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61. 发明授权

US06973801B1 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack 有权
标题翻译：在电子机架的电子子系统内使用闭环冷却剂路径和微型冷却结构的冷却系统和方法
公开(公告)号：US06973801B1
公开(公告)日：2005-12-13
申请号：US11008711
申请日：2004-12-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D23/12 , H01L23/473 , H05K7/20
CPC分类号： H05K7/2079 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.
摘要翻译：为电子机架的一个或多个子系统提供冷却方法。冷却方式采用冷却液分配单元和散热单元。冷却剂分配单元具有第一热交换器，第一冷却回路和第二冷却回路。第一冷却回路使设备冷却剂通过第一热交换器，并且第二冷却回路将系统冷却剂提供给电子子系统，并将第一热交换器中的热量从子系统排出到设备冷却剂。散热单元与电子子系统相关联并且包括第二热交换器，第二冷却回路和第三冷却回路。第二冷却回路为第二热交换器提供系统冷却剂，第三冷却回路将调节后的冷却剂循环在电子子系统内，并将第二热交换器中的热量从电子系统排出到系统冷却剂。

62. 发明授权

US09295182B2 Dual coil with adapter to move between redundant and non-redundant high performance heat exchanger 有权
标题翻译：双线圈与适配器在冗余和非冗余高性能热交换器之间移动
公开(公告)号：US09295182B2
公开(公告)日：2016-03-22
申请号：US13296207
申请日：2011-11-14
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： F28D15/00 , B23P15/26 , H05K7/20 , F28D21/00
CPC分类号： H05K7/20736 , F28D2021/0028 , F28F2210/04 , H05K7/20618 , H05K7/20781 , Y10T29/4935
摘要： An apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack. The system includes a cooling system having at least two liquid cooling circuits. The system also includes a rear door heat exchanger connected to the cooling system. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system.
摘要翻译：一种用于控制用于服务器机架的冷却系统的冗余的装置，后门热交换器，系统和方法。该系统包括具有至少两个液体冷却回路的冷却系统。该系统还包括连接到冷却系统的后门热交换器。后门热交换器包括两个热交换线圈。每个热交换线圈由服务器机架承载，并配置成与不同的液体冷却回路接口。后门热交换器还包括配置成将两个热交换盘管连接在一起的一个热交换单元中的适配器。热交换单元配置成与来自冷却系统的一个液体冷却回路相连接。

63. 发明授权

US09110476B2 Controlled cooling of an electronic system based on projected conditions 有权
标题翻译：基于预测条件控制电子系统的冷却
公开(公告)号：US09110476B2
公开(公告)日：2015-08-18
申请号：US13527909
申请日：2012-06-20
申请人： Milnes P. David , Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Milnes P. David , Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G05D23/00 , G05D23/19 , H05K7/20
CPC分类号： G05D23/00 , G05D23/1919 , H05K7/20836
摘要： Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system.
摘要翻译：部分地基于预计的条件提供冷却电子系统的冷却系统的能量效率控制。该控制包括自动确定用于冷却系统的可调冷却部件的调整的控制设置。至少部分地，自动确定是基于电子系统在未来时间的消耗的预计功率以及散热器未来时间的预计温度，而散热器的热量被排除。自动确定用于降低冷却系统和/或电子系统的功率消耗，同时确保与冷却系统或电子系统相关联的至少一个目标温度在期望的范围内。该自动确定可以至少部分地基于与冷却系统的可调冷却部件的目标温度和功率消耗相关的实验获得的模型。

64. 发明授权

US08856321B2 System to improve operation of a data center with heterogeneous computing clouds 有权
标题翻译：系统改进了具有异构计算云的数据中心的运行
公开(公告)号：US08856321B2
公开(公告)日：2014-10-07
申请号：US13077578
申请日：2011-03-31
申请人： Madhusudan K. Iyengar , Vinod Kamath , Eren Kursun , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Vinod Kamath , Eren Kursun , Roger R. Schmidt
IPC分类号： G06F15/16 , G06F15/173 , G06F9/50
CPC分类号： G06F9/5094 , Y02D10/22
摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.
摘要翻译：改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。

65. 发明授权

US08649177B2 Method of fabricating a cooled electronic system 失效
标题翻译：冷却电子系统的制造方法
公开(公告)号：US08649177B2
公开(公告)日：2014-02-11
申请号：US13451714
申请日：2012-04-20
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译：提供一种制造液冷电子系统的方法，其包括具有电子卡的电子组件和在一端具有闩锁的插座。闩锁有助于将卡固定在插座内。该方法包括在插座的一端提供液冷冷轨，以及将电子卡耦合到冷轨的散热器。热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。延伸件设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除，而不移除冷轨或散热器。

66. 发明申请

US20130118353A1 SERVER RACK FRONT DOOR WITH CONTAMINATION FILTER AND SENSOR 有权
标题翻译：服务器机架前门带有污染过滤器和传感器
公开(公告)号：US20130118353A1
公开(公告)日：2013-05-16
申请号：US13295078
申请日：2011-11-13
申请人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
发明人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
IPC分类号： B01D46/42 , B01D46/00
CPC分类号： B01D46/10 , B01D46/103 , B01D2279/45
摘要： An apparatus, system, and method for preventing server contamination. The system includes a server rack and a contamination filter secured to the server rack. The contamination filter may be configured to filter particulate substances and/or chemical substances from air. The system may include a reaction coupon configured to indicate the presence of particulate substances and/or chemical substances in the air.
摘要翻译：一种用于防止服务器污染的设备，系统和方法。该系统包括一个服务器机架和一个固定在服务器机架上的污染过滤器。污染过滤器可以被配置为从空气中过滤颗粒物质和/或化学物质。该系统可以包括配置为指示空气中颗粒状物质和/或化学物质的存在的反应试剂。

