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61. 发明授权

US06991516B1 Chemical mechanical polishing with multi-stage monitoring of metal clearing 有权
标题翻译：化学机械抛光多级监控金属清理
公开(公告)号：US06991516B1
公开(公告)日：2006-01-31
申请号：US10920726
申请日：2004-08-17
申请人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
发明人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B49/105 , B24B37/04 , B24B49/12
摘要： A plurality of portions of a substrate are monitored during polishing at a first polishing station with an in-situ monitoring system. A plurality of thicknesses are determined based on measurements by the in-situ monitoring system, and the plurality of pressures to apply to the plurality of regions of the substrate are calculated in a closed-loop control system. However, if a representative thickness of the layer is less than a threshold thickness, calculation of the plurality of pressures by the closed-loop control system is halted and a plurality of predetermined pressures are applied to the plurality of regions of the substrate.
摘要翻译：在具有原位监测系统的第一抛光站的抛光期间，监测基板的多个部分。基于通过原位监测系统的测量确定多个厚度，并且在闭环控制系统中计算应用于衬底的多个区域的多个压力。然而，如果层的代表性厚度小于阈值厚度，则闭环控制系统的多个压力的计算被停止，并且多个预定压力施加到基板的多个区域。

62. 发明授权

US06945845B2 Chemical mechanical polishing apparatus with non-conductive elements 有权
标题翻译：具有非导电元件的化学机械抛光装置
公开(公告)号：US06945845B2
公开(公告)日：2005-09-20
申请号：US10643773
申请日：2003-08-18
申请人： Doyle E Bennett , Sandeep R Koppikar , Jeffrey Drue David , Boguslaw A Swedek , Nils Johansson
发明人： Doyle E Bennett , Sandeep R Koppikar , Jeffrey Drue David , Boguslaw A Swedek , Nils Johansson
IPC分类号： B24B37/04 , B24B49/10 , B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/04 , B24B49/105
摘要： Conductive elements of a chemical mechanical polishing system may generate undesired eddy currents under the influence of a time-dependent magnetic field used in an eddy current monitoring system. To improve the accuracy of an eddy current monitoring system, elements that may contribute an undesired signal to the sensed eddy current signal may be fabricated from a non-conductive material such as plastic or ceramic. In some implementations, elements may be fabricated from non-magnetic materials.
摘要翻译：化学机械抛光系统的导电元件可能在涡流监测系统中使用的时间依赖磁场的影响下产生不期望的涡流。为了提高涡流监测系统的精度，可能会对非传导性材料（如塑料或陶瓷）制造可能对感测到的涡流信号造成不必要信号的元件。在一些实施方案中，元件可以由非磁性材料制成。

63. 发明授权

US08815109B2 Spectra based endpointing for chemical mechanical polishing 有权
标题翻译：基于光谱的化学机械抛光终点
公开(公告)号：US08815109B2
公开(公告)日：2014-08-26
申请号：US13339057
申请日：2011-12-28
申请人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
发明人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
IPC分类号： C03C15/00
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.
摘要翻译：监测抛光过程的计算机实现的方法包括：对于经历抛光的衬底上的光学传感器的多个扫描的每次扫描，获得多个电流光谱，多个电流光谱的每个电流光谱是由对于多个扫描的每次扫描，从基板反射白光，确定多个参考光谱的每个当前光谱和每个参考光谱之间的差异，以对于多个扫描的每次扫描产生多个差异，确定多个差异的最小差异，从而产生最小差异的序列，并且基于最小差异的序列确定抛光端点。

64. 发明申请

US20090017726A1 SPECTRA BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING 有权
标题翻译：用于化学机械抛光的基于光谱的端基
公开(公告)号：US20090017726A1
公开(公告)日：2009-01-15
申请号：US12182076
申请日：2008-07-29
申请人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
发明人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
IPC分类号： B24B49/06 , G01B11/06 , B24B49/12
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
摘要翻译：用于基于频谱的终点的方法和装置。一种终点方法包括选择两个或更多个参考光谱。每个参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。为特定的基于光谱的端点确定逻辑选择参考光谱，以便通过应用特定的基于光谱的端点逻辑来调用端点时实现目标厚度。该方法包括获得两个或更多个当前光谱。每个电流光谱是当感兴趣的膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二衬底上从感兴趣的膜反射的白光的光谱。该方法包括为第二基底确定何时已经实现了抛光步骤的终点。

65. 发明授权

US08518827B2 Spectrum based endpointing for chemical mechanical polishing 有权
标题翻译：基于光谱的化学机械抛光终点
公开(公告)号：US08518827B2
公开(公告)日：2013-08-27
申请号：US12843782
申请日：2010-07-26
申请人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek
发明人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek
IPC分类号： H01L21/302
CPC分类号： H01L22/26 , B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , B24D7/14 , H01L21/30625 , H01L21/31053 , H01L21/31055 , H01L21/3212 , H01L21/67075 , H01L21/67092 , H01L21/67253
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
摘要翻译：用于基于频谱的终点的方法和装置。终点方法包括选择参考频谱。参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。对于特定的基于频谱的端点确定逻辑，经验地选择参考频谱，使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。该方法包括获得当前频谱。目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二基板上从感兴趣的薄膜反射的白光的光谱。该方法包括为第二基底确定何时已经实现了抛光步骤的终点。该确定基于参考和当前光谱。

