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61. 发明授权

US07298617B2 Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled 失效
公开(公告)号：US07298617B2
公开(公告)日：2007-11-20
申请号：US11258314
申请日：2005-10-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

62. 发明授权

US07272005B2 Multi-element heat exchange assemblies and methods of fabrication for a cooling system 失效
标题翻译：多元件热交换组件及其制冷方法
公开(公告)号：US07272005B2
公开(公告)日：2007-09-18
申请号：US11290757
申请日：2005-11-30
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： F28F9/007 , F28D15/00 , F28F7/02 , F28F2260/02 , H05K7/2079
摘要： A heat exchange assembly for a cooling system, having first and second cooling loops, includes a housing with a first coolant inlet and outlet and a second coolant inlet and outlet, respectively coupling to the first and second cooling loops, and multiple heat exchange elements. Each heat exchange element includes a first set and a second set of coolant flow passages intersecting different pairs of parallel face surfaces of the elements, with the second set of flow passages extending in a transverse direction to the first set of flow passages. The heat exchange elements are disposed within the housing with the first set of flow passages oriented in a first common direction in fluid communication with the first coolant inlet and outlet and the second set of flow passages oriented in a second common direction in fluid communication with the second coolant inlet and outlet of the housing.
摘要翻译：一种用于具有第一和第二冷却回路的冷却系统的热交换组件，包括具有第一冷却剂入口和出口以及分别与第一和第二冷却回路连接的多个热交换元件的第二冷却剂入口和出口的壳体。每个热交换元件包括与元件的不同对的平行面表面相交的第一组和第二组冷却剂流动通道，而第二组流动通道沿横向方向延伸到第一组流动通道。热交换元件设置在壳体内，第一组流动通道在第一共同方向上定向，与第一冷却剂入口和出口流体连通，而第二组流动通道在第二共同方向上定向成与壳体的第二冷却剂入口和出口。

63. 发明授权

US07184269B2 Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly 有权
标题翻译：一种采用集成热交换组件的电子模块的冷却装置和方法
公开(公告)号：US07184269B2
公开(公告)日：2007-02-27
申请号：US11008359
申请日：2004-12-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20781
摘要： A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.
摘要翻译：一种用于具有衬底和一个或多个电子器件的电子组件的冷却装置，包括密封地接合衬底以形成空腔的外壳，电子设备和热交换组件设置在空腔内。热交换组件限定了主冷却剂流动路径和单独的二次冷却剂流动路径。主冷却剂流动路径包括流体连通的第一和第二腔室，并且二次流动路径包括设置在第一和第二腔室之间的第三腔室。热交换组件提供在第一室中的主要冷却剂和第三室中的二次冷却剂之间的第一热传导路径，以及在第二室中的一次冷却剂和第三室中的二次冷却剂之间的第二热传导路径。热交换组件还包括冷却剂喷嘴以将主冷却剂引向电子设备。

64. 发明授权

US08959941B2 Data center cooling with an air-side economizer and liquid-cooled electronics rack(s) 有权
公开(公告)号：US08959941B2
公开(公告)日：2015-02-24
申请号：US13187563
申请日：2011-07-21
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D23/12 , F28D15/00 , H02B1/00 , H05K7/20 , F28D1/047
CPC分类号： H05K7/20145 , F28D1/0477 , H05K7/203 , H05K7/20318 , H05K7/20772 , H05K7/20781 , H05K7/2079 , H05K7/20827 , H05K7/20836
摘要： A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

