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61. 发明授权

US06727580B1 Microelectronic spring contact elements 失效
标题翻译：微电子弹簧接触元件
公开(公告)号：US06727580B1
公开(公告)日：2004-04-27
申请号：US09694205
申请日：2000-10-20
申请人： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen
发明人： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen
IPC分类号： H01L2348
CPC分类号： H01L24/12 , H01L24/11 , H01L24/72 , H01L2224/1147 , H01L2224/13099 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/3011
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.
摘要翻译：弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。每个弹簧接触元件具有基端，接触端和中心主体部分。接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

62. 发明授权

US06184053B2 Method of making microelectronic spring contact elements 失效
标题翻译：制造微电子弹簧接触元件的方法
公开(公告)号：US06184053B2
公开(公告)日：2001-02-06
申请号：US08852152
申请日：1997-05-06
申请人： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen
发明人： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen
IPC分类号： H01L2144
CPC分类号： H05K3/4092 , G01R1/06727 , G01R3/00 , H01L21/4853 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L2224/11462 , H01L2224/11472 , H01L2224/11474 , H01L2224/1152 , H01L2224/11827 , H01L2224/13015 , H01L2224/13017 , H01L2224/13018 , H01L2224/13023 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13169 , H01L2224/1318 , H01L2224/13184 , H01L2224/13565 , H01L2224/13582 , H01L2224/136 , H01L2224/1369 , H01L2224/94 , H01L2924/01005 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H05K2201/0311 , H05K2201/0347 , H01L2924/00014 , H01L2224/11
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.
摘要翻译：弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。每个弹簧接触元件具有基端，接触端和中心主体部分。接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

63. 发明授权

US5994152A Fabricating interconnects and tips using sacrificial substrates 失效
标题翻译：使用牺牲衬底制造互连和尖端
公开(公告)号：US5994152A
公开(公告)日：1999-11-30
申请号：US788740
申请日：1997-01-24
申请人： Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu
发明人： Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu
IPC分类号： H01L21/44
CPC分类号： H01L21/44
摘要： Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate establishes a predetermined spatial relationship between the interconnection elements which may be composite interconnection elements having a relatively soft elongate element as a core and a relatively hard (springy material) overcoat. Tip structures fabricated on sacrificial substrates may be provided with a surface texture optimized for mounting to any interconnection elements for making pressure connections to terminals of electronic components. Interconnection elements may be fabricated upon such tip structures, or may first be mounted to the electronic component and the tip structures joined to the free-ends of the interconnection elements. Tip structures formed as cantilever beams are described.
摘要翻译：用于互连元件的互连元件和/或尖端结构可以首先在牺牲基板上制造以用于随后安装到电子部件。以这种方式，电子部件在制造过程中不“处于危险中”。牺牲衬底在互连元件之间建立预定的空间关系，其可以是具有作为芯的相对柔软的细长元件和相对硬（弹性材料）外涂层的复合互连元件。在牺牲基板上制造的尖端结构可以设置有优化的表面纹理，用于安装到任何互连元件，用于与电子部件的端子进行压力连接。互连元件可以制造在这样的尖端结构上，或者可以首先安装到电子部件，并且尖端结构连接到互连元件的自由端。描述形成为悬臂梁的尖端结构。

64. 发明授权

US07868632B2 Composite motion probing 失效
标题翻译：复合运动探测
公开(公告)号：US07868632B2
公开(公告)日：2011-01-11
申请号：US11697603
申请日：2007-04-06
申请人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
发明人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
IPC分类号： G01R31/02
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备相对于用于与设备电接触的探针移动到第一位置。然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。进入第二位置的运动包括两个部件。移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。第二动作往往会减轻压力。然后通过探头将测试数据传送到电子设备和从电子设备传送。

65. 发明授权

US07731503B2 Carbon nanotube contact structures 失效
标题翻译：碳纳米管接触结构
公开(公告)号：US07731503B2
公开(公告)日：2010-06-08
申请号：US11466039
申请日：2006-08-21
申请人： Benjamin N. Eldridge , John K. Gritters , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , John K. Gritters , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
IPC分类号： H01R12/00
CPC分类号： G01R1/06755 , H01R13/03 , Y10T29/49204
摘要： A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.
摘要翻译：可以使用碳纳米管接触结构来与DUT进行压力连接。可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。接触结构或其部分也可以镀有含有碳纳米管的溶液。所得到的接触结构可以是韧性的，并且可以提供良好的导电性。

66. 发明授权

US07347702B2 Contact carriers (tiles) for populating larger substrates with spring contacts 失效
标题翻译：接触托架（瓷砖），用于通过弹簧触点填充较大的基板
公开(公告)号：US07347702B2
公开(公告)日：2008-03-25
申请号：US11561297
申请日：2006-11-17
申请人： Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith
发明人： Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith
IPC分类号： H01R12/00
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49126 , Y10T29/49208 , Y10T29/49222 , H01L2924/00 , H01L2224/48
摘要： An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.
摘要翻译：一种互连装置和形成互连装置的方法。接触结构附着在第一基底上或形成在第一基底上。第一衬底附接到比第一衬底大的第二衬底。可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

