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61. 发明授权

US06284563B1 Method of making compliant microelectronic assemblies 失效
标题翻译：制造符合微电子组件的方法
公开(公告)号：US06284563B1
公开(公告)日：2001-09-04
申请号：US09071412
申请日：1998-05-01
申请人： Joseph Fjelstad
发明人： Joseph Fjelstad
IPC分类号： H01L2144
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： A method of making a compliant microelectronic assembly includes providing a microelectronic element having a first surface, the first surface having a central region and a peripheral region surrounding the central region, the microelectronic element including a plurality of contacts disposed in the central region and providing a compliant layer over the peripheral region of the first surface, the compliant layer having a bottom surface facing toward the first surface of the microelectronic element, a top surface facing upwardly away from the microelectronic element and one or more edge surfaces extending between the top and bottom surfaces. Next, flexible bond ribbons are selectively formed over the compliant layer so that the bond ribbons extend over the top surface and one or more of the edge surfaces and the bond ribbons electrically connect the contacts to conductive terminals overlying the top surface of the compliant layer.
摘要翻译：一种制造柔性微电子组件的方法包括提供具有第一表面的微电子元件，所述第一表面具有中心区域和围绕中心区域的周边区域，所述微电子元件包括设置在所述中心区域中的多个触点，柔性层具有面向微电子元件的第一表面的底表面，面向上远离微电子元件的顶表面和在顶部和底部之间延伸的一个或多个边缘表面表面。接下来，在柔性层上选择性地形成柔性粘结带，使得结合带在顶表面上延伸，并且一个或多个边缘表面和接合带将触点电连接到覆盖顺应层的顶表面的导电端子。

62. 发明授权

US06274820B1 Electrical connections with deformable contacts 有权
标题翻译：具有可变形触点的电气连接
公开(公告)号：US06274820B1
公开(公告)日：2001-08-14
申请号：US09653930
申请日：2000-09-01
申请人： Thomas H. DiStefano , John W. Smith , Konstantine N. Karavakis , Zlata Kovac , Joseph Fjelstad
发明人： Thomas H. DiStefano , John W. Smith , Konstantine N. Karavakis , Zlata Kovac , Joseph Fjelstad
IPC分类号： H01R909
CPC分类号： H01R13/2414 , H01R12/714 , H05K1/0272 , H05K1/036 , H05K1/056 , H05K1/116 , H05K3/0032 , H05K3/445 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0382 , H05K2201/09536 , H05K2201/09554 , H05K2201/096 , H05K2201/09827 , H05K2201/10378 , H05K2203/0554 , H05K2203/0582 , H05K2203/135 , H05K2203/308 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.
摘要翻译：用于微电子电路板之间的互连的插入件在其表面具有接触。每个接触件具有垂直于表面的中心轴线和适于根据由接合电路板上的焊盘施加的力而从中心轴线径向向外扩张的外围部分。因此，当电路板被内插件压缩时，触头径向膨胀并擦过焊盘。擦拭动作有助于将接触件接合到焊盘，如通过接触件本身上承载的导电接合材料。

63. 发明授权

US06229100B1 Low profile socket for microelectronic components and method for making the same 有权
标题翻译：用于微电子元件的薄型插座及其制造方法
公开(公告)号：US06229100B1
公开(公告)日：2001-05-08
申请号：US09234650
申请日：1999-01-21
申请人： Joseph Fjelstad
发明人： Joseph Fjelstad
IPC分类号： H01R1204
CPC分类号： H05K3/4092 , H01L23/32 , H01L23/49811 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/30107 , H01L2924/351 , Y10T29/49117 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , H01L2924/00
摘要： A connector for microelectronic elements includes electrically conductive, elongated leads having contact portions underlying a compliant layer. The contact portion of each lead overlies a pedestal portion of the compliant layer. The pedestal portion is at least partially isolated from the remaining portion of the compliant layer by gaps in the compliant layer. The pedestals may thus deflect horizontally, compensating for relative movement between the connector and the microelectronic element. Portions of the leads spanning the gaps may be curved to facilitate deflection. The pedestals may be attached to a substrate having terminals. A terminal end of each lead is then electrically connected to the terminal in the substrate, either through a plated through-hole, or by bending downward and bonding. The pedestals may support a plurality of leads along their length. Alternatively, the pedestals may support only a single respective lead, in which case the pedestal is isolated from neighboring pedestals and may deflect in a plurality of horizontal directions.
摘要翻译：用于微电子元件的连接器包括导电的细长导线，其具有位于柔顺层下面的接触部分。每个引线的接触部分覆盖柔性层的基座部分。通过顺应层中的间隙，基座部分至少部分地与柔性层的剩余部分隔离。因此，基座可能水平偏转，补偿连接器和微电子元件之间的相对运动。跨越间隙的引线的一些部分可以是弯曲的以便于偏转。基座可以附接到具有端子的基板。然后，每个引线的末端通过电镀通孔或通过向下弯曲和结合而电连接到衬底中的端子。基座可以沿其长度支撑多个引线。或者，基座可以仅支撑单个相应的引线，在这种情况下，基座与相邻的基座隔离并且可以在多个水平方向上偏转。