66. 发明授权

US07406394B2 Spectra based endpointing for chemical mechanical polishing 有权
标题翻译：基于光谱的化学机械抛光终点
公开(公告)号：US07406394B2
公开(公告)日：2008-07-29
申请号：US11261742
申请日：2005-10-28
申请人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
发明人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
IPC分类号： G01B5/02 , G01B7/02 , G01B11/02 , G01B13/02
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
摘要翻译：用于基于频谱的终点的方法和装置。一种终点方法包括选择两个或更多个参考光谱。每个参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。为特定的基于光谱的端点确定逻辑选择参考光谱，以便通过应用特定的基于光谱的端点逻辑来调用端点时实现目标厚度。该方法包括获得两个或更多个当前光谱。每个电流光谱是当感兴趣的膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二衬底上从感兴趣的膜反射的白光的光谱。该方法包括为第二基底确定何时已经实现了抛光步骤的终点。

67. 发明授权

US07074109B1 Chemical mechanical polishing control system and method 有权
标题翻译：化学机械抛光控制系统及方法
公开(公告)号：US07074109B1
公开(公告)日：2006-07-11
申请号：US10920701
申请日：2004-08-17
申请人： Doyle E Bennett , Jeffrey Drue David , Manoocher Birang , Jimin Zhang , Boguslaw A Swedek
发明人： Doyle E Bennett , Jeffrey Drue David , Manoocher Birang , Jimin Zhang , Boguslaw A Swedek
IPC分类号： B24B49/00
CPC分类号： H01L21/3212 , B24B37/013 , B24B49/00 , H01L22/26
摘要： A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.
摘要翻译：一种用于化学机械抛光衬底的系统，方法和计算机程序产品，其中最初将多个预定压力施加到衬底的多个区域。在用原位监测系统进行抛光时监测基板的多个部分。如果基板的两个部分之间的厚度差超过预定阈值，则在闭环控制系统中计算多个调节压力，并且将多个调节压力施加到基板的多个区域。预定阈值包括用于开始抛光处理的初始阈值和在抛光过程开始之后的抛光周期的第二阈值。

68. 发明授权

US08834229B2 Dynamically tracking spectrum features for endpoint detection 有权
标题翻译：动态跟踪用于端点检测的频谱特征
公开(公告)号：US08834229B2
公开(公告)日：2014-09-16
申请号：US13090926
申请日：2011-04-20
申请人： Jeffrey Drue David , Harry Q. Lee
发明人： Jeffrey Drue David , Harry Q. Lee
IPC分类号： B24B49/00 , G01B11/06
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , G01N21/25
摘要： A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.
摘要翻译：控制抛光的方法包括抛光衬底并接收所选择的光谱特征的识别，具有宽度的波长范围以及所选择的光谱特征的特征以在抛光期间进行监视。在衬底被抛光的同时测量来自衬底的光的光谱序列。从光谱序列中产生所选光谱特征的特征值的序列。对于来自光谱序列的至少一些光谱，基于在光谱序列中用于先前光谱的先前波长范围内的光谱特征的位置来生成修改的波长范围，将修改的波长范围搜索所选择的光谱特征和所选光谱特征的特征值被确定。

69. 发明授权

US08467896B2 Feedback for polishing rate correction in chemical mechanical polishing 有权
标题翻译：化学机械抛光抛光率校正的反馈
公开(公告)号：US08467896B2
公开(公告)日：2013-06-18
申请号：US13480434
申请日：2012-05-24
申请人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q. Lee
发明人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q. Lee
IPC分类号： G06F19/00 , B24B49/04 , B24B49/12
CPC分类号： B24B49/04 , B24B49/12
摘要： A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
摘要翻译：研磨具有多个区域的基板并测量光谱。对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引预计时间比没有这样的调整。基于对先前基板计算的反馈误差来计算调整。基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

70. 发明申请

US20110275281A1 Dynamically Tracking Spectrum Features For Endpoint Detection 有权
标题翻译：动态跟踪频谱特征进行端点检测
公开(公告)号：US20110275281A1
公开(公告)日：2011-11-10
申请号：US13090926
申请日：2011-04-20
申请人： Jeffrey Drue David , Harry Q. Lee
发明人： Jeffrey Drue David , Harry Q. Lee
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , G01N21/25
摘要： A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.
摘要翻译：控制抛光的方法包括抛光衬底并接收所选择的光谱特征的识别，具有宽度的波长范围以及所选择的光谱特征的特征以在抛光期间进行监视。在衬底被抛光的同时测量来自衬底的光的光谱序列。从光谱序列中产生所选光谱特征的特征值的序列。对于来自光谱序列的至少一些光谱，基于在光谱序列中用于先前光谱的先前波长范围内的光谱特征的位置来生成修改的波长范围，将修改的波长范围搜索所选择的光谱特征和所选光谱特征的特征值被确定。

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