16 , H01G5/38
摘要： A micro-electro mechanical system (MEMS) variable capacitor (varactor) generally includes a substrate (102), a first capacitive plate (112) formed on the substrate, a flexible structure (150) coupled to the substrate, a second capacitive plate (116) and a first electrode (122) formed on the flexible structure; a package seal (104) coupled to the substrate and having a second electrode (106) formed thereon, wherein the distance between the first capacitive plate and the second capacitive plate (and hence, the capacitance of the structure) is responsive to a bias voltage applied to the electrodes.
摘要翻译：微机电系统（MEMS）可变电容器（变容二极管）通常包括衬底（102），形成在衬底上的第一电容板（112），耦合到衬底的柔性结构（150），第二电容板 116）和形成在柔性结构上的第一电极（122）封装密封件（104），其耦合到所述基板并且具有形成在其上的第二电极（106），其中所述第一电容板和所述第二电容板之间的距离（并且因此所述结构的电容）响应偏置电压施加到电极。

67. 发明申请

US20170341926A9 MICROELECTROMECHANICAL SYSTEM DEVICES HAVING CRACK RESISTANT MEMBRANE STRUCTURES AND METHODS FOR THE FABRICATION THEREOF 有权
公开(公告)号：US20170341926A9
公开(公告)日：2017-11-30
申请号：US14537498
申请日：2014-11-10
申请人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
发明人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
IPC分类号： B81B3/00 , G01L9/00
CPC分类号： B81B3/007 , B81B2201/0264 , B81B2203/0127 , G01L9/0072
摘要： Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.

68. 发明授权

US09448251B2 Integrated inertial sensor and pressure sensor, and forming method therefor 有权
标题翻译：集成惯性传感器和压力传感器及其形成方法
公开(公告)号：US09448251B2
公开(公告)日：2016-09-20
申请号：US14004595
申请日：2012-02-23
申请人： Lianjun Liu
发明人： Lianjun Liu
IPC分类号： G01P15/125 , G01P15/02 , G01P15/08 , B81B7/02 , H01L29/84 , G01C19/574 , G01C19/5769
CPC分类号： G01P15/02 , B81B7/02 , B81B2201/025 , B81B2201/0264 , G01C19/574 , G01C19/5769 , G01P15/0802 , G01P15/125 , H01L29/84
摘要： An integrated inertial sensor and pressure sensor may include a first substrate including a first surface and a second surface; at least one or more conductive layers, formed on the first surface of the first substrate; a movable sensitive element, formed by using a first region of the first substrate; a second substrate and a third substrate, the second substrate being coupled to a surface of the conductive layer, the third substrate being coupled to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, and the third substrate and the second substrate are respectively arranged on opposite sides of the movable sensitive element; and a sensitive film of the pressure sensor, including at least a second region of the first substrate, or including at least one of the conductive layers on the second region of the first substrate.
摘要翻译：集成的惯性传感器和压力传感器可以包括包括第一表面和第二表面的第一基底; 形成在所述第一基板的所述第一表面上的至少一个或多个导电层; 通过使用第一衬底的第一区域形成的可移动敏感元件; 第二基板和第三基板，所述第二基板耦合到所述导电层的表面，所述第三基板耦合到所述第一基板的形成所述惯性传感器的可移动敏感元件的第二表面，并且所述第三基板基板和第二基板分别布置在可移动敏感元件的相对侧上; 以及压力传感器的敏感膜，包括第一衬底的至少第二区域，或者在第一衬底的第二区域上包括至少一个导电层。

69. 发明申请

US20150225229A1 MICROELECTROMECHANICAL SYSTEM DEVICES HAVING THROUGH SUBSTRATE VIAS AND METHODS FOR THE FABRICATION THEREOF 有权
标题翻译：具有基板VIAS的微电子仪器系统及其制造方法
公开(公告)号：US20150225229A1
公开(公告)日：2015-08-13
申请号：US14694908
申请日：2015-04-23
申请人： Lianjun Liu
发明人： Lianjun Liu
IPC分类号： B81B7/00
CPC分类号： B81B7/0006 , B81B7/007 , B81B2207/096 , B81C1/00301
摘要： Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.
摘要翻译：提供了用于制造微机电系统（“MEMS”）器件的方法，MEMS器件也是如此。在一个实施例中，MEMS器件制造方法包括形成延伸到衬底晶片中的至少一个通孔开口，在衬底晶片上沉积导电材料体并进入通孔开口以产生通孔，将衬底晶片接合到换能器晶片具有导电换能器层，并且在通孔和导电换能器层之间形成电连接。衬底晶片被薄化以通过衬底晶片的底表面露出通孔，并且在衬底晶片的底表面上产生电气耦合到通孔的背面导体。

70. 发明授权

US09073745B2 MEMS pressure sensor and manufacturing method therefor 有权
标题翻译： MEMS压力传感器及其制造方法
公开(公告)号：US09073745B2
公开(公告)日：2015-07-07
申请号：US14004816
申请日：2012-02-23
申请人： Lianjun Liu
发明人： Lianjun Liu
IPC分类号： B81B3/00 , B81C1/00 , G01L9/00
CPC分类号： B81B3/0018 , B81B2201/0264 , B81C1/00158 , B81C1/00182 , G01L9/0073
摘要： A Micro Electromechanical System (MEMS) pressure sensor may include a first substrate provided with a sensitive diaphragm of a capacitive pressure sensing unit, an electrical connecting layer and a first bonding layer on a surface of the first substrate; and a second substrate provided with an inter-conductor dielectric layer, a conductor connecting layer in the inter-conductor dielectric layer and/or a second bonding layer on a surface of the second substrate. The second substrate is arranged opposite to the first substrate, and the second substrate is fixedly coupled to the first substrate via the first bonding layer and the second bonding layer; a pattern of the first bonding layer is corresponding to a pattern of the second bonding layer, and both the first bonding layer and the second bonding layer are formed of a conductive material.
摘要翻译：微机电系统（MEMS）压力传感器可以包括设置有电容式压力感测单元的敏感隔膜的第一基板，电连接层和在第一基板的表面上的第一接合层; 以及设置有导体间介电层的第二基板，导体间电介质层中的导体连接层和/或第二基板的表面上的第二接合层。第二基板与第一基板相对设置，第二基板经由第一接合层和第二接合层固定地耦合到第一基板; 第一接合层的图案对应于第二接合层的图案，并且第一接合层和第二接合层都由导电材料形成。

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