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61. 发明授权

US07153765B2 Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles 有权
标题翻译：使用纳米尺寸焊料颗粒的自组装，利用选择性焊料沉积来组装焊接包装的方法
公开(公告)号：US07153765B2
公开(公告)日：2006-12-26
申请号：US11096238
申请日：2005-03-31
申请人： Daoqiang Lu , Tian-An Chen
发明人： Daoqiang Lu , Tian-An Chen
IPC分类号： H01L21/44 , B23K31/02
CPC分类号： H01L24/11 , B23K1/0016 , B23K35/22 , B23K35/38 , B23K2101/40 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/05147 , H01L2224/05155 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H05K3/3484 , H05K3/3489 , H05K2201/0257 , H05K2203/0425 , H05K2203/043 , H05K2203/095 , H01L2924/00014
摘要： A nano-sized solder suspension flows by selective wetting onto a bond pad and away from a bond-pad resist area. A microelectronic package is also disclosed that uses the nano-sized solder suspension. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes a bump that was reflowed from the nano-sized solder suspension.
摘要翻译：纳米尺寸的焊料悬浮液通过选择性润湿流动到接合焊盘上并远离焊垫抗蚀剂区域。还公开了使用纳米尺寸的焊料悬浮液的微电子封装。还公开了组装微电子封装的方法。还公开了包括从纳米尺寸的焊料悬浮液回流的凸块的计算系统。

62. 发明申请

US20060251360A1 Flip-chip mountable optical connector for chip-to-chip optical interconnectability 失效
标题翻译：用于芯片到芯片光学互连的倒装芯片安装光学连接器
公开(公告)号：US20060251360A1
公开(公告)日：2006-11-09
申请号：US11124033
申请日：2005-05-06
申请人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
发明人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4232 , G02B6/4214 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H05K1/0274 , H05K3/3436
摘要： An optical connector comprises a housing having a cavity extending there through to accept a mating connector. The connector comprises no optical components. Dummy solder bonding pads positioned on the connector allow the connector to be automated flip-chip bonded over a substrate waveguide.
摘要翻译：光学连接器包括壳体，该壳体具有在其上延伸以容纳匹配连接器的空腔。连接器不包括光学部件。定位在连接器上的虚拟焊接焊盘允许连接器在衬底波导上自动倒装芯片结合。

63. 发明申请

US20050253282A1 Temperature resistant hermetic sealing formed at low temperatures for MEMS packages 审中-公开
标题翻译： MEMS封装在低温下形成耐温密封密封
公开(公告)号：US20050253282A1
公开(公告)日：2005-11-17
申请号：US10833978
申请日：2004-04-27
申请人： Daoqiang Lu , John Heck
发明人： Daoqiang Lu , John Heck
IPC分类号： B81B7/00 , H01L23/10 , H01L21/44
CPC分类号： B81C1/00269
摘要： Certain hermetically sealed devices, such as micro-electromechanical systems (MEMS), may be sensitive high processing temperatures. However, the seal should be able to withstand higher temperatures that may be encountered, for example during device operation. Hermetic sealing may be realized by a fluxless soldering approach that comprises solder combinations that contain a low-melting-point (LMP) component such as Indium (In) or Tin (Sn) and a high-melting-point (HMP) component such as gold (Au), silver (Ag), or copper (Cu). The LMP/HMP ratio is selected to be HMP component rich so that the LMP component is essentially depleted resulting in an intermetallic compound (IMC) that has a higher melting point than the original HMP/LMP processing temperature after bonding and thermal annealing.
摘要翻译：某些密封的装置，例如微机电系统（MEMS），可能是敏感的高处理温度。然而，密封件应该能够承受可能遇到的更高的温度，例如在设备操作期间。密封可以通过无焊剂焊接方法实现，其包括含有低熔点（LMP）组分如铟（In）或锡（Sn）和高熔点（HMP）组分的焊料组合，例如金（Au），银（Ag）或铜（Cu）。选择LMP / HMP比为富含HMP成分，使得LMP组分基本上耗尽，导致在接合和热退火后具有比原始HMP / LMP处理温度更高的熔点的金属间化合物（IMC）。

64. 发明申请

US20050082552A1 Large bumps for optical flip chips 有权
公开(公告)号：US20050082552A1
公开(公告)日：2005-04-21
申请号：US10864188
申请日：2004-06-08
申请人： Ming Fang , Valery Dubin , Daoqiang Lu
发明人： Ming Fang , Valery Dubin , Daoqiang Lu
IPC分类号： G02B6/42 , H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/60 , H01L23/48 , H01L23/485 , H01L23/52 , H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00
CPC分类号： H01L24/16 , G02B6/4204 , G02B6/4232 , H01L24/11 , H01L24/81 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00015 , H01L2224/29099
摘要： The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer.

