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61. 发明申请

US20100207272A1 SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT 有权
标题翻译：包括导电元件的半导体器件
公开(公告)号：US20100207272A1
公开(公告)日：2010-08-19
申请号：US12389103
申请日：2009-02-19
申请人： Rainer Steiner , Jens Pohl , Werner Robl , Markus Brunnbauer , Gottfried Beer
发明人： Rainer Steiner , Jens Pohl , Werner Robl , Markus Brunnbauer , Gottfried Beer
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L23/528 , H01L21/561 , H01L21/568 , H01L23/5283 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/20 , H01L2224/02351 , H01L2224/03462 , H01L2224/0361 , H01L2224/03622 , H01L2224/0401 , H01L2224/04105 , H01L2224/05006 , H01L2224/05012 , H01L2224/05017 , H01L2224/05546 , H01L2224/05548 , H01L2224/05553 , H01L2224/05555 , H01L2224/05557 , H01L2224/05559 , H01L2224/05567 , H01L2224/05568 , H01L2224/05647 , H01L2224/12105 , H01L2224/13023 , H01L2224/131 , H01L2224/97 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1461 , H01L2224/83 , H01L2924/00014 , H01L2924/01014 , H01L2924/00
摘要： A semiconductor device includes a chip comprising a contact element, a structured dielectric layer over the chip, and a conductive element coupled to the contact element. The conductive element comprises a first portion embedded in the structured dielectric layer, a second portion at least partially spaced apart from the first portion and embedded in the structured dielectric layer, and a third portion contacting a top of the structured dielectric layer and extending at least vertically over the first portion and the second portion.
摘要翻译：半导体器件包括芯片，其包括接触元件，芯片上方的结构化介电层以及耦合到接触元件的导电元件。导电元件包括嵌入结构化电介质层中的第一部分，与第一部分至少部分间隔开并嵌入结构化介电层的第二部分，以及接触结构化介电层顶部并至少延伸的第三部分垂直于第一部分和第二部分。

62. 发明申请

US20100062563A1 METHOD OF MANUFACTURING A STACKED DIE MODULE 有权
标题翻译：制造堆叠模块的方法
公开(公告)号：US20100062563A1
公开(公告)日：2010-03-11
申请号：US12205294
申请日：2008-09-05
申请人： Klaus Pressel , Gottfried Beer
发明人： Klaus Pressel , Gottfried Beer
IPC分类号： H01L21/50
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L24/19 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/32145 , H01L2224/73217 , H01L2224/73267 , H01L2224/8203 , H01L2224/97 , H01L2225/06524 , H01L2225/06593 , H01L2924/01033 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first semiconductor die applied to the carrier and a second semiconductor die stacked over the first semiconductor die. The second semiconductor die has a larger lateral surface area than the first semiconductor die. A dam is applied around each of the stacked die structures, thereby forming an enclosed cavity for each of the stacked die structures. The enclosed cavity for each stacked die structure surrounds the first semiconductor die of the stacked die structure.
摘要翻译：制造堆叠模具模块的方法包括将多个堆叠的模具结构应用于载体。每个堆叠的管芯结构包括施加到载体的第一半导体管芯和堆叠在第一半导体管芯上的第二半导体管芯。第二半导体管芯具有比第一半导体管芯更大的侧表面积。在每个堆叠的模具结构周围施加坝，从而为每个堆叠的模具结构形成封闭的腔。用于每个堆叠的管芯结构的封闭空腔包围堆叠管芯结构的第一半导体管芯。

