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61. 发明授权

US08736181B2 AC driven light emitting device 有权
标题翻译：交流驱动发光装置
公开(公告)号：US08736181B2
公开(公告)日：2014-05-27
申请号：US13215619
申请日：2011-08-23
申请人： Young Jin Lee , Hyung Kun Kim , Kyung Mi Moon
发明人： Young Jin Lee , Hyung Kun Kim , Kyung Mi Moon
IPC分类号： H05B37/02
CPC分类号： H05B33/0821 , H05B33/0806
摘要： There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.
摘要翻译：提供了一种包括串联连接的多个LED阵列的交流（AC）驱动的发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构当对两端电路施加交流电压时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。交流驱动发光器件允许从低驱动电压Vf进行操作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。

62. 发明授权

US08633643B2 LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof 有权
标题翻译： LED封装，具有相同的LED封装模块及其制造方法，以及具有其相同的头灯模块及其控制方法
公开(公告)号：US08633643B2
公开(公告)日：2014-01-21
申请号：US12956812
申请日：2010-11-30
申请人： Young Jin Lee , Hyung Kun Kim
发明人： Young Jin Lee , Hyung Kun Kim
IPC分类号： H01J1/62 , F21V1/00 , H01L21/00 , H01L33/00
CPC分类号： H01L33/647 , F21S41/147 , F21V29/677 , F21V29/89 , H01L2224/13 , H05K1/056 , H05K2201/09054 , H05K2201/10106 , H05K2201/10174 , H05K2201/10969
摘要： Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.
摘要翻译：公开了一种LED封装，具有该LED封装的LED封装模块及其制造方法以及具有该LED封装模块及其控制方法的头灯模块。发光二极管封装包括：封装衬底; 安装在所述封装基板的一个表面上的发光二极管芯片; 电极焊盘，形成在所述封装基板的另一个表面上并电连接到所述发光二极管芯片; 以及形成在所述封装基板的另一表面上并与所述电极焊盘电绝缘的散热焊盘。

63. 发明授权

US08278671B2 Led package module 有权
标题翻译： LED封装模块
公开(公告)号：US08278671B2
公开(公告)日：2012-10-02
申请号：US13404924
申请日：2012-02-24
申请人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

64. 发明申请

US20110042690A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20110042690A1
公开(公告)日：2011-02-24
申请号：US12608442
申请日：2009-10-29
申请人： Jin Bock LEE , Hee Seok Park , Hyung Kun Kim , Young Jin Lee
发明人： Jin Bock LEE , Hee Seok Park , Hyung Kun Kim , Young Jin Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L24/48 , H01L24/73 , H01L33/60 , H01L33/62 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/15153 , H01L2924/15165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; an LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.
摘要翻译：本发明提供了一种发光二极管封装，其包括：封装模具，其具有第一空腔和具有比第一空腔小的尺寸的第二空腔; 分别设置在第一腔和第二腔的底表面上的第一和第二电极垫; 安装在所述第一电极焊盘上的LED芯片; 用于在所述LED芯片和所述第二电极焊盘之间提供电连接的导线; 以及填充在第一腔和第二腔内的成型材料。

65. 发明授权

US07795086B2 Method of manufacturing semiconductor device using salicide process 失效
标题翻译：使用自对准硅胶工艺制造半导体器件的方法
公开(公告)号：US07795086B2
公开(公告)日：2010-09-14
申请号：US12346011
申请日：2008-12-30
申请人： Young Jin Lee , Dong Sun Sheen , Seok Pyo Song , Mi Ri Lee , Chi Ho Kim , Gil Jae Park , Bo Min Seo
发明人： Young Jin Lee , Dong Sun Sheen , Seok Pyo Song , Mi Ri Lee , Chi Ho Kim , Gil Jae Park , Bo Min Seo
IPC分类号： H01L21/8238
CPC分类号： H01L21/823814 , H01L21/823425 , H01L21/823835
摘要： A method for manufacturing a semiconductor device using a salicide process, which includes forming a gate dielectric layer over a silicon substrate including a PMOS region and an NMOS region; forming a first silicon pattern in the NMOS region and a second silicon pattern in the PMOS region; forming a first metal layer that is in contact with the first silicon pattern and the exposed first portion of the silicon substrate; and forming a first gate, a first junction, a second gate, and a second junction by performing a heat treatment to silicify the respective first and second silicon patterns and the silicon substrate.
摘要翻译：一种使用自对准硅化物工艺制造半导体器件的方法，包括在包括PMOS区域和NMOS区域的硅衬底上形成栅极电介质层; 在所述NMOS区域中形成第一硅图案和在所述PMOS区域中形成第二硅图案; 形成与所述第一硅图案和所述暴露的所述硅衬底的第一部分接触的第一金属层; 以及通过进行热处理以使相应的第一和第二硅图案和硅衬底硅化而形成第一栅极，第一结，第二栅极和第二结。