67. 发明申请

US20130096721A1 DATA CENTER COOLING CONTROL 有权
标题翻译：数据中心冷却控制
公开(公告)号：US20130096721A1
公开(公告)日：2013-04-18
申请号：US13276247
申请日：2011-10-18
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G05D23/19
CPC分类号： H05K7/20836 , G05D23/1932
摘要： A method, system, and computer program product for controlling data center cooling. In an example embodiment the method includes calculating, using a processor, an over-provisioning factor, where the over-provisioning factor is a function of a ratio of a rated cooling power to a calculated cooling power of a set of cooling units, the set of cooing units comprising at least one cooling unit. The method proceeds by adjusting the data-center cooling until the over-provisioning factor is substantially equal to a target over-provisioning factor.
摘要翻译：一种用于控制数据中心冷却的方法，系统和计算机程序产品。在示例实施例中，该方法包括使用处理器计算过度供应因子，其中过度供应因子是额定冷却功率与一组冷却单元的计算的冷却功率的比率的函数，该组包括至少一个冷却单元的冷却单元。该方法通过调整数据中心冷却来进行，直到过度供应因子基本上等于目标过度供应因子。

68. 发明申请

US20120232879A1 DATA CENTER EFFICIENCY ANALYSES AND OPTIMIZATION 审中-公开
标题翻译：数据中心效率分析和优化
公开(公告)号：US20120232879A1
公开(公告)日：2012-09-13
申请号：US13045474
申请日：2011-03-10
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G06G7/62
CPC分类号： G06F17/5009 , G06Q10/04
摘要： Method, system and computer program product for estimating the overall energy efficiency of a data center over a period of time. In one embodiment, a computer processor coupled to computer readable memory is configured to receive time parameters indicating the period of time over which the overall energy efficiency of the data center is to be estimated, receive component parameters indicating the performance characteristics of data center components and the operational interactions between the data center components, simulate the operation and interaction of the data center components based, at least in part, on the component parameters for the period of time over which the energy efficiency is estimated, and output results of the simulation to estimate the overall energy efficiency of the data center.
摘要翻译：方法，系统和计算机程序产品，用于估计数据中心在一段时间内的总体能效。在一个实施例中，耦合到计算机可读存储器的计算机处理器被配置为接收指示要在其上估计数据中心的总能量效率的时间周期的时间参数，接收指示数据中心组件的性能特征的组件参数，以及数据中心组件之间的操作交互，至少部分地模拟数据中心组件的操作和交互，该模型至少部分地基于估计能量效率的时间段内的组件参数，以及模拟的输出结果估计数据中心的整体能源效率。

69. 发明授权

US08020298B2 Method of fabricating a heat exchanger with angled secondary fins extending from primary fins 失效
标题翻译：制造具有从主翅片延伸的成角度的辅助翅片的热交换器的方法
公开(公告)号：US08020298B2
公开(公告)日：2011-09-20
申请号：US12246545
申请日：2008-10-07
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： B21D53/06 , B23P15/26
CPC分类号： F28F1/126 , F28D2001/0266 , F28D2021/0031 , F28F1/30 , F28F1/32 , F28F2009/228 , G06F1/20 , G06F2200/201 , H01L23/3672 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49359 , Y10T29/49377 , Y10T29/49378 , Y10T29/4938 , H01L2924/00
摘要： A method of fabricating a heat exchanger which includes: obtaining multiple coolant-carrying conduit sections, each having a non-circular cross-section, and first and second main surfaces; providing multiple primary folded fins secured to the conduit sections. Each folded fin includes a solid fin surface with multiple bends defining alternating, U-shaped air-passage channels, and a base surface and a top surface. Each folded fin is secured at the base or top surface to a main surface of a conduit section, and the folded fins have leading and trailing edges relative to airflow direction. The method includes forming a plurality of sets of secondary fins, each set extending from the leading or trailing edge of a respective folded fin at an angle other than 0. At least one conduit section has a first folded fin secured to its first main surface, and a second folded fin secured to its second main surface thereof.
摘要翻译：一种制造热交换器的方法，包括：获得多个具有非圆形横截面的冷却剂承载管段，以及第一和第二主表面; 提供固定到导管部分的多个主折叠翼片。每个折叠翅片包括具有限定交替的U形通气通道的多个弯曲的固体翅片表面，以及基部表面和顶部表面。每个折叠的翅片在基部或顶部表面固定到导管部分的主表面，并且折叠的翅片具有相对于气流方向的前缘和后缘。该方法包括形成多组辅助散热片，每组二次散热片各自以相应的折叠翅片的前缘或后缘以不同于0的角度延伸。至少一个导管段具有固定到其第一主表面上的第一折叠翅片，以及固定到其第二主表面的第二折叠翅片。

70. 发明授权

US07948757B2 Multi-fluid cooling of an electronic device 失效
标题翻译：电子设备的多流体冷却
公开(公告)号：US07948757B2
公开(公告)日：2011-05-24
申请号：US12850099
申请日：2010-08-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00 , H01B9/06 , F25D23/12 , B05B7/06
CPC分类号： H01L23/4735 , H01L23/427 , H01L2924/0002 , Y10S165/908 , Y10T29/49002 , H01L2924/00
摘要： A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.
摘要翻译：提供了一种制造多流体冷却系统的方法，用于从一个或多个电子设备去除热量。冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

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