63. 发明授权

US07625781B2 Semiconductor device having a plastic housing and external connections and method for producing the same 有权
标题翻译：具有塑料外壳和外部连接的半导体器件及其制造方法
公开(公告)号：US07625781B2
公开(公告)日：2009-12-01
申请号：US11354391
申请日：2006-02-15
申请人： Gottfried Beer
发明人： Gottfried Beer
IPC分类号： H01L21/44
CPC分类号： H01L23/5389 , H01L21/288 , H01L21/486 , H01L21/4871 , H01L23/3128 , H01L24/03 , H01L24/11 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/48 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L2224/0401 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/24226 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/76155 , H01L2224/82102 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2225/1064 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device having a plastic housing and external connections, and to a method for producing the same is disclosed. In one embodiment, the plastic housing has a housing external contour made of plastic external areas with a top side, an underside opposite to the top side, and edge sides. Lower external contact areas are arranged on the underside and upper external contact areas are arranged on the top side. Furthermore, the plastic housing has external conductor tracks along the housing external contour, by means of which the lower and upper external contact areas are electrically connected. For this purpose, the external conductor tracks have at least one jet-printed first conductor track layer made of electrically conductive material. Such jet-printed conductor track layers may also be applied to active top sides of semiconductor chips in order to bridge underlying conductor track layers.
摘要翻译：公开了一种具有塑料外壳和外部连接的半导体器件及其制造方法。在一个实施例中，塑料外壳具有由塑料外部区域制成的壳体外部轮廓，其具有顶侧，与顶侧相对的下侧和边缘侧。下部外部接触区域设置在下侧，上部外部接触区域设置在顶侧。此外，塑料外壳具有沿壳体外部轮廓的外部导体轨道，通过该外部导体轨道，下部和上部外部接触区域电连接。为此，外部导体轨道具有由导电材料制成的至少一个喷墨印刷的第一导体轨迹层。这种喷墨印刷导体轨道层也可以应用于半导体芯片的有源顶侧，以便桥接下面的导体轨道层。

64. 发明申请

US20090286357A1 METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE 有权
标题翻译：制造半导体结构的方法
公开(公告)号：US20090286357A1
公开(公告)日：2009-11-19
申请号：US12122926
申请日：2008-05-19
申请人： Gottfried Beer
发明人： Gottfried Beer
IPC分类号： H01L21/60 , H01L21/311 , H01L21/44
CPC分类号： H01L24/19 , H01L21/561 , H01L23/3114 , H01L23/544 , H01L24/96 , H01L24/97 , H01L2223/54413 , H01L2223/54433 , H01L2223/54473 , H01L2223/5448 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/3511 , H01L2224/96 , H01L2224/82 , H01L2924/00
摘要： A method of manufacturing a semiconductor structure. One embodiment produces a substrate having at least two semiconductor chips embedded in a molded body. A layer is applied over at least one main surface of the substrate by using a jet printing process.
摘要翻译：一种制造半导体结构的方法。一个实施例产生具有嵌入模制体中的至少两个半导体芯片的基板。通过使用喷墨印刷方法将层施加在基板的至少一个主表面上。

65. 发明授权

US07585701B2 Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film 有权
标题翻译：具有粘合膜的载体片和使用具有粘合剂膜的载体片制造半导体器件的方法
公开(公告)号：US07585701B2
公开(公告)日：2009-09-08
申请号：US11439425
申请日：2006-05-24
申请人： Gottfried Beer , Markus Brunnbauer , Irmgard Escher-Poeppel , Edward Fuergut
发明人： Gottfried Beer , Markus Brunnbauer , Irmgard Escher-Poeppel , Edward Fuergut
IPC分类号： H01L21/00
CPC分类号： H01L24/96 , C09J7/35 , C09J7/385 , C09J2201/134 , C09J2201/28 , C09J2203/326 , C09J2427/006 , C09J2433/00 , C09J2467/006 , H01L21/561 , H01L21/568 , H01L21/67126 , H01L21/67132 , H01L2221/68318 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.
摘要翻译：具有粘合膜的载体片包括具有上侧和下侧的耐热基膜，以及设置在基膜的下侧并且朝向载体片取向的热敏粘合剂层。基膜的上侧包括固定有半导体芯片的粘合剂层，半导体芯片由膜上侧的粘合剂层的去活化区域包围。