64. 发明授权

US06211690B1 Apparatus for electrically testing bare printed circuits 有权
标题翻译：用于电测试裸印刷电路的装置
公开(公告)号：US06211690B1
公开(公告)日：2001-04-03
申请号：US09170904
申请日：1998-10-13
申请人： Joseph Fjelstad
发明人： Joseph Fjelstad
IPC分类号： G01R1073
CPC分类号： G01R1/07328 , G01R31/2805 , H05K1/118 , H05K3/326
摘要： A testing fixture for microelectronic elements is in the nature of an interposer which is operative for receiving a plurality of test probes. The interposer enables the simultaneous testing of contacts on the microelectronic element which are arranged in both high contact pitch density areas and normal contact pitch density areas. The contacts on the microelectronic element within the high contact pitch density areas are accessed by conductive leads on the interposer having rigid portions arranged in a corresponding high contact pitch density.
摘要翻译：用于微电子元件的测试夹具是插入器的性质，其可操作用于接收多个测试探针。插入器能够同时测试布置在高接触间距密度区域和正常接触间距密度区域中的微电子元件上的触点。在高接触间距密度区域内的微电子元件上的触点由具有以相应的高接触间距密度排列的刚性部分的插入件上的导电引线接近。

65. 发明授权

US06205660B1 Method of making an electronic contact 失效
标题翻译：制作电子联系人的方法
公开(公告)号：US06205660B1
公开(公告)日：2001-03-27
申请号：US08845014
申请日：1997-04-22
申请人： Joseph Fjelstad , John W. Smith , Thomas H. Distefano , James Zaccardi , A. Christian Walton
发明人： Joseph Fjelstad , John W. Smith , Thomas H. Distefano , James Zaccardi , A. Christian Walton
IPC分类号： H01R4300
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/07357 , G01R3/00 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01L24/81 , H01L2224/16237 , H01L2224/45144 , H01L2224/8114 , H01L2224/81385 , H01L2224/81899 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01R12/7076 , H01R13/2485 , H05K1/118 , H05K3/326 , H05K3/3431 , H05K3/3436 , H05K3/4092 , H05K7/1069 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/4921 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.
摘要翻译：诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。每个粗糙部分的尖端具有远离接触表面的尖端特征。当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连和任选的有效的冶金结合接合材料。

66. 发明授权

US06204091B1 Method of assembling a semiconductor chip package 有权
标题翻译：组装半导体芯片封装的方法
公开(公告)号：US06204091B1
公开(公告)日：2001-03-20
申请号：US09505609
申请日：2000-02-17
申请人： John W. Smith , Joseph Fjelstad
发明人： John W. Smith , Joseph Fjelstad
IPC分类号： H01L2334
CPC分类号： H01L23/3107 , H01L21/56 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/81 , H01L24/84 , H01L24/92 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/4024 , H01L2224/92122 , H01L2224/84 , H01L2924/00014
摘要： A method of encapsulating a microelectronic assembly includes providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at the exterior surfaces, the one or more elements defining one or more apertures through the exterior surfaces. A layer of a curable barrier material is then provided on a supporting element. The barrier layer has openings therein in a pattern corresponding to the array of terminals on the one or more microelectronic assemblies. The supporting element and the one or more microelectronic elements are then assembled together so that the layer of barrier material contacts the exterior surfaces and covers the apertures and so that the openings in the layer of barrier material are aligned with the terminals. The barrier material is then cured while in contact with the exterior surfaces to thereby form a barrier layer covering the apertures. Next, a curable liquid encapsulant is applied to the microelectronic assemblies, whereby the barrier layer prevents the curable liquid encapsulant from flowing through the apertures, and the encapsulant is cured. The barrier layer and the supporting element cooperatively surround the terminals exposed at the exterior surfaces to protect the terminals from contaminants.
摘要翻译：封装微电子组件的方法包括提供一个或多个微电子组件，其具有限定外表面的一个或多个元件和暴露在外表面处的端子阵列，所述一个或多个元件限定通过外表面的一个或多个孔。然后在支撑元件上设置一层可固化阻挡材料。阻挡层在其中具有对应于一个或多个微电子组件上的端子阵列的图案中的开口。然后将支撑元件和一个或多个微电子元件组装在一起，使得阻挡层的层与外表面接触并覆盖孔，使得阻挡材料层中的开口与端子对准。然后在与外表面接触的同时固化阻挡材料，从而形成覆盖孔的阻挡层。接下来，将可固化液体密封剂施加到微电子组件，由此阻挡层防止可固化液体密封剂流过孔，并且密封剂固化。阻挡层和支撑元件协同地围绕暴露在外表面处的端子以保护端子免受污染物的影响。