65. 发明申请

US20130042946A1 SOLDER PASTE COMPOSITION, A SOLDER PASTE AND A SOLDERING FLUX 有权
标题翻译：焊膏组合物，焊膏和焊料
公开(公告)号：US20130042946A1
公开(公告)日：2013-02-21
申请号：US13530751
申请日：2012-06-22
申请人： Huiying Yang , Daoqiang Lu
发明人： Huiying Yang , Daoqiang Lu
IPC分类号： B23K35/363
CPC分类号： B23K35/3601 , B23K35/262 , B23K35/3613 , B23K35/3618 , B23K35/362
摘要： The present invention relates to a solder paste composition, a solder paste and a soldering flux. The soldering flux comprises a resin, a thixotropic agent, an activator, a solvent as well as a long-chain thiol and/or an organic chelating agent.
摘要翻译：本发明涉及一种焊膏组合物，焊膏和焊剂。焊剂包括树脂，触变剂，活化剂，溶剂以及长链硫醇和/或有机螯合剂。

66. 发明申请

US20110294264A1 HEAT SPREADER AS MECHANICAL REINFORCEMENT FOR ULTRA-THIN DIE 有权
标题翻译：热膨胀机作为超薄机械加固
公开(公告)号：US20110294264A1
公开(公告)日：2011-12-01
申请号：US13206390
申请日：2011-08-09
申请人： Daoqiang Lu
发明人： Daoqiang Lu
IPC分类号： H01L21/50
CPC分类号： H01L23/3675 , H01L21/4882 , H01L21/6836 , H01L23/04 , H01L23/36 , H01L23/42 , H01L23/562 , H01L2221/68327 , H01L2221/6834 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2924/01079 , H01L2924/09701 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152
摘要： A technique to fabricate a package. A thin wafer supported by a wafer support substrate (WSS) is formed. The WSS-supported thin wafer layer is diced into a plurality of WSS-supported thin dice. A WSS-supported thin die is bonded to a first heat spreader (HS) to form a HS-reinforced thin die.
摘要翻译：一种制作包装的技术。形成由晶片支撑基板（WSS）支撑的薄晶片。将WSS支撑的薄晶片层切割成多个支持WSS的薄骰子。 WSS支撑的薄模具结合到第一散热器（HS）以形成HS增强的薄模。

67. 发明授权

US07897486B2 Semiconductor wafer coat layers and methods therefor 有权
标题翻译：半导体晶片涂层及其方法
公开(公告)号：US07897486B2
公开(公告)日：2011-03-01
申请号：US11801465
申请日：2007-05-09
申请人： Eric J. Li , Daoqiang Lu , Christopher L. Rumer , Paul A. Koning , Darcy E. Fleming , Gudbjorg H. Oskarsdottir , Tiffany Byrne
发明人： Eric J. Li , Daoqiang Lu , Christopher L. Rumer , Paul A. Koning , Darcy E. Fleming , Gudbjorg H. Oskarsdottir , Tiffany Byrne
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/78 , H01L24/10 , H01L24/13 , H01L24/81 , H01L2221/6834 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1181 , H01L2224/13 , H01L2224/13099 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/014 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.
摘要翻译：公开了用于形成晶片涂层的制剂和方法。在一个实施方案中，在激光划线操作之前，将有机表面保护剂并入沉积到半导体晶片上的晶片涂层制剂中。在去除晶片涂层时，有机表面保护剂保留在凸块上，从而防止芯片准备和芯片之间的凸起的氧化附着。在替代实施例中，将紫外光吸收剂添加到晶片涂层配方中以增强晶片涂层的能量吸收，从而提高激光器烧蚀晶片涂层的能力。在替代实施例中，保形晶片涂层沉积在晶片和模具凸起上，从而减少可能影响激光划线能力的晶片涂层厚度变化。