66. 发明申请

US20100171143A1 LIGHT EMITTING DIODE PACKAGE 失效
标题翻译：发光二极管封装
公开(公告)号：US20100171143A1
公开(公告)日：2010-07-08
申请号：US12571751
申请日：2009-10-01
申请人： Ho Sun PAEK , Hak Hwan Kim , Young Jin Lee , Hyung Kun Kim , Suk Ho Jung
发明人： Ho Sun PAEK , Hak Hwan Kim , Young Jin Lee , Hyung Kun Kim , Suk Ho Jung
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.
摘要翻译：提供了具有高散热效率的LED封装。根据本发明的一个方面的LED封装可以包括：封装主体，包括凹入到封装体中的第一凹槽部分，并且作为安装区域设置在封装主体的顶部; 第一引线框架和第二引线框架布置在第一槽部分的下表面上，同时第一和第二引线框架的一部分被暴露; LED芯片安装在第一槽部分的下表面上并电连接到第一和第二引线框架; 以及设置在包装体的底部并由碳纳米管形成的多个散热图案。

67. 发明申请

US20100090231A1 LED PACKAGE MODULE 有权
标题翻译： LED封装模块
公开(公告)号：US20100090231A1
公开(公告)日：2010-04-15
申请号：US12571754
申请日：2009-10-01
申请人： Suk Ho JUNG , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
发明人： Suk Ho JUNG , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48235 , H01L2924/00014
摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.
摘要翻译：根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。因此，防止由黄化引起的LED的发光效率的降低，从而提高发光效率并实现尺寸的减小。

68. 发明授权

US07667843B2 Method of evaluating sensitivity grade of interior material used in vehicles 有权
标题翻译：评估车辆内部材料敏感度等级的方法
公开(公告)号：US07667843B2
公开(公告)日：2010-02-23
申请号：US12150978
申请日：2008-05-02
申请人： Jong Myung Kim , Young Jin Lee , Won Jin Seo , Yun Seok Kim , Yeong Nam Hwang , Won Jun Kim
发明人： Jong Myung Kim , Young Jin Lee , Won Jin Seo , Yun Seok Kim , Yeong Nam Hwang , Won Jun Kim
IPC分类号： G01J3/46
CPC分类号： G01N33/367
摘要： A method of evaluating the sensitivity grade of an interior material used in vehicles comprises: evaluating sensitivity properties of an interior material before providing noise factors; evaluating sensitivity properties of the interior material after providing noise factors; averaging each of the sensitivity properties evaluated before the provision of noise factors and after the provision of noise factors to obtain the average value (safety factor) of each of the sensitivity properties; comparing the average value of each of the sensitivity properties with a preset target value of each of the sensitivity properties to compute a target value achievement level of each of the sensitivity properties; and determining the sensitivity grade of the interior material based on the sensitivity property with the lowest target value achievement level. By providing an objective standard to evaluate sensitivity properties of an interior material used in vehicles, the present method(s) eliminates the difficulty in communication between customers and manufactures and quality control regarding the sensitivity grade of interior materials used in vehicles.
摘要翻译：评估车辆内部材料的灵敏度等级的方法包括：在提供噪声因子之前评估内部材料的灵敏度特性; 提供噪声因素后评估内部材料的敏感性; 对提供噪声因子之前评估的每个灵敏度特性进行平均，并在提供噪声因子后获得每个敏感性的平均值（安全系数）; 将每个灵敏度特性的平均值与每个灵敏度属性的预设目标值进行比较，以计算每个灵敏度特性的目标值实现水平; 并且基于具有最低目标值实现水平的灵敏度属性来确定内部材料的灵敏度等级。通过提供客观标准来评估车辆内部材料的灵敏度特性，本方法消除了客户和制造商之间的沟通困难以及车辆内部材料的灵敏度等级的质量控制。