67. 发明授权

US6130116A Method of encapsulating a microelectronic assembly utilizing a barrier 失效
标题翻译：封装利用屏障的微电子组件的方法
公开(公告)号：US6130116A
公开(公告)日：2000-10-10
申请号：US984933
申请日：1997-12-04
申请人： John W. Smith , Joseph Fjelstad
发明人： John W. Smith , Joseph Fjelstad
IPC分类号： H01L21/56 , H01L23/31
CPC分类号： H01L23/3107 , H01L21/56 , H01L24/40 , H01L24/73 , H01L24/81 , H01L24/84 , H01L24/92 , H01L2224/4024 , H01L2224/92122
摘要： A method of encapsulating a microelectronic assembly includes providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at the exterior surfaces, the one or more elements defining one or more apertures through the exterior surfaces. A layer of a curable barrier material is then provided on a supporting element. The barrier layer has openings therein in a pattern corresponding to the array of terminals on the one or more microelectronic assemblies. The supporting element and the one or more microelectronic elements are then assembled together so that the layer of barrier material contacts the exterior surfaces and covers the apertures and so that the openings in the layer of barrier material are aligned with the terminals. The barrier material is then cured while in contact with the exterior surfaces to thereby form a barrier layer covering the apertures. Next, a curable liquid encapsulant is applied to the microelectronic assemblies, whereby the barrier layer prevents the curable liquid encapsulant from flowing through the apertures, and the encapsulant is cured. The barrier layer and the supporting element cooperatively surround the terminals exposed at the exterior surfaces to protect the terminals from contaminants.
摘要翻译：封装微电子组件的方法包括提供一个或多个微电子组件，其具有限定外表面的一个或多个元件和暴露在外表面处的端子阵列，所述一个或多个元件限定通过外表面的一个或多个孔。然后在支撑元件上设置一层可固化阻挡材料。阻挡层在其中具有对应于一个或多个微电子组件上的端子阵列的图案中的开口。然后将支撑元件和一个或多个微电子元件组装在一起，使得阻挡层的层与外表面接触并覆盖孔，使得阻挡材料层中的开口与端子对准。然后在与外表面接触的同时固化阻挡材料，从而形成覆盖孔的阻挡层。接下来，将可固化液体密封剂施加到微电子组件，由此阻挡层防止可固化液体密封剂流过孔，并且密封剂固化。阻挡层和支撑元件协同地围绕暴露在外表面处的端子以保护端子免受污染物的影响。

68. 发明授权

US6107123A Methods for providing void-free layers for semiconductor assemblies 有权
标题翻译：为半导体组件提供无空隙层的方法
公开(公告)号：US6107123A
公开(公告)日：2000-08-22
申请号：US188599
申请日：1998-11-09
申请人： Thomas H. Distefano , Joseph Fjelstad
发明人： Thomas H. Distefano , Joseph Fjelstad
IPC分类号： H01L21/56 , H01L21/68 , H01L23/31 , H01L23/495 , H01L21/44
CPC分类号： H01L21/568 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/3107 , H01L23/3114 , H01L23/49572 , H01L24/32 , H01L24/80 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2224/08225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/80203 , H01L2224/80207 , H01L2224/81192 , H01L2224/81904 , H01L2224/83209 , H01L2224/9212 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311
摘要： A method for the removal of voids and gas bubbles within uncured or partially cured microelectronic component enapsulants and adhesive/chip attach layers. A sealed void or gas bubble within a gap between a microelectronic component and a supporting substrate is substantially eliminated through the application of a uniform pressure (isostatic or hydrostatic) and energy such that a substantially void/bubble free interposer is created.
摘要翻译：在未固化或部分固化的微电子元件助剂和粘合剂/芯片附着层中去除空隙和气泡的方法。通过施加均匀的压力（等静压或静水压）和能量使得产生基本上无空隙/无气泡的中间层，基本上消除了微电子部件和支撑基板之间的间隙内的密封空隙或气泡。