67. 发明授权

US5912046A Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component 失效
标题翻译：将可流动涂层材料层施加到电子部件表面的方法和装置
公开(公告)号：US5912046A
公开(公告)日：1999-06-15
申请号：US854203
申请日：1997-05-09
申请人： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： B23K3/06 , B23K20/00 , C25D7/12 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/40 , B05D5/12
CPC分类号： H01L24/81 , B23K20/004 , B23K3/0607 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/75 , H01L25/0652 , H01L25/16 , H05K3/326 , H05K3/4015 , B23K2201/40 , G01R3/00 , G01R31/2884 , H01L2224/1134 , H01L2224/13099 , H01L2224/49109 , H01L2224/73203 , H01L2224/75 , H01L2224/81801 , H01L2224/85201 , H01L24/49 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H05K1/141 , H05K3/20
摘要： A flowable coating material, such as a liquid having solids in suspension, such as spin-on glass, is applied to a surface of an electronic component by placing the component in a centrifuge and spinning the component about a first axis so that the liquid material is forced against the surface of the component. The component may also be rotated about its own axis so that the liquid material is distributed along the surface of the component.
摘要翻译：通过将组分放置在离心机中并将组分围绕第一轴线旋转，将可流动的涂层材料，例如具有悬浮液中固体的液体（例如旋涂玻璃）施加到电子部件的表面，使得液体材料被迫靠在组件的表面上。组件也可以围绕其自身的轴线旋转，使得液体材料沿着部件的表面分布。

68. 发明申请

US20090085592A1 PROBING A DEVICE 失效
标题翻译：探索一个设备
公开(公告)号：US20090085592A1
公开(公告)日：2009-04-02
申请号：US12331163
申请日：2008-12-09
申请人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
发明人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
IPC分类号： G01R31/3181
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。然后电子设备水平或对角地移动，使得端子接触探针。然后通过探头将测试数据传送到电子设备和从电子设备传送。

69. 发明授权

US07202682B2 Composite motion probing 失效
标题翻译：复合运动探测
公开(公告)号：US07202682B2
公开(公告)日：2007-04-10
申请号：US10328113
申请日：2002-12-20
申请人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
发明人： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu
IPC分类号： G01R31/02
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译：电子设备相对于用于与设备电接触的探针移动到第一位置。然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。进入第二位置的运动包括两个部件。移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。第二动作往往会减轻压力。然后通过探头将测试数据传送到电子设备和从电子设备传送。

70. 发明授权

US6043563A Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals 失效
标题翻译：电子元件具有端子和弹簧接触元件，从远离端子的区域延伸
公开(公告)号：US6043563A
公开(公告)日：2000-03-28
申请号：US955001
申请日：1997-10-20
申请人： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen
发明人： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen
IPC分类号： H01L23/12 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/20 , H01L21/48 , H01L21/60 , H01L23/48 , H01L23/485 , H01L23/498 , H01L23/522 , H05K3/20 , H05K3/34 , H05K3/40 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , G01R31/2884 , H01L21/4846 , H01L21/4853 , H01L23/49811 , H01L23/522 , H01L24/06 , H01L24/72 , G01R1/06711 , G01R31/2856 , G01R31/2863 , H01L2224/04042 , H01L2224/05624 , H01L2224/06136 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48624 , H01L2224/48724 , H01L24/45 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/19041 , H05K3/20 , H05K3/3421 , H05K3/4092
摘要： Spring contact elements are fabricated at areas on an electronic component remote from terminals to which they are electrically connected. For example, the spring contact elements may be mounted to remote regions such as distal ends of extended tails (conductive lines) which extend from a terminal of an electronic component to positions which are remote from the terminals. In this manner, a plurality of substantially identical spring contact elements can be mounted to the component so that their free (distal) ends are disposed in a pattern and at positions which are spatially-translated from the pattern of the terminals on the component. The spring contact elements include, but are not limited to, composite interconnection elements and plated-up structures. The electronic component includes, but is not limited to, a semiconductor device, a memory chip, a portion of a semiconductor wafer, a space transformer, a probe card, a chip carrier, and a socket.
摘要翻译：弹簧接触元件制造在远离其电连接的端子的电子部件上的区域。例如，弹簧接触元件可以安装到远程区域，例如从电子部件的端子延伸到远离端子的位置的延伸尾部（导电线）的远端。以这种方式，可以将多个基本相同的弹簧接触元件安装到部件上，使得它们的自由（远端）端部以图案和从部件上的端子的图案空间平移的位置设置。弹簧接触元件包括但不限于复合互连元件和电镀结构。电子部件包括但不限于半导体器件，存储器芯片，半导体晶片的一部分，空间变压器，探针卡，芯片载体和插座。

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