69. 发明申请

US20090153863A1 Method of evaluating sensitivity grade of interior material used in vehicles 有权
标题翻译：评估车辆内部材料敏感度等级的方法
公开(公告)号：US20090153863A1
公开(公告)日：2009-06-18
申请号：US12150978
申请日：2008-05-02
申请人： Jong Myung Kim , Young Jin Lee , Won Jin Seo , Yun Seok Kim , Yeong Nam Hwang , Won Jun Kim
发明人： Jong Myung Kim , Young Jin Lee , Won Jin Seo , Yun Seok Kim , Yeong Nam Hwang , Won Jun Kim
IPC分类号： G01J3/46
CPC分类号： G01N33/367
摘要： A method of evaluating the sensitivity grade of an interior material used in vehicles comprises: evaluating sensitivity properties of an interior material before providing noise factors; evaluating sensitivity properties of the interior material after providing noise factors; averaging each of the sensitivity properties evaluated before the provision of noise factors and after the provision of noise factors to obtain the average value (safety factor) of each of the sensitivity properties; comparing the average value of each of the sensitivity properties with a preset target value of each of the sensitivity properties to compute a target value achievement level of each of the sensitivity properties; and determining the sensitivity grade of the interior material based on the sensitivity property with the lowest target value achievement level. By providing an objective standard to evaluate sensitivity properties of an interior material used in vehicles, the present method(s) eliminates the difficulty in communication between customers and manufactures and quality control regarding the sensitivity grade of interior materials used in vehicles.
摘要翻译：评估车辆内部材料的灵敏度等级的方法包括：在提供噪声因子之前评估内部材料的灵敏度特性; 提供噪声因素后评估内部材料的敏感性; 对提供噪声因子之前评估的每个灵敏度特性进行平均，并在提供噪声因子后获得每个敏感性的平均值（安全系数）; 将每个灵敏度特性的平均值与每个灵敏度属性的预设目标值进行比较，以计算每个灵敏度特性的目标值实现水平; 并且基于具有最低目标值实现水平的灵敏度属性来确定内部材料的灵敏度等级。通过提供客观标准来评估车辆内部材料的灵敏度特性，本方法消除了客户和制造商之间的沟通困难以及车辆内部材料的灵敏度等级的质量控制。

70. 发明申请

US20080315789A1 Light emitting diode driving circuit and light emitting diode array device 有权
标题翻译：发光二极管驱动电路和发光二极管阵列器件
公开(公告)号：US20080315789A1
公开(公告)日：2008-12-25
申请号：US12213506
申请日：2008-06-20
申请人： Young Jin Lee , Byoung Own Min , Gil Han Park , Grigory Onushkin
发明人： Young Jin Lee , Byoung Own Min , Gil Han Park , Grigory Onushkin
IPC分类号： H05B37/02
CPC分类号： H05B33/0803 , H05B33/0821 , Y02B20/342 , Y10S362/80 , Y10S362/808
摘要： There is provided an LED driving circuit including: at least one ladder network circuit including: (n+1) number of first branches connected in parallel with one another by n number of first middle junction points between a first junction point and a second junction point, where n denotes an integer satisfying n≧2, (n+1) number of second branches connected in parallel with one another by n number of second middle junction points between the first junction point and the second junction point, the (n+1) number of second branches connected in parallel with the first branches; and n number of middle branches connecting the first and second middle junction points of an identical m sequence to each other, respectively, wherein each of the first and second, and middle branches comprises at least one LED device.
摘要翻译：提供了一种LED驱动电路，包括：至少一个梯形网络电路，包括：（n + 1）数个第一分支，其在第一连接点和第二连接点之间彼此并联连接n个第一中间连接点，其中n表示满足n> = 2的整数，（n + 1）个数量的第二分支数彼此并联连接在第一连接点和第二连接点之间的n个第二中间连接点，（n + 1）与第一分支并联连接的第二分支的数量; 以及分别将相同m个序列的第一和第二中间连接点彼此连接的n个中间分支，其中第一和第二和中间分支中的每一个包括至少一个LED装置。

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