66. 发明申请

US20080121724A1 Semiconductor Chips for TAG Applications, Devices for Mounting the Same, and Mounting Method 有权
标题翻译：用于TAG应用的半导体芯片，用于安装其的设备和安装方法
公开(公告)号：US20080121724A1
公开(公告)日：2008-05-29
申请号：US11938857
申请日：2007-11-13
申请人： Gottfried Beer , Werner Weber
发明人： Gottfried Beer , Werner Weber
IPC分类号： G06K19/07 , H01L21/66 , B65G47/92
CPC分类号： H01L21/67144 , G06K19/07718 , H01L21/67132 , H01L23/49855 , H01L24/95 , H01L2224/75733 , H01L2224/95144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01072 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/00
摘要： A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or electrostatic lifter, which picks up singulated semiconductor chips of a semiconductor wafer with a magnetic coating or including an electrostatically chargeable structure from a wafer position and deposits them in a collecting position. A mounting device includes a conveying roller with conveying receptacles for semiconductor chips, which pick up the semiconductor chips in a pick-up position with electromagnetically or electrostatically activatable conveying receptacles and, in a discharge position will discharge, via deactivation of the conveying receptacles, the semiconductor chips onto a corresponding liner or an object.
摘要翻译： TAG芯片包括磁性涂层或静电电荷结构。用于包装半导体芯片的装置包括电磁或静电提升器，其利用磁性涂层拾取半导体晶片的单个半导体芯片，或者从晶片位置拾取可静电充电的结构，并将它们沉积在收集位置。安装装置包括具有用于半导体芯片的输送容器的输送辊，其利用电磁或静电可激活的输送容器拾取拾取位置中的半导体芯片，并且在放电位置将通过输送容器的失活将其排出，半导体芯片到相应的衬里或物体上。

67. 发明申请

US20080101750A1 Optical Transmitter and/or Receiver Assembly Comprising a Planar Optical Circuit 失效
标题翻译：包括平面光电路的光发射器和/或接收器组件
公开(公告)号：US20080101750A1
公开(公告)日：2008-05-01
申请号：US10537717
申请日：2002-12-05
申请人： Gottfried Beer , Hans-Ludwig Althaus
发明人： Gottfried Beer , Hans-Ludwig Althaus
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G02B6/421 , G02B6/4204 , G02B6/423 , G02B6/4246
摘要： The invention relates to an optical transmitter and/or receiver assembly comprising at least one transmitter component (2) and/or at least one receiver component (3, 4), in addition to a planar optical circuit (5) with at least one integrated waveguide (51). According to the invention, light from the transmitter element (1) is coupled into a waveguide (51) of the planar optical circuit (5) and/or light from the waveguide (51) of the planar optical circuit (5) is uncoupled and guided onto the receiver component (3, 4). The assembly is provided with a lens (14, 15) for optically coupling the waveguide(s) (51) of the planar optical circuit (5) to a fibre-optic that can he fixed to the transmitter and/or receiver assembly (1), said lens (14, 15) being positioned on the planar optical circuit (5).
摘要翻译：本发明涉及一种包括至少一个发射器部件（2）和/或至少一个接收器部件（3,4）的光发射机和/或接收机组件，除了具有至少一个集成的平面光学电路波导（51）。根据本发明，来自发射器元件（1）的光耦合到平面光电路（5）的波导（51）和/或来自平面光电路（5）的波导（51）的光分离，并且被引导到接收器部件（3,4）上。组件设置有用于将平面光学电路（5）的波导（51）光学耦合到能够固定到发射器和/或接收器组件（1）的光纤的透镜（14,15）），所述透镜（14,15）位于平面光电路（5）上。

