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61. 发明授权

US08545599B2 Electrohydrodynamic device components employing solid solutions 失效
标题翻译：使用固溶体的电动液压装置部件
公开(公告)号：US08545599B2
公开(公告)日：2013-10-01
申请号：US12914786
申请日：2010-10-28
申请人： Giles Humpston
发明人： Giles Humpston
IPC分类号： B03C3/40
CPC分类号： G03G21/206 , B03C3/06 , B03C3/60 , B03C2201/14 , C23C10/28 , C23C14/16 , C23C14/5806 , C25D7/00
摘要： A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.
摘要翻译：热管理装置包括电动液体加速器，其中发射电极和另一电极通电以激励流体流动。电极之一包括由具有第一性能特性的溶剂金属和具有第二性能特性的溶质材料形成的固溶体。第一和第二性能特征在电极中基本独立地表现，因为溶剂金属和溶质材料在固溶体中保持基本上纯的。制造EHD产品的方法包括向电极提供这样的固溶体，并且相对于另一电极定位电极以在通电时激励流体流动。

62. 发明授权

US07858445B2 Wire bonded wafer level cavity package 有权
标题翻译：接线晶圆级腔体封装
公开(公告)号：US07858445B2
公开(公告)日：2010-12-28
申请号：US12283710
申请日：2008-09-15
申请人： Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
发明人： Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
IPC分类号： H01L21/50
CPC分类号： B81B7/0006 , B81C1/00269 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.
摘要翻译：微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。该装置还包括盖在前表面上的盖。盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

63. 发明授权

US07569424B2 Method of forming a wall structure in a microelectronic assembly 有权
标题翻译：在微电子组件中形成壁结构的方法
公开(公告)号：US07569424B2
公开(公告)日：2009-08-04
申请号：US11600289
申请日：2006-11-15
申请人： Michael J. Nystrom , Christopher Paul Wade , Giles Humpston
发明人： Michael J. Nystrom , Christopher Paul Wade , Giles Humpston
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L27/14618 , B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a wall structure in a microelectronic assembly includes selectively depositing a flowable material on an upper surface of a first element in the microelectronic assembly, positioning a molding surface in contact with the deposited flowable material and controlling a distance between the upper surface of the first element and the molding surface with one or more objects positioned between the upper surface and the molding surface.
摘要翻译：在微电子组件中形成壁结构的方法包括在微电子组件中的第一元件的上表面上选择性地沉积可流动材料，将模制表面定位成与沉积的可流动材料接触并且控制上表面之间的距离第一元件和模制表面，其中一个或多个物体位于上表面和模制表面之间。

64. 发明授权

US07443597B2 Liquid lens with piezoelectric voltage converter 有权
标题翻译：液晶透镜带压电变压器
公开(公告)号：US07443597B2
公开(公告)日：2008-10-28
申请号：US11318821
申请日：2005-12-27
申请人： Giles Humpston
发明人： Giles Humpston
IPC分类号： G02B1/06
CPC分类号： G02B3/14 , G02B26/005 , H04N5/2254 , H04N5/2257
摘要： An electronic camera module includes a lens or refractive element formed by a pair of immiscible liquids and having optical properties which can be varied by applying a voltage so as to deform the meniscus. One of the two liquids extends from the meniscus all the way to the front surface of the sensor, so that light passing through the meniscus does not encounter further changes in refractive index enroute to the sensor.
摘要翻译：电子照相机模块包括由一对不混溶液体形成的具有光学特性的透镜或折射元件，该特性可以通过施加电压以使弯液面变形来改变。两个液体中的一个液体从弯液面一直延伸到传感器的前表面，使得穿过弯月面的光不会遇到传感器的折射率的进一步变化。

65. 发明申请

US20060220234A1 Wire bonded wafer level cavity package 有权
公开(公告)号：US20060220234A1
公开(公告)日：2006-10-05
申请号：US11322617
申请日：2005-12-30
申请人： Kenneth Honer , Giles Humpston , David Tuckerman , Michael Nystrom
发明人： Kenneth Honer , Giles Humpston , David Tuckerman , Michael Nystrom
IPC分类号： H01L23/34
CPC分类号： B81B7/0006 , B81C1/00269 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

66. 发明申请

US20060138626A1 Microelectronic packages using a ceramic substrate having a window and a conductive surface region 审中-公开
标题翻译：使用具有窗口和导电表面区域的陶瓷基板的微电子封装
公开(公告)号：US20060138626A1
公开(公告)日：2006-06-29
申请号：US11025432
申请日：2004-12-29
申请人： Victor Liew , Giles Humpston
发明人： Victor Liew , Giles Humpston
IPC分类号： H01L23/06
CPC分类号： H01L23/49822 , H01L23/13 , H01L23/49816 , H01L23/5389 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/14 , H01L2924/15311 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic device, a unitary ceramic substrate, and a plurality of terminals. The microelectronic device has a front surface and a plurality of electrical contacts thereon. The substrate has first and second opposing surfaces. A window extends from a first opening on the first surface along a side wall to a second opening on the second surface. A conductive region may be provided on the side wall and/or the second substrate surface. The substrate is located between the device and the terminals such that the first surface of the substrate faces the front surface of the device and the first opening is aligned with at least one contact on the front device surface. Also provided are methods for producing microelectronic packages and wafer-scale assemblies.
摘要翻译：微电子封装包括微电子器件，单一陶瓷衬底和多个端子。微电子器件在其上具有前表面和多个电触点。衬底具有第一和第二相对表面。窗口从第一表面上的第一开口沿侧壁延伸到第二表面上的第二开口。可以在侧壁和/或第二基板表面上设置导电区域。衬底位于器件和端子之间，使得衬底的第一表面面向器件的前表面，并且第一开口与前器件表面上的至少一个触点对准。还提供了用于生产微电子封装和晶片级组件的方法。