68. 发明申请

US20100246138A1 METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES 审中-公开
标题翻译：集成电路封装薄膜热绝缘材料的方法，装置和系统
公开(公告)号：US20100246138A1
公开(公告)日：2010-09-30
申请号：US12813277
申请日：2010-06-10
申请人： Wei Shi , Daoqiang Lu , Edward A. Zarbock
发明人： Wei Shi , Daoqiang Lu , Edward A. Zarbock
IPC分类号： H05K7/20
CPC分类号： H01L21/50 , H01L23/3735 , H01L23/3736 , H01L2224/16225 , H01L2224/73253 , Y10T29/49144
摘要： Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed.
摘要翻译：本发明的一些实施例包括散热器和模具之间的热界面。热界面可以包括单一材料的主层或多种材料的组合。热界面可以包括覆盖主层的一个或多个表面的一个或多个附加层。热界面可以在低温下与焊剂和散热器结合，焊剂或无焊剂。描述和要求保护其他实施例。

69. 发明授权

US07723164B2 Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same 有权
标题翻译：双散热器面板组装方法，用于无冲击的芯片附接封装，包含它的封装以及含有它的系统
公开(公告)号：US07723164B2
公开(公告)日：2010-05-25
申请号：US11469581
申请日：2006-09-01
申请人： Daoqiang Lu , Jiangqi He , Xiang Yin Zeng , Jiamiao Tang
发明人： Daoqiang Lu , Jiangqi He , Xiang Yin Zeng , Jiamiao Tang
IPC分类号： H01L21/00
CPC分类号： H01L21/4882 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2224/32245 , H01L2224/73267 , H01L2224/97 , H01L2924/15153 , H01L2924/15165 , H01L2224/83
摘要： A process includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The process includes placing a first die in a first die recess of the first heat spreader, and placing a second die in a second die recess in the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. Thereafter, the process includes separating the first heat spreader and the second heat spreader. A package is achieved by the process, with reduced thicknesses. The package can be disposed onto a mounting substrate. The package can be assembled into a computing system.
摘要翻译：一种方法包括：配合第一散热器和第二散热器，使得匹配表面处的第一散热器和配合表面处的第二散热器变得平行和相邻。该方法包括将第一模具放置在第一散热器的第一模具凹部中，以及将第二模具放置在第二散热器中的第二模具凹部中。该方法包括在每个模具和相应的散热器之间回流热界面材料。此后，该方法包括分离第一散热器和第二散热器。通过该方法实现了包装，减小了厚度。该封装可以设置在安装基板上。该包装可以组装成一个计算系统。

70. 发明授权

US07666714B2 Assembly of thin die coreless package 有权
标题翻译：组装薄芯无芯封装
公开(公告)号：US07666714B2
公开(公告)日：2010-02-23
申请号：US11648120
申请日：2006-12-29
申请人： Daoqiang Lu , Rajashree Baskaran , Charan Gurumurthy
发明人： Daoqiang Lu , Rajashree Baskaran , Charan Gurumurthy
IPC分类号： H01L21/58
CPC分类号： H01L21/563 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L24/81 , H01L24/97 , H01L2221/68354 , H01L2221/68359 , H01L2224/73203 , H01L2224/73253 , H01L2224/81001 , H01L2224/8121 , H01L2224/81815 , H01L2224/8191 , H01L2224/97 , H01L2924/014 , H01L2924/14 , H01L2924/16152 , H01L2224/81
摘要： In one embodiment, a method comprises coupling a coreless substrate panel to a pressure cover plate of a carrier, applying flux to the coreless substrate panel, placing at least one die on the coreless substrate panel, reflowing solder onto the coreless substrate panel, defluxing the coreless substrate panel, underfilling the coreless substrate panel, and attaching at least one heat spreader to the coreless substrate panel.
摘要翻译：在一个实施例中，一种方法包括将无芯衬底面板耦合到载体的压力盖板，将助焊剂施加到无芯衬底面板，将至少一个管芯放置在无芯衬底面板上，将焊料回流到无芯衬底面板上，无芯基板，底部填充无芯基板，并将至少一个散热器附接到无芯基板。

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