65. 发明授权

US08955347B2 Air-side economizer facilitating liquid-based cooling of an electronics rack 有权
标题翻译：空气侧节能器促进电子机架的液体冷却
公开(公告)号：US08955347B2
公开(公告)日：2015-02-17
申请号：US13187561
申请日：2011-07-21
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D23/12 , F25D17/02 , H05K7/20
CPC分类号： H05K7/20136 , H05K7/20209 , H05K7/203 , H05K7/20745 , H05K7/20781
摘要： A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.
摘要翻译：提供一种用于冷却电子机架的电子子系统的冷却装置和方法。该冷却装置包括一个局部冷却站，该冷却站具有液体 - 空气热交换器和用于引导冷却气流穿过热交换器的管道。冷却子系统与机架的电子子系统相关联，并且包括促进电子子系统的电子部件的浸入式冷却的壳体，或者向电子子系统的电子部件提供导电冷却的一个或多个液冷结构。冷却剂回路将冷却子系统连接到本地冷却站的液 - 空热交换器。在操作中，通过来自电子子系统的循环冷却剂传递热量，并将其在局部冷却站的液体 - 空气热交换器中排出到穿过液体 - 空气热交换器的冷却气流。在一个实施例中，冷却气流是室外空气。

66. 发明授权

US08955346B2 Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load 有权
标题翻译：冷却剂缓冲，蒸气压缩制冷装置和控制冷却剂热负荷的方法
公开(公告)号：US08955346B2
公开(公告)日：2015-02-17
申请号：US12939546
申请日：2010-11-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12 , F25B49/02 , F25B25/00 , H05K7/20
CPC分类号： F25B49/02 , F25B25/005 , F25B2400/01 , F25B2400/06 , F25B2500/28 , F25B2600/13 , F25B2700/21171 , H05K7/20809 , H05K7/20836 , Y02B30/745
摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.
摘要翻译：提供了用于冷却电子部件的装置和方法。该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通地连接以冷却和供应的冷却剂与制冷剂热交换器冷却剂冷却剂冷却结构。该装置还包括与冷却剂 - 制冷剂热交换器流体连通的制冷剂回路，并且热交换器通过从冷却剂回路中的冷却剂向制冷剂回路中的制冷剂散热而冷却通过其中的冷却剂。可控制的冷却剂加热器与冷却剂回路相关联，以在冷却剂回路中的冷却剂上提供可调整的热负荷，以确保至少最小的热负荷从冷却剂消耗到通过热交换器的制冷剂。

67. 发明授权

US08867209B2 Two-phase, water-based immersion-cooling apparatus with passive deionization 有权
标题翻译：具有无源去离子的两相水基浸没式冷却装置
公开(公告)号：US08867209B2
公开(公告)日：2014-10-21
申请号：US13187556
申请日：2011-07-21
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20 , F28F7/00 , F28D15/02 , H01L23/473 , H01L23/427 , H05K13/00 , F28D21/00
CPC分类号： H05K13/00 , F28D15/02 , F28D2021/0028 , H01L23/427 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K7/20236 , H05K7/203 , H05K7/20745 , H05K7/20772 , H05K7/20809 , Y10T29/49002 , Y10T29/49353 , H01L2924/00
摘要： Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.
摘要翻译：提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。冷却的电子模块包括支撑电子部件的基板，并且冷却装置耦合到基板，并且包括至少部分围绕电子部件周围并形成隔室的壳体。此外，冷却装置包括设置在隔室内的流体和去离子结构。电子部件至少部分地浸没在流体内，并且流体是水基流体。去离子结构包括去离子材料，其确保隔室内的流体的去离子。去离子结构便于从电子部件到设置在隔室中的冷凝器结构的沸腾热传递。随后将转移的热量传送到例如冷却冷凝器结构的液冷冷板或连接到壳体的风冷散热片。

68. 发明授权

US08369091B2 Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack 有权
标题翻译：用于电子机架的电子子系统的交错式浸入式冷却装置和方法
公开(公告)号：US08369091B2
公开(公告)日：2013-02-05
申请号：US12825761
申请日：2010-06-29
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： F28F3/04 , F28D2021/0031 , F28F3/12 , G06F1/20 , G06F2200/201 , H05K7/20236 , H05K7/20827
摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components.
摘要翻译：提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。冷却装置包括至少部分围绕电子子系统和形成密封隔室的壳体，以及设置在密封隔间内的电介质流体，使得电子子系统浸没在电介质流体内。提供了液体冷却的蒸汽冷凝器，其包括在密封隔室内延伸的多个导热冷凝器翅片。冷凝器翅片促进在密封隔室内产生的介电流体蒸气的冷却和冷凝。在密封隔室内，多个导热冷凝器翅片与浸没在电介质流体内的多个电子部件交错，以便于多个电子部件之间的介电流体蒸气的局部冷却和冷凝。