69. 发明授权

US6093584A Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads 失效
标题翻译：用于封装具有穿过牺牲层和接触垫的孔的半导体封装的方法
公开(公告)号：US6093584A
公开(公告)日：2000-07-25
申请号：US85352
申请日：1998-05-27
申请人： Joseph Fjelstad
发明人： Joseph Fjelstad
IPC分类号： D21F1/06 , D21G9/00 , H01L21/48 , H01L21/56 , H01L21/68 , H01L23/31 , H01L25/18 , H01L21/44
CPC分类号： H01L21/568 , H01L21/4832 , H01L21/56 , H01L21/561 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L24/49 , H01L24/97 , H01L25/18 , H01L2221/68377 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48475 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2224/83192 , H01L2224/85001 , H01L2224/85051 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/18165 , H01L2924/19043 , H01L2924/19107 , H01L2924/3011
摘要： A method of manufacturing a semiconductor chip package. A sacrificial layer is used as a base to selectively form an array of conductive pads such that a central region is defined by the pads. A back surface of a semiconductor chip is next attached to the sacrificial layer within the central region between the pads so that the contact bearing surface of the chip faces away from the sacrificial layer. The chip contacts are then electrically connected to respective pads, typically by wire bonding a wire therebetween. A curable, dielectric liquid encapsulant is then deposited on the sacrificial layer such that the pads, electrical connections and chip are fully encapsulated, as by an overmolding operation. The encapsulant is then cured and the sacrificial layer is either completely removed or is selectively removed to expose a surface of the pads for electrical attachment to a PWB and the back surface of the chip for creating a direct thermal path from the chip to the PWB.
摘要翻译：一种制造半导体芯片封装的方法。牺牲层用作基底以选择性地形成导电焊盘的阵列，使得中心区域由焊盘限定。接下来，半导体芯片的背面附着在焊盘之间的中心区域内的牺牲层，使得芯片的接触支承表面背离牺牲层。芯片触点然后电连接到相应的焊盘，通常通过在其间引线接合线。然后将可固化的介电液体密封剂沉积在牺牲层上，使得焊盘，电连接和芯片被完全封装，如通过包覆成型操作。然后将密封剂固化并且牺牲层被完全去除或者被选择性地去除以暴露焊盘的表面以电连接到PWB和芯片的后表面，以形成从芯片到PWB的直接热路径。

70. 发明授权

US6002168A Microelectronic component with rigid interposer 失效
标题翻译：具有刚性插入器的微电子元件
公开(公告)号：US6002168A
公开(公告)日：1999-12-14
申请号：US978082
申请日：1997-11-25
申请人： Pieter H. Bellaar , Thomas H. DiStefano , Joseph Fjelstad , Christopher M. Pickett , John W. Smith
发明人： Pieter H. Bellaar , Thomas H. DiStefano , Joseph Fjelstad , Christopher M. Pickett , John W. Smith
IPC分类号： H01L23/498 , H05K3/28 , H05K3/34 , H05K3/40 , H01L23/48 , H01L23/06 , H01L23/52
CPC分类号： H01L23/49816 , H01L23/4985 , H05K3/3436 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K2201/049 , H05K2201/10234 , H05K2201/10378 , H05K2201/10977 , H05K2203/041 , H05K3/284 , H05K3/4084 , Y02P70/613
摘要： A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.
摘要翻译：一种微电子部件，用于将诸如混合电路的刚性基板安装到刚性支撑基板，例如印刷电路板。微电子部件包括可以在其第一表面上安装芯片的刚性插入器; 刚性插入件上的接触图案; 位于刚性插入件的第二表面上的柔性插入件; 柔性插入器上的端子图案; 柔性线以及安装在柔性插入件上的焊接铜球。微电子部件可以具有安装在刚性插入件的第一表面上的插座组件。微电子部件可以安装在刚性支撑基板上。

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