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61. 发明授权

US08731883B2 Techniques for thermal modeling of data centers to improve energy efficiency 有权
标题翻译：数据中心热建模技术，以提高能源效率
公开(公告)号：US08731883B2
公开(公告)日：2014-05-20
申请号：US13644234
申请日：2012-10-03
申请人： International Business Machines Corporation
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , Theodore G. vanKessel
IPC分类号： G06G7/54 , G06G7/48
CPC分类号： G06F1/206 , G06F17/5004 , G06F2217/80 , H05K7/20836 , Y02D10/16
摘要： Techniques for modeling a data center are provided. In one aspect, a method for modeling a data center is provided. The method comprises the following steps. Spatially dense three-dimensional thermal distribution and air flow measurements made in the data center using a mobile off-line surveying system are obtained. A temperature and air flow model for the data center is created using the spatially dense three-dimensional thermal distribution and air flow measurements. The temperature and air flow model is used to make thermal distribution and air flow predictions of the data center. The thermal distribution and air flow predictions are compared with the thermal distribution and air flow measurements made using the mobile off-line surveying system to produce a validated model for the data center.
摘要翻译：提供了数据中心建模技术。在一方面，提供了一种用于建模数据中心的方法。该方法包括以下步骤。获得了使用移动离线测量系统在数据中心进行的空间密集三维热分布和气流测量。使用空间密集的三维热分布和空气流量测量，创建数据中心的温度和气流模型。温度和气流模型用于对数据中心进行热分布和气流预测。将热分布和气流预测与使用移动离线测量系统进行的热分布和气流测量进行比较，以生成数据中心的验证模型。

62. 发明申请

US20140104787A1 INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD 审中-公开
公开(公告)号：US20140104787A1
公开(公告)日：2014-04-17
申请号：US14106840
申请日：2013-12-15
申请人： International Business Machines Corporation
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K13/00 , H01L21/4882 , H01L23/40 , H01L23/42 , H01L23/44 , H01L23/467 , H01L23/473 , H01L2224/16225 , H05K7/20009 , H05K7/20254 , Y10T29/49117
摘要： Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.

63. 发明申请

US20140101933A1 INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD 审中-公开
标题翻译：用于集成电路和电路板的可互换冷却系统
公开(公告)号：US20140101933A1
公开(公告)日：2014-04-17
申请号：US14106845
申请日：2013-12-15
申请人： International Business Machines Corporation
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K13/00
CPC分类号： H05K13/00 , H01L21/4882 , H01L23/40 , H01L23/42 , H01L23/44 , H01L23/467 , H01L23/473 , H01L2224/16225 , H05K7/20009 , H05K7/20254 , Y10T29/49117
摘要： Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.
摘要翻译：提供冷却系统互换性的几种设备和方法。一种装置包括热耦合到集成电路的导热板。导热板被配置为可互换地耦合到液体冷却组件或空气冷却组件，并且液体冷却组件和空气冷却组件是分离的装置。

64. 发明授权

US11019755B2 Effectiveness-weighted control of cooling system components 有权
公开(公告)号：US11019755B2
公开(公告)日：2021-05-25
申请号：US16749134
申请日：2020-01-22
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. ELLSWORTH, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： G05D23/00 , H05K7/20 , G05D23/19 , G05B15/02
摘要： Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

65. 发明授权

US10342165B2 Data center coolant switch 有权
公开(公告)号：US10342165B2
公开(公告)日：2019-07-02
申请号：US14867161
申请日：2015-09-28
申请人： International Business Machines Corporation
发明人： Madhusudan K. Iyengar , Pritish R. Parida , Mark D. Schultz
IPC分类号： F25B25/00 , H05K7/20 , F28D15/00
摘要： A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

66. 发明授权

US09936607B2 Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader 有权
公开(公告)号：US09936607B2
公开(公告)日：2018-04-03
申请号：US14564265
申请日：2014-12-09
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： F28D15/02 , H05K7/20
CPC分类号： H05K7/20336 , F28D15/02 , H05K7/20509 , H05K7/20772 , H05K7/20936
摘要： Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

67. 发明授权

US09719865B2 Thermally determining flow and/or heat load distribution in parallel paths 有权
公开(公告)号：US09719865B2
公开(公告)日：2017-08-01
申请号：US13687779
申请日：2012-11-28
申请人： International Business Machines Corporation
发明人： Timothy J. Chainer , Madhusudan K. Iyengar , Pritish R. Parida
IPC分类号： G01K15/00 , G01K7/42 , G01J5/52 , G01J5/00
CPC分类号： G01K15/005 , G01J5/0003 , G01J5/522 , G01K7/427 , G01K15/00 , G01K2007/422 , G06F2200/201
摘要： A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

68. 发明授权

US09686889B2 Field-replaceable bank of immersion-cooled electronic components 有权
公开(公告)号：US09686889B2
公开(公告)日：2017-06-20
申请号：US14827617
申请日：2015-08-17
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/203 , H05K7/20 , H05K7/20236 , H05K7/20336 , H05K7/20781
摘要： A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

69. 发明授权

US09357675B2 Pump-enhanced, immersion-cooling of electronic component(s) 有权
标题翻译：泵增强型，电子部件的浸入式冷却
公开(公告)号：US09357675B2
公开(公告)日：2016-05-31
申请号：US14058530
申请日：2013-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： H05K7/20318 , B23P15/26 , B23P2700/10 , H05K7/203 , H05K7/20781 , H05K7/2079 , Y10T29/49361
摘要： Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.
摘要翻译：提供冷却装置及其制造方法，其有助于电子部件的抽吸浸没冷却。所述冷却装置包括具有容纳所述电子部件的隔室的外壳和所述隔室内的介电流体，至少部分地浸没所述电子部件。液体冷却散热器与外壳相关联，以冷却与隔室相关联的至少一个冷却表面，并且便于通过介电流体从电子部件传递到散热器。泵设置在隔室的外部并与其流体连通以便于泵送的介电流体流过隔间。泵送的电介质流体流过隔室增强了通过冷却表面从电子部件到液体冷却的散热器的热传递。在一个实施方案中，泵送介质流体流通过沸腾流向电子部件提供两相冷却。

70. 发明授权

US09342079B2 Controlled cooling of an electronic system based on projected conditions 有权
公开(公告)号：US09342079B2
公开(公告)日：2016-05-17
申请号：US13775545
申请日：2013-02-25
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Milnes P. David , Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G05D23/00 , G05D23/19 , H05K7/20
CPC分类号： G05D23/00 , G05D23/1919 , H05K7/20836
摘要： Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system.

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