67. 发明申请

US20060108402A1 Solder ball formation and transfer method 审中-公开
标题翻译：焊球形成和转移方法
公开(公告)号：US20060108402A1
公开(公告)日：2006-05-25
申请号：US10993962
申请日：2004-11-19
申请人： Richard Crisp , Giles Humpston
发明人： Richard Crisp , Giles Humpston
IPC分类号： B23K31/02
CPC分类号： H01L21/6835 , B23K3/0623 , B23K2101/40 , H01L21/4853 , H05K3/3484 , H05K2203/0338 , H05K2203/043
摘要： A method of forming and applying a solder mass comprised of depositing solder paste containing a carrier and a solder onto a first substrate, not wettable by said solder; reflowing the solder paste on the first substrate to cause the solder to coalesce into a solder mass; and transferring the solder mass from the first substrate to a second substrate.
摘要翻译：一种形成和施加焊料块的方法，所述焊料质量包括将包含载体和焊料的焊膏沉积到第一衬底上，所述焊料不能被所述焊料润湿; 在第一基板上回流焊膏以使焊料聚结成焊料; 以及将所述焊料块从所述第一基板转移到第二基板。

68. 发明申请

US20050248680A1 Compact lens turret assembly 有权
标题翻译：紧凑型镜头转塔组件
公开(公告)号：US20050248680A1
公开(公告)日：2005-11-10
申请号：US11121434
申请日：2005-05-04
申请人： Giles Humpston
发明人： Giles Humpston
IPC分类号： G02B7/02 , H01L27/146 , H01L31/0203 , H01L31/0232 , H04N5/225
CPC分类号： H04N5/2254 , G02B7/02 , H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L2924/0002 , H04N5/2253 , H01L2924/00
摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.
摘要翻译：电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。光学单元（50）包括一个或多个光学元件，例如透镜（58）。光学单元具有接合特征（64），其接合传感器单元上的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。

69. 发明申请

US20050227410A1 Manufacture of microelectronic fold packages 有权
标题翻译：微电子折叠包装的制造
公开(公告)号：US20050227410A1
公开(公告)日：2005-10-13
申请号：US10950241
申请日：2004-09-27
申请人： Nicholas Colella , Giles Humpston
发明人： Nicholas Colella , Giles Humpston
IPC分类号： H01L21/60 , B65B9/06 , B65B15/04 , H01L21/00 , H01L21/44 , H01L23/498
CPC分类号： B65B49/04 , B65B9/06 , B65B15/04 , H01L23/4985 , H01L24/86 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/3025 , H01L2924/00
摘要： An elongated strip of a sheetlike substrate bearing microelectronic elements such as semiconductor chips is advanced in a downstream direction through one or more folding stations where successive portions of the substrate are folded so as to form a strip including a plurality of fold packages, each including confronting top and bottom runs and a fold region with one or more of the runs bearing one or more microelectronic elements. The strip incorporating the plural fold packages can be wound on a reel or otherwise handled, stored and shipped to a subsequent manufacturing operation, where individual fold packages can be severed from the strip.
摘要翻译：带有诸如半导体芯片的微电子元件的片状基片的细长带沿下游方向前进通过一个或多个折叠站，其中基底的连续部分被折叠以形成包括多个折叠包装的条带，每个折叠包装件包括面对顶部和底部运行以及具有一个或多个承载一个或多个微电子元件的运行的折叠区域。包含多个折叠包装的条带可以卷绕在卷轴上或以其他方式处理，存储和运输到随后的制造操作，其中可以从带切断各个折叠包装。

70. 发明授权

US06493231B2 Electrical apparatus 失效
标题翻译：电气设备
公开(公告)号：US06493231B2
公开(公告)日：2002-12-10
申请号：US09308684
申请日：1999-07-29
申请人： Brian Frederick Nicholson , David Michael Jacobson , Surinder Pal Singh Sangha , Giles Humpston , James Hugh Vincent , William Martin Lovell
发明人： Brian Frederick Nicholson , David Michael Jacobson , Surinder Pal Singh Sangha , Giles Humpston , James Hugh Vincent , William Martin Lovell
IPC分类号： H05K900
CPC分类号： H01L23/057 , H01L23/06 , H01L23/66 , H01L2924/0002 , H05K9/0022 , Y10T403/4602 , H01L2924/00
摘要： A housing for a microwave circuit is formed from a base made of metal matrix composite material and walls made of sheet metal. The base and the walls are joined together by diffusion soldering. Some holes to receive feedthroughs are formed at the junction of the base and a wall.
摘要翻译：用于微波电路的壳体由金属基复合材料制成的基底和由金属片制成的壁形成。底座和墙壁通过扩散焊接连接在一起。在基座和墙壁的接合处形成一些用于接收馈通孔的孔。

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