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    • 64. 发明授权
    • Process for forming a photoresist pattern by top surface imaging process
    • 通过顶表面成像工艺形成光致抗蚀剂图案的工艺
    • US06319654B1
    • 2001-11-20
    • US09566290
    • 2000-05-05
    • Myoung Soo KimJae Chang JungHyung Gi KimKi Ho Baik
    • Myoung Soo KimJae Chang JungHyung Gi KimKi Ho Baik
    • G03F740
    • G03F7/38G03F7/0045G03F7/038G03F7/265Y10S430/168
    • The present invention relates to a process for forming a photoresist pattern by employing a silylation process, and particularly to a method for forming a photoresist pattern according to a top surface imaging (TSI) process using a photoresist composition comprising a cross-linker having a cross-linker monomer of the following Chemical Formula 1 or 2. The photoresist composition containing a polymer of the above cross-linker monomer is preferably used in a TSI process which has been optimized by controlling the conditions of each step, such as temperature and time, thereby obtaining an ultrafine pattern that can be more efficiently applied to a 4 G or 16 G DRAM semiconductor fabrication process: wherein, R1, R2, R3, R5, R6, R7, R, m and n are as defined in the specification attached hereto.
    • 本发明涉及一种通过使用甲硅烷化方法形成光致抗蚀剂图案的方法,特别涉及一种使用光致抗蚀剂组合物的顶表面成像(TSI)方法形成光致抗蚀剂图案的方法,所述光致抗蚀剂组合物包含交联剂 含有上述交联剂单体的聚合物的光致抗蚀剂组合物优选用于通过控制各步骤的条件如温度和时间而优化的TSI方法, 从而获得可以更有效地应用于4G或16G DRAM半导体制造工艺的超精细图案:其中,R1,R2,R3,R5,R6,R7,R,m和n如本文所附的说明书中所定义。 。
    • 65. 发明授权
    • Photoresist cross-linker and photoresist composition comprising the same
    • 光阻抗交联剂和包含其的光致抗蚀剂组合物
    • US06312868B1
    • 2001-11-06
    • US09501096
    • 2000-02-09
    • Keun Kyu KongJae Chang JungMyoung Soo KimHyoung Gi KimHyeong Soo KimKi Ho Baik
    • Keun Kyu KongJae Chang JungMyoung Soo KimHyoung Gi KimHyeong Soo KimKi Ho Baik
    • G03F7004
    • G03F7/0045G03F7/038
    • The present invention is directed to photoresist cross-linkers selected from the group consisting of a cross-linker monomer represented by following Chemical Formula 1, and homopolymers and copolymers thereof. Such cross-linkers are suitable for use in photolithography processes employing KrF(248nm), ArF(193nm), E-beam, ion-beam or EUV light sources. wherein X1 and X2 individually represent CH2, CH2CH2, O or S; p and s individually represent an integer from 0 to 5; q is 0 or 1; R′ and R″ independently represent hydrogen or methyl; R represents straight or branched C1-10 alkyl, straight or branched C1-10 ether, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ether including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group; R1 and R2 independently represent hydrogen, straight or branched C1-10 alkyl, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group.
    • 本发明涉及选自由以下化学式1表示的交联剂单体和其均聚物和共聚物的光致抗蚀剂交联剂。 这种交联剂适用于采用KrF(248nm),ArF(193nm),电子束,离子束或EUV光源的光刻工艺.X1和X2分别表示CH2,CH2CH2,O或S; p和s各自表示0至5的整数; q为0或1; R'和R“独立地表示氢或甲基; R代表直链或支链C 1-10烷基,直链或支链C1-10醚,直链或支链C1-10酯,直链或支链C 1-10酮,直链或支链C 1-10羧酸,直链或支链C 1-10缩醛 包括至少一个羟基的直链或支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10醚,包括至少一个羟基的直链或支链C 1-10酯,直链或支链C 1-10酮 包括至少一个羟基,包括至少一个羟基的直链或支链C 1-10羧酸,和包含至少一个羟基的直链或支链C 1-10缩醛; R 1和R 2独立地表示氢,直链或支链C 1-10烷基,直链或支链C 1-10酯,直链或支链C 1-10酮,直链或支链C 1-10羧酸,直链或支链C 1-10缩醛,直链或 包括至少一个羟基的支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10酯,包括至少一个羟基,直链或支链C 1-10羧酸的直链或支链C 1-10酮包括 至少一个羟基,以及包含至少一个羟基的直链或支链C 1-10缩醛。