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    • 64. 发明申请
    • ASYNCHRONOUSLY SCHEDULING MEMORY ACCESS REQUESTS
    • 非同步调度存储器访问请求
    • US20110238934A1
    • 2011-09-29
    • US12748600
    • 2010-03-29
    • Kun XuDavid B KramerJames A. Welker
    • Kun XuDavid B KramerJames A. Welker
    • G06F12/00
    • G06F13/1689G06F12/0215
    • A data processing system employs a scheduler to schedule pending memory access requests and a memory controller to service scheduled pending memory access requests. The memory access requests are asynchronously scheduled with respect to the clocking of the memory. The scheduler is operated using a clock signal with a frequency different from the frequency of the clock signal used to operate the memory controller. The clock signal used to clock the scheduler can have a lower frequency than the clock used by a memory controller. As a result, the scheduler is able to consider a greater number of pending memory access requests when selecting the next pending memory access request to be submitted to the memory for servicing and thus the resulting sequence of selected memory access requests is more likely to be optimized for memory access throughput.
    • 数据处理系统使用调度器来调度待执行的存储器访问请求和存储器控制器来服务预定的未决存储器访问请求。 存储器访问请求相对于存储器的时钟被异步调度。 使用频率不同于用于操作存储器控制器的时钟信号的频率的时钟信号来操作调度器。 用于时钟调度器的时钟信号的频率可能低于存储器控制器使用的时钟频率。 因此,当选择要提交给存储器进行服务的下一个未决的存储器访问请求时,调度器能够考虑更多数量的待处理存储器访问请求,因此所选择的存储器访问请求的结果序列更有可能被优化 用于内存访问吞吐量。
    • 65. 发明申请
    • TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
    • 化学机械抛光温度控制
    • US20100279435A1
    • 2010-11-04
    • US12433559
    • 2009-04-30
    • Kun XuJimin ZhangStephen JewThomas H. Osterheld
    • Kun XuJimin ZhangStephen JewThomas H. Osterheld
    • H01L21/66C23F1/08
    • B24B55/02B24B37/015
    • A chemical mechanical polishing apparatus including a platen for holding a pad having a polishing surface, a subsystem for holding a substrate and the polishing surface together during a polishing step, and a temperature sensor oriented to measure a temperature of the polishing surface, wherein the subsystem accepts the temperature measured by the sensor and is programmed to vary a polishing process parameter in response to the measured temperature. In an aspect, a chemical mechanical polishing apparatus having a platen for holding a pad having a polishing surface, a fluid delivery system for transporting a fluid from a source to the polishing surface, and a temperature controller which during operation controls the temperature of the fluid transported by the delivery system.
    • 一种化学机械抛光装置,包括用于在抛光步骤期间将用于保持具有抛光表面的焊盘的垫板,用于保持基板和抛光表面的子系统以及用于测量抛光表面的温度的温度传感器,其中所述子系统 接受由传感器测量的温度,并被编程以响应于测量的温度来改变抛光工艺参数。 一方面,一种具有用于保持具有抛光表面的焊盘的压板的化学机械抛光装置,用于将流体从源传送到抛光表面的流体输送系统以及在操作期间控制流体温度的温度控制器 由运送系统运输。