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    • 61. 发明授权
    • IC package processing and measuring method and system therefor
    • IC封装加工及测量方法及系统
    • US5920481A
    • 1999-07-06
    • US952259
    • 1997-11-12
    • Masashi IchiharaYoshinori SaitoMasato SuwaYukihiro TsudaHitoshi Kitamura
    • Masashi IchiharaYoshinori SaitoMasato SuwaYukihiro TsudaHitoshi Kitamura
    • H01L21/677H01L21/00H01L21/02H01L21/68H01L23/00H01L23/544H05K13/04H05K13/08G06F19/00
    • H01L21/67294H01L22/34H01L23/544H05K13/0478H05K13/08H01L2223/54473H01L2924/0002
    • An IC package processing and measuring system comprises: a processing and measuring device that executes processing or measurement on a prescribed number of IC packages juxtaposed in a prescribed area; a feed device that feeds IC packages into the prescribed area, a prescribed number at a time, by feeding with a prescribed feed pitch an IC package support on which are loaded a plurality of juxtaposed IC packages; and a control device that controls the processing and measuring device and feed device. The control device comprises position calculating means that uses shape data of the IC package and IC package support to calculate target positions of processing and measurement of the IC packages in the prescribed area and outputs the calculated position data to the processing and measuring device. The processing and measuring device comprises processing and measuring means that uses the target position data that were input from the position calculating means to execute processing or measurement on the IC packages that were fed into the prescribed area. Thus improvement of the operability and shortening of the operating time are attained.
    • PCT No.PCT / JP96 / 01279 Sec。 371日期:1997年11月12日 102(e)日期1997年11月12日PCT提交1996年5月15日PCT公布。 公开号WO96 / 36456 日期1996年11月21日IC封装处理和测量系统包括:处理和测量装置,其在规定区域中并列规定数量的IC封装件执行处理或测量; 馈送装置,通过馈送规定的馈送距离将IC封装馈送到规定的区域,一个规定的数量,一个IC封装支架,其上装有多个并置的IC封装; 以及控制装置和控制装置。 控制装置包括使用IC封装和IC封装支架的形状数据的位置计算装置,以计算处理和在规定区域中的IC封装的测量的目标位置,并将计算的位置数据输出到处理和测量装置。 处理和测量装置包括处理和测量装置,其使用从位置计算装置输入的目标位置数据对进入规定区域的IC封装进行处理或测量。 从而可以实现操作性的提高和操作时间的缩短。
    • 64. 发明授权
    • Process for preparing carbonyl compounds
    • 制备羰基化合物的方法
    • US5414137A
    • 1995-05-09
    • US67803
    • 1993-05-27
    • Hirotoshi IshiiMasanori TsuzukiYoshinori Saito
    • Hirotoshi IshiiMasanori TsuzukiYoshinori Saito
    • C07C45/34
    • C07C45/34
    • An improved process for preparing carbonyl compounds by oxidizing olefins is disclosed. The process comprises oxidizing an olefin with oxygen or an oxygen containing gas in the presence of a palladium compound or metallic palladium, a polyoxoanion compound and an organic phosphorus compound in a solvent selected from oxygen-containing organic compounds, sulfur-containing organic compounds and nitrogen-containing organic compounds. In this process, precipitating of the palladium component is prevented and the high, reaction rate is well maintained through the prolonged reaction period and thus carbonyl compounds can be produced with high efficiency and productivity.
    • 公开了通过氧化烯烃制备羰基化合物的改进方法。 该方法包括在钯化合物或金属钯,多氧阴离子化合物和有机磷化合物存在下,在选自含氧有机化合物,含硫有机化合物和氮气的溶剂中,用氧气或含氧气体氧化烯烃 含有机化合物。 在该方法中,通过延长的反应时间,可以防止钯成分的沉淀,高的反应速度得到很好的保持,因此可以高效率和高生产率生产羰基化合物。