69. 发明授权

US08322154B2 Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system 有权
标题翻译：控制系统冷却液，以便于多蒸发器冷却系统中的两相热传递
公开(公告)号：US08322154B2
公开(公告)日：2012-12-04
申请号：US12556031
申请日：2009-09-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25B5/02 , F25D17/02 , F28D15/02
CPC分类号： H05K7/20381 , F28D15/0266 , F28D15/06
摘要： A cooling system and method are provided for facilitating two-phase heat transfer from an electronics system including a plurality of electronic devices to be cooled. The cooling system includes a plurality of evaporators coupled to the electronic devices, and a coolant loop for passing system coolant through the evaporators. The coolant loop includes a plurality of coolant branches coupled in parallel, with each coolant branch being coupled in fluid communication with a respective evaporator. The cooling system further includes a control unit for maintaining pressure of system coolant at a system coolant supply side of the coolant branches within a specific pressure range at or above saturation pressure of the system coolant for a given desired saturation temperature of system coolant into the evaporators to facilitate two-phase heat transfer in the plurality of evaporators from the electronic devices to the system coolant at the given desired saturation temperature.
摘要翻译：提供了一种冷却系统和方法，用于促进包括要冷却的多个电子设备的电子系统的两相热传递。冷却系统包括耦合到电子设备的多个蒸发器和用于使系统冷却剂通过蒸发器的冷却剂回路。冷却剂回路包括并联联接的多个冷却剂分支，每个冷却剂分支与相应的蒸发器流体连通地联接。冷却系统还包括一个控制单元，用于在系统冷却剂进入蒸发器的给定期望饱和温度下，在系统冷却剂的饱和压力或更高的特定压力范围内，保持冷却剂分支的系统冷却剂供应侧的系统冷却剂的压力。以促进在给定的所需饱和温度下从电子装置到系统冷却剂的多个蒸发器中的两相热传递。

70. 发明授权

US08208258B2 System and method for facilitating parallel cooling of liquid-cooled electronics racks 失效
标题翻译：用于促进液冷电子机架并联冷却的系统和方法
公开(公告)号：US08208258B2
公开(公告)日：2012-06-26
申请号：US12556053
申请日：2009-09-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079
摘要： A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics racks, and a main system coolant return loop with a plurality of system coolant return branch lines for facilitating return of exhausted system coolant from the electronics racks. When operational, cooled system coolant circulates through the coolant supply loop and exhausted system coolant circulates through the coolant return loop. A plurality of modular cooling units are coupled to the coolant supply loop and coolant return loop. Each modular cooling unit includes a heat exchanger to facilitate cooling of a portion of the exhausted coolant circulating through the main system coolant return loop for return as cooled system coolant to the main system coolant supply loop.
摘要翻译：提供了一种用于促进多个液冷电子机架的冷却的冷却系统和方法。冷却系统包括主系统冷却剂供应回路，其具有多个系统冷却剂供应分支管线，以便于将冷却的系统冷却剂供应到电子机架，以及具有多个系统冷却剂返回分支管线以便于返回的主系统冷却剂回流回路从电子机架排出的系统冷却液。冷却系统冷却剂在运行时循环通过冷却剂供应回路，排气系统冷却剂循环通过冷却液回流回路。多个模块化冷却单元联接到冷却剂供应回路和冷却剂回流回路。每个模块化冷却单元包括热交换器，以便于冷却循环通过主系统冷却剂回流回路的排出冷却剂的一部分，以便作为冷却系统冷却剂返回到主系统冷却剂供应回路。

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