68. 发明申请

US20070069353A1 Semiconductor device with plastic housing composition and method for producing the same 有权
标题翻译：具有塑料外壳组成的半导体器件及其制造方法
公开(公告)号：US20070069353A1
公开(公告)日：2007-03-29
申请号：US11526102
申请日：2006-09-25
申请人： Gottfried Beer , Edward Fuergut
发明人： Gottfried Beer , Edward Fuergut
IPC分类号： H01L23/02
CPC分类号： H01L23/552 , H01L23/29 , H01L23/295 , H01L23/3128 , H01L2224/04105 , H01L2224/05571 , H01L2224/05573 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01005 , H01L2924/01042 , H01L2924/01074 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/3025 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device with plastic housing composition includes an internal wiring that is electrically insulated from the plastic housing composition by an insulation layer. The plastic housing composition has a high thermal conductivity and a low coefficient of expansion, the coefficient of expansion being adapted to the semiconductor chip of the semiconductor device. This is achieved by forming the plastic housing composition with electrically semiconducting and/or electrically conducting filler particles. In particular, this plastic housing composition is advantageously used for semiconductor devices with flip-chip contacts and/or for semiconductor devices which are constructed according to the “universal packaging concept”.
摘要翻译：具有塑料外壳组合物的半导体器件包括通过绝缘层与塑料外壳组合物电绝缘的内部布线。塑料外壳组合物具有高导热性和低膨胀系数，膨胀系数适用于半导体器件的半导体芯片。这通过用电半导体和/或导电填料颗粒形成塑料外壳组合物来实现。特别地，该塑料外壳组合物有利地用于具有倒装芯片触点和/或根据“通用封装概念”构造的半导体器件的半导体器件。

69. 发明申请

US20060273469A1 Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film 有权
公开(公告)号：US20060273469A1
公开(公告)日：2006-12-07
申请号：US11439425
申请日：2006-05-24
申请人： Gottfried Beer , Markus Brunnbauer , Irmgard Escher-Poeppel , Edward Fuergut
发明人： Gottfried Beer , Markus Brunnbauer , Irmgard Escher-Poeppel , Edward Fuergut
IPC分类号： H01L23/48
CPC分类号： H01L24/96 , C09J7/35 , C09J7/385 , C09J2201/134 , C09J2201/28 , C09J2203/326 , C09J2427/006 , C09J2433/00 , C09J2467/006 , H01L21/561 , H01L21/568 , H01L21/67126 , H01L21/67132 , H01L2221/68318 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

70. 发明申请

US20060189124A1 Semiconductor device having a through contact through a housing composition and method for producing the same 审中-公开
标题翻译：具有通过壳体组合物的直通接触的半导体器件及其制造方法
公开(公告)号：US20060189124A1
公开(公告)日：2006-08-24
申请号：US11350287
申请日：2006-02-09
申请人： Gottfried Beer , Jens Pohl
发明人： Gottfried Beer , Jens Pohl
IPC分类号： H01L21/4763 , H01L23/48
CPC分类号： H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device includes a housing composition and a through contact extending through the housing composition. The through contact is provided in a contact hole formed through the housing composition and having an asymmetrical funnel form with at least two opposite inner wall sides oriented substantially perpendicular to the top side of the housing and a further inner wall side inclined in such a way that the contact hole has an elongated-hole cross section at the top side of the housing. In the region of the contact pad, the contact hole has a cross section adapted to the contact pad. The through contact includes a contact-making conductor track that extends from the top side of the housing along the inclined fourth inner wall side to the contact pad.
摘要翻译：半导体器件包括壳体组合物和延伸穿过壳体组合物的通孔。通孔形成在通过壳体组合物形成的接触孔中并且具有不对称的漏斗形式，其具有至少两个相对的内壁侧，该至少两个相对的内壁侧基本上垂直于壳体的顶侧定向，另外的内壁侧以如下方式倾斜：接触孔在壳体的顶侧具有细长孔横截面。在接触垫的区域中，接触孔具有适于接触垫的横截面。通孔包括从壳体的顶侧沿着倾斜的第四内壁侧延伸到接触垫的接触导体